Patents by Inventor Vijay D. Parkhe

Vijay D. Parkhe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TUBULAR ELECTROSTATIC DEVICE
    Publication number: 20190078204
    Abstract: Embodiments described herein generally pertain to an electrostatic device for use in a process system. Process gas may flow through an aperture formed in a tubular body of a filter. Electrodes disposed within the tubular body create an electric field. The field generated by the electrodes may be utilized to trap contaminate particles flowing through the aperture before entering the processing chamber.
    Type: Application
    Filed: September 12, 2017
    Publication date: March 14, 2019
    Inventors: Vijay D. PARKHE, David THOMPSON
  • ELECTROSTATIC SHIELD FOR SUBSTRATE SUPPORT
    Publication number: 20190043698
    Abstract: Embodiments of the disclosure relate to a shield used within a plasma processing chamber. In one embodiment, a kit for shielding a substrate support is disclosed. The kit includes a plate having a central aperture and a hollow shell assembly configured to be coupled to the plate around the central aperture. The hollow shell assembly includes a plurality of shell portions removably coupled together. In another embodiment, a shielded substrate support includes a pedestal body having one or more heating elements, a hollow stem coupled to the pedestal body, a heater support coupled to the stem and a shield assembly coupled to the heater support. The shield assembly includes a plate having a central aperture and a hollow shell assembly configured to be coupled to the plate around the central aperture. The hollow shell assembly includes a plurality of shell portions removably coupled together.
    Type: Application
    Filed: August 3, 2018
    Publication date: February 7, 2019
    Inventor: Vijay D. PARKHE
  • Protective cover for electrostatic chuck
    Patent number: 10177023
    Abstract: In embodiments, manufacturing a protective cover for an electrostatic chuck comprises coating a top surface and side walls of a conductive wafer with a plasma resistant ceramic, masking an inner region of a bottom surface of the conductive wafer, coating inner region of the bottom surface with the plasma resistant ceramic, and grinding the inner region of the bottom surface to a flatness of less than approximately 300 microns. In embodiments, a protective cover is manufactured by a process comprising applying a mask to an outer perimeter of a bottom surface of a plasma resistant ceramic wafer, coating the bottom surface of the plasma resistant ceramic wafer with an electrically conductive layer, and removing the mask, wherein an inner region of the bottom surface of the plasma resistant ceramic wafer is coated with the conductive layer.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: January 8, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Vijay D. Parkhe
  • REAL TIME MONITORING WITH CLOSED LOOP CHUCKING FORCE CONTROL
    Publication number: 20180330926
    Abstract: Embodiments disclosed herein include a method for minimizing chucking forces on a workpiece disposed on a electrostatic chuck within a plasma processing chamber. The method begins by placing a workpiece on an electrostatic chuck in a processing chamber. A plasma is struck within the processing chamber. A deflection force is monitored on the workpiece. A chucking voltage is applied at a minimum value. A backside gas pressure is applied at a minimum pressure. The chucking voltage and or backside gas pressure is adjusted such that the deflection force is less than a threshold value. And the chucking voltage and the backside gas pressure are simultaneously ramped up.
    Type: Application
    Filed: May 15, 2018
    Publication date: November 15, 2018
    Inventors: Wendell Glenn BOYD, JR., Vijay D. PARKHE, Matthew James BUSCHE, Konstantin MAKHRATCHEV, Masanori ONO, Senh THACH
  • ELECTROSTATIC CHUCK OPTIMIZED FOR REFURBISHMENT
    Publication number: 20180319205
    Abstract: An electrostatic chuck includes a metal base plate, an electrostatic puck bonded to the metal base plate, and surface features on the surface of the electrostatic puck. The electrostatic puck includes an electrode embedded in the electrostatic puck. A surface of the electrostatic puck has a flatness of below 10 microns. The surface features include mesas and a sealing band around a perimeter of the electrostatic puck. The surface features have an average surface roughness of approximately 2-6 micro-inches. The corners of the surface features are not rounded.
    Type: Application
    Filed: July 16, 2018
    Publication date: November 8, 2018
    Inventors: Vijay D. Parkhe, Kadthala Ramaya Narendrnath
  • Electrostatic chuck with external flow adjustments for improved temperature distribution
    Patent number: 10121688
    Abstract: An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, a method for adjusting coolant flow in an electrostatic chuck includes heating a dielectric puck, the dielectric puck being for electrostatically gripping a silicon wafer. Heat is detected at a plurality of locations on a top surface of the dielectric puck, the locations each being thermally coupled to at least one of a plurality of coolant chambers of the electrostatic chuck. A plurality of valves are adjusted to control coolant flow into the coolant chambers based on the detected heat.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: November 6, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Matthew J. Busche, Vijay D. Parkhe, Wendell Boyd, Jr., Senh Thach, Konstantin Makhratchev, Masanori Ono
  • SUBSTRATE SUPPORT ASSEMBLY WITH DEPOSITED SURFACE FEATURES
    Publication number: 20180301364
    Abstract: An electrostatic chuck comprises a ceramic body comprising an embedded electrode and a first ceramic coating on a surface of the ceramic body, wherein the first ceramic coating fills pores in the ceramic body. The electrostatic chuck further comprises a second ceramic coating on the first ceramic coating and a plurality of elliptical mesas on the second ceramic coating, the plurality of elliptical mesas having rounded edges.
    Type: Application
    Filed: June 13, 2018
    Publication date: October 18, 2018
    Inventors: Wendell Glenn Boyd, JR., Vijay D. Parkhe, Teng-Fang Kuo, Zhenwen Ding
  • ELECTROSTATIC CHUCK HAVING THERMALLY ISOLATED ZONES WITH MINIMAL CROSSTALK
    Publication number: 20180269098
    Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic puck. Trenches are formed in the thermally conductive base approximately concentric around a center of the thermally conductive base. The trenches extend from the upper surface towards a lower surface of the thermally conductive base without contacting the lower surface of the thermally conductive base. The thermally conductive base includes thermal zones. The substrate support assembly further includes a thermally insulating material disposed in the trenches. The thermally insulating material in a trench of the trenches provides a degree of thermal isolation between two of the thermal zones separated by the trench at the upper surface of the thermally conductive base.
    Type: Application
    Filed: May 11, 2018
    Publication date: September 20, 2018
    Inventors: Vijay D. Parkhe, Konstantin Makhratchev, Jason Della Rosa, Hamid Noorbakhsh, Brad L. Mays, Douglas A. Buchberger, JR.
  • Cooling pedestal with coating of diamond-like carbon
    Patent number: 10053778
    Abstract: A cooling pedestal for supporting a substrate, comprises a support structure having cooling conduits to flow a fluid therethrough to cool the substrate, and a contact surface comprising a coating of a diamond-like carbon. The coating comprises (i) a coefficient of friction of less than about 0.3, (ii) an average surface roughness of less than about 0.4 micrometers, and (iii) a microhardness of at least about 8 GPa.
    Type: Grant
    Filed: July 21, 2014
    Date of Patent: August 21, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Vijay D. Parkhe, Kurt J Ahmann, Matthew C Tsai, Steve Sansoni
  • Electrostatic chuck optimized for refurbishment
    Patent number: 10056284
    Abstract: A method of manufacturing an electrostatic chuck includes bonding an electrostatic puck to a metal base plate, wherein the electrostatic puck has an electrode embedded in the electrostatic puck. The method further includes subsequently polishing a surface of the electrostatic puck to a flatness of below 10 microns and an average surface roughness of approximately 2-6 micro-inches. The method further includes subsequently forming surface features on a surface of the electrostatic puck, the surface features comprising mesas and a sealing band around a perimeter of the electrostatic puck.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: August 21, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Vijay D. Parkhe, Kadthala Ramaya Narendrnath
  • ELECTROSTATIC PUCK ASSEMBLY WITH METAL BONDED BACKING PLATE FOR HIGH TEMPERATURE PROCESSES
    Publication number: 20180197758
    Abstract: An electrostatic puck assembly includes an upper puck plate, a lower puck plate and a backing plate. The upper puck plate comprises AlN or Al2O3 and has a first coefficient of thermal expansion. The lower puck plate comprises a material having a second coefficient of thermal expansion that approximately matches the first coefficient of thermal expansion and is bonded to the upper puck plate by a first metal bond. The backing plate comprises AlN or Al2O3 and is bonded to the lower puck plate by a second metal bond.
    Type: Application
    Filed: March 8, 2018
    Publication date: July 12, 2018
    Inventor: Vijay D. Parkhe
  • Substrate support assembly with deposited surface features
    Patent number: 10020218
    Abstract: A method of manufacturing an electrostatic chuck includes polishing a surface of a ceramic body of the electrostatic chuck to produce a polished surface and depositing a ceramic coating onto the polished surface of the ceramic body to produce a coated ceramic body. The method further includes disposing a mask over the coated ceramic coating, the mask comprising a plurality of elliptical holes and depositing a ceramic material through the plurality of elliptical holes of the mask to form a plurality of elliptical mesas on the coated ceramic body, wherein the plurality of elliptical mesas have rounded edges. The mask is then removed from the coated ceramic body and the plurality of elliptical mesas are polished.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: July 10, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Wendell Glenn Boyd, Jr., Vijay D. Parkhe, Teng-Fang Kuo, Zhenwen Ding
  • ELECTROSTATIC CHUCK ASSEMBLY FOR HIGH TEMPERATURE PROCESSES
    Publication number: 20180190528
    Abstract: An electrostatic chuck assembly includes a puck and a cooling plate. The puck includes an electrically insulative upper puck plate comprising one or more heating elements and one or more electrodes to electrostatically secure a substrate and further includes a lower puck plate bonded to the upper puck plate by a metal bond, the lower puck plate comprising a plurality of features distributed over a bottom side of the lower puck plate at a plurality of different distances from a center of the lower puck plate, wherein each of the plurality of features accommodates one of a plurality of fasteners. The cooling plate is coupled to the puck by the plurality of fasteners, wherein the plurality of fasteners each apply an approximately equal fastening force to couple the cooling plate to the puck.
    Type: Application
    Filed: February 28, 2018
    Publication date: July 5, 2018
    Inventor: Vijay D. Parkhe
  • Electrostatic chuck assembly for high temperature processes
    Patent number: 10008404
    Abstract: An electrostatic chuck assembly includes a puck and a cooling plate. The puck includes an electrically insulative upper puck plate comprising one or more heating elements and one or more electrodes to electrostatically secure a substrate and further includes a lower puck plate bonded to the upper puck plate by a metal bond, the lower puck plate comprising a plurality of features distributed over a bottom side of the lower puck plate at a plurality of different distances from a center of the lower puck plate, wherein each of the plurality of features accommodates one of a plurality of fasteners. The cooling plate is coupled to the puck by the plurality of fasteners, wherein the plurality of fasteners each apply an approximately equal fastening force to couple the cooling plate to the puck.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: June 26, 2018
    Assignee: Applied Materials, Inc.
    Inventor: Vijay D. Parkhe
  • Electrostatic puck assembly with metal bonded backing plate for high temperature processes
    Patent number: 10008399
    Abstract: An electrostatic puck assembly includes an upper puck plate, a lower puck plate and a backing plate. The upper puck plate comprises AlN or Al2O3 and has a first coefficient of thermal expansion. The lower puck plate comprises a material having a second coefficient of thermal expansion that approximately matches the first coefficient of thermal expansion and is bonded to the upper puck plate by a first metal bond. The backing plate comprises AlN or Al2O3 and is bonded to the lower puck plate by a second metal bond.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: June 26, 2018
    Assignee: Applied Materials, Inc.
    Inventor: Vijay D. Parkhe
  • Electrostatic chuck having thermally isolated zones with minimal crosstalk
    Patent number: 9991148
    Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base, wherein each of the plurality of thermal isolators provides approximate thermal isolation between two of the plurality of thermal zones at the upper surface of the thermally conductive base.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: June 5, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Vijay D. Parkhe, Konstantin Makhratchev, Jason Della Rosa, Hamid Noorbakhsh, Brad L. Mays, Douglas A. Buchberger, Jr.
  • Temperature control apparatus including groove-routed optical fiber heating, substrate temperature control systems, electronic device processing systems, and processing methods
    Patent number: 9986598
    Abstract: Substrate temperature control apparatus including groove-routed optical fibers. Substrate temperature control apparatus includes upper and lower members including grooves in one or both, and a plurality of optical fibers routed in the grooves. In one embodiment, the optical fibers are adapted to provide light-based pixelated heating. In another embodiment, embedded optical temperature sensors are adapted to provide temperature measurement. Substrate temperature control systems, electronic device processing systems, and methods including groove-routed optical fiber temperature control and measurement are described, as are numerous other aspects.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: May 29, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Matthew Busche, Wendell Boyd, Jr., Dmitry A. Dzilno, Vijay D. Parkhe, Michael R. Rice, Leon Volfovski
  • Electrostatic chuck design for high temperature RF applications
    Patent number: 9984911
    Abstract: An electrostatic chuck includes a puck having a support surface to support a substrate when disposed thereon and an opposing second surface, wherein one or more chucking electrodes are embedded in the puck, a body having a support surface coupled to the second surface of the puck to support the puck, a DC voltage sensing circuit disposed on support surface of the puck, and an inductor disposed in the body and proximate the support surface of the body, wherein the inductor is electrically coupled to DC voltage sensing circuit, and wherein the inductor is configured to filter high frequency current flow in order to accurately measure DC potential on the substrate.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: May 29, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ryan Hanson, Manjunatha Koppa, Vijay D. Parkhe, John C. Forster, Keith A. Miller
  • Vacuum process chamber component and methods of making
    Patent number: 9969022
    Abstract: A vacuum process chamber component comprising two separate pieces with an o-ring between the pieces and solder bonded together is described. The component may be an electrostatic chuck comprising a ceramic electrostatic puck and a metal baseplate with at least one o-ring therebetween and joined by a solder bond is described. Methods of making and using vacuum process chamber component are also described.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: May 15, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Vijay D. Parkhe
  • PROTECTIVE COVER FOR ELECTROSTATIC CHUCK
    Publication number: 20180108562
    Abstract: In embodiments, manufacturing a protective cover for an electrostatic chuck comprises coating a top surface and side walls of a conductive wafer with a plasma resistant ceramic, masking an inner region of a bottom surface of the conductive wafer, coating inner region of the bottom surface with the plasma resistant ceramic, and grinding the inner region of the bottom surface to a flatness of less than approximately 300 microns. In embodiments, a protective cover is manufactured by a process comprising applying a mask to an outer perimeter of a bottom surface of a plasma resistant ceramic wafer, coating the bottom surface of the plasma resistant ceramic wafer with an electrically conductive layer, and removing the mask, wherein an inner region of the bottom surface of the plasma resistant ceramic wafer is coated with the conductive layer.
    Type: Application
    Filed: December 13, 2017
    Publication date: April 19, 2018
    Inventor: Vijay D. Parkhe