Abstract: A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided.

Abstract: A luminaire with a removable rail is disclosed. The luminaire can be powered with power provided by a power over Ethernet (PoE) solution. The rail can include a sensor that can provide feedback to the luminaire. The sensor can detect ambient information. A controller can modify output of the luminaire based on sensed information.

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Abstract: A luminaire with a removable rail is disclosed. The luminaire can be powered with power provided by a power over Ethernet (PoE) solution. The rail can include a sensor that can provide feedback to the luminaire. The sensor can detect ambient information. A controller can modify output of the luminaire based on sensed information.

Abstract: In an embodiment, a smart connector includes an Application Specific Electronics Packaging (ASEP) device formed by an ASEP manufacturing process, and a separate printed circuit board electrically connected to electrical components of the ASEP device. The ASEP manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of ASEP devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.

Abstract: In an embodiment, a luminaire includes a housing with a reflector. A rail is positioned near the reflector and has a light thereon which is configured to emit light into the reflector. The light is reflected from the reflector and passes through a diffuser that can act to ensure the emitted light is desirably defuse. In an embodiment, the diffuser can be removed from the housing for service or replacement.

Abstract: A micro power distribution box is provided which includes a device, a connector/housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate is overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin.

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Abstract: An electrical connector assembly provides a hinge between two parts, such as an eye-piece part and an arm-piece part of augmented eyewear. The assembly includes first and second hermaphroditic connectors which are rotatable relative to each other. Each connector includes a conductive electrical terminal disposed on a non-conductive support. Each electrical terminal includes a main body and a flexible contact arm extending therefrom, and a contacting protrusion protruding from the contact arm. The contact arm can be flexed into a slot in the support. The contacting protrusion on each arm maintains engagement with the main body of the other connector during rotation.

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Abstract: In an embodiment, a luminaire includes a housing with a reflector. A rail is positioned near the reflector and has a light thereon which is configured to emit light into the reflector. The light is reflected from the reflector and passes through a diffuser that can act to ensure the emitted light is desirably defuse. In an embodiment, the diffuser can be removed from the housing for service or replacement.

Abstract: An electrical connector assembly provides a hinge between two parts, such as an eye-piece part and an arm-piece part of augmented eyewear. The assembly includes first and second hermaphroditic connectors which are rotatable relative to each other. Each connector includes a conductive electrical terminal disposed on a non-conductive support. Each electrical terminal includes a main body and a flexible contact arm extending therefrom, and a contacting protrusion protruding from the contact arm. The contact arm can be flexed into a slot in the support. The contacting protrusion on each arm maintains engagement with the main body of the other connector during rotation.

Abstract: A micro power distribution box is provided which includes a device, a connector/housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate is overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin.

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Abstract: A luminaire with a removable rail is disclosed. The luminaire can be powered with power provided by a power over Ethernet (POE) solution.

Abstract: A light emitting diode (LED) fixture is provided. The fixture includes a housing that supports an LED array. A power supply can be coupled to the housing via a connector. A controller with a constant current driver can be configured to actuate the LED array. In an embodiment the controller can be configured to control operation of the LED array based on a sensed signal.

Abstract: An assembly is provided that includes a semiconductor device positioned on a frame and connected to electroplated traces via wire bonding. A connector can be integrated into the frame. Terminals can be molded into the frame. Traces can be connected to the terminals so as to provide a three-dimensional circuit.