Abstract: A process for forming a single crystal layer of one material type such as III-V semiconductor) onto a substrate of a different material type such as silicon. A substrate of a first material type is provided. At least one discrete region of catalyst material is deposited onto the substrate, the discrete region defining a seed area of the substrate. A second material type such as III-V semiconductor is grown as a single crystal nanowire onto the substrate between the substrate and catalyst material, the nanowire of second material type extending upward from the substrate with lateral dimensions not substantially exceeding the seed area. After growth of the nanowire, growth conditions are changed so as to epitaxially grow the second material type laterally from the single crystal nanowire in a direction parallel to the substrate surface.

Abstract: An electrode for an ionization chamber and an ionization chamber including an electrode are provided wherein the electrode comprises a substrate comprising a first material, and a plurality of nanowires extending from the substrate and manufactured by processing the first material of the substrate.

Abstract: A method of manufacturing a semiconductor device is disclosed comprising providing an insulating carrier (10) such as an oxide wafer; providing a channel structure (20) between a source structure (12) and a drain structure (14) on said carrier (10); selectively removing a part of the channel structure (20), thereby forming a recess (22) between the channel structure (20) and the carrier (10); exposing the device to an annealing step such that the channel structure (20?) obtains a substantially cylindrical shape; forming a confinement layer (40) surrounding the substantially cylindrical channel structure (20?); growing an oxide layer (50) surrounding the confinement layer (40); and forming a gate structure (60) surrounding the oxide layer (50). The substantially cylindrical channel structure 20? may comprise the semiconductor layer 30. A corresponding semiconductor device is also disclosed.

Abstract: A process for forming a single crystal layer of one material type such as III-V semiconductor) onto a substrate of a different material type such as silicon. A substrate of a first material type is provided. At least one discrete region of catalyst material is deposited onto the substrate, the discrete region defining a seed area of the substrate. A second material type such as III-V semiconductor is grown as a single crystal nanowire onto the substrate between the substrate and catalyst material, the nanowire of second material type extending upward from the substrate with lateral dimensions not substantially exceeding the seed area. After growth of the nanowire, growth conditions are changed so as to epitaxially grow the second material type laterally from the single crystal nanowire in a direction parallel to the substrate surface.

Abstract: An electrode for an ionization chamber and an ionization chamber including an electrode are provided wherein the electrode comprises a substrate comprising a first material, and a plurality of nanowires extending from the substrate and manufactured by processing the first material of the substrate.

Abstract: The invention relates to a method of manufacturing a semiconductor device (10) with a semiconductor body (1) which is provided with at least one semiconductor element, wherein on the surface of the semiconductor body (1) a mesa-shaped semiconductor region (2) is formed, a masking layer (3) is deposited over the mesa-shaped semiconductor region (2), a part (3A) of the masking layer (3) is removed that borders a side surface of the mesa-shaped semiconductor region (2) near its top and an electrically conducting connection region (4) is formed on the resulting structure forming a contact for the mesa-shaped semiconductor region (2). According to the invention after removal of said part (3A) of the masking layer (3) but before formation of the electrically conducting connection region (4) the mesa-shaped semiconductor region (2) is widened by an additional semiconductor region (5) at the side surface of the mesa-shaped semiconductor region (2) freed by removal of said part (3A) of the masking layer (3).

Abstract: The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semiconductor body (12) which is provided with at least one semiconductor element (E), wherein on the surface of the semiconductor body (12) a mesa-shaped semiconductor region (1) is formed, an insulating layer (2) is deposited over the mesa-shaped semiconductor region (1) having a smaller thickness on top of the mesa-shaped semiconductor region (1) than in a region (3) bordering the mesa-shaped semiconductor region (1), subsequently a part of the insulating layer (2) on top of the mesa-shaped semiconductor region (1) is removed freeing the upper side of the mesa-shaped semiconductor region (1), and subsequently a conducting layer (4) contacting the mesa-shaped semiconducting region (1) is deposited over the resulting structure. According to the invention the insulating layer (2) is deposited using a high-density plasma deposition process.

Abstract: The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semi-conductor body (12) which is provided with at least one semiconductor element (E) and comprising a monocrystalline silicon (1) region on top of which an epitaxial silicon region (2) is formed by providing a metal silicide region (3) on the monocrystalline silicon region (1) and a low-crystallinity silicon region (4) on top of the metal silicide region (3), after which the low-crystallinity silicon region (4) is transformed by heating into the epitaxial silicon region (2) having a high-crystallinity, during which process the metal silicide region (3) is moved from the bottom of the low-crystallinity silicon region (4) to the top of the epitaxial silicon region (2).