Abstract: A sensor module is disclosed. The sensor module can include a housing body that is disposed about a cavity that is sized and shaped to receive a container in which a substance is disposed in an operational configuration of the sensor module. The sensor module can include a first electrode that is coupled to or formed with the housing body. The first electrode is disposed at a first peripheral position on the housing body. The sensor module can include a second electrode that is coupled to or formed with the housing body. The second electrode is disposed at a second peripheral position on the housing body that is opposite the first peripheral position. The cavity is disposed between the first and second electrodes in the operational configuration of the housing body.

Abstract: A flow meter is disclosed. The flow meter can include a housing that has a cavity. The flow meter can also include a deformable tube that is disposed in the cavity. The deformable tube can comprise a portion of a flow path of a fluid substance. The flow meter can further include a cam that is rotatably coupled to the housing. A portion of the cam is configured to press against a portion of the collapsible tube so as to deform the portion of the collapsible tube. The cam can be configured to rotate in response to a flow of the fluid substance in the flow path.

Abstract: A battery assembly is disclosed. The battery assembly can include a first electrode disposed in a first substrate section and a second electrode disposed in a second substrate section. The battery assembly can also include an adhesive that bonds the first substrate section to the second substrate section. The adhesive partially defines a chamber between the first and second electrodes. The battery assembly can also include an electrolyte disposed in the chamber between the first and second electrodes.

Abstract: An integrated device package is disclosed. The package can include a package substrate and an integrated device die having active electronic circuitry. The integrated device die can have a first side and a second side opposite the first side. The first side can have bond pads electrically connected to the package substrate by way of bonding wires. A redistribution layer (RDL) stack can be disposed on a the first side of the integrated device die. The RDL stack can comprise an insulating layer and a conductive redistribution layer. The package can include a passive electronic device assembly mounted and electrically connected to the RDL stack.

Abstract: An electronic module is disclosed. The electronic module can include a package substrate, an integrated device die, a dam structure, and a mounting compound. The integrated device die can have an upper side, a lower side, and an outer side edge. The dam structure can have a first sidewall and a second sidewall opposite the first sidewall. The second sidewall can be nearer to the outer side edge than the first sidewall. The first sidewall can be laterally positioned between a center of the lower side of the integrated device die and the outer side edge. The dam structure can be disposed between a portion of the package substrate and a portion of the lower side of the integrated device die. The mounting compound can be disposed between the lower side of the integrated device die and the package substrate. The dam structure can be positioned between the mounting compound and the outer side edge of the integrated device die.

Abstract: An integrated device package sized and shaped to fit in a small space, such as within a body lumen or cavity of a human patient, is disclosed. The integrated device package includes a package substrate and integrated device dies. The first and second integrated device dies are angled relative to one another about the longitudinal axis by a fixed non-parallel angle.

Abstract: An electronic device is disclosed. The electronic device comprise an elongate electrical connector that is configured to connect to an integrated device package. The elongate electrical connector can comprise an elongate flexible substrate. The elongate flexible substrate has a proximal portion and a distal portion spaced from the proximal portion by a length along a longitudinal axis. The elongate flexible substrate has a width along an axis transverse to the longitudinal axis. The elongate flexible substrate defines an elongation ratio of the length to the width. The elongation ratio is at least 100:1. The elongate electrical connector can be connected to a bobbin. The elongate electrical connector can be configured to unspool from the bobbin.

Abstract: According to one example configuration, an apparatus enhances functionality of a mobile communication device. The apparatus includes an encasement in which to retain the mobile communication device and supplemental circuitry. The supplemental circuitry is operable to: i) control an optical transmitter in the supplemental circuitry to irradiate matter under test, ii) monitor attributes of an optical signal reflected off the matter under test and received by the optical receiver; and iii) communicate the attributes of the optical signal from the supplemental circuitry to the mobile communication device over a communication link. The supplemental circuitry optionally includes multiple electrodes to further monitor attributes of the matter under test.

Abstract: A flow meter is disclosed. The flow meter can include a housing that has a cavity. The flow meter can also include a deformable tube that is disposed in the cavity. The deformable tube can comprise a portion of a flow path of a fluid substance. The flow meter can further include a cam that is rotatably coupled to the housing. A portion of the cam is configured to press against a portion of the collapsible tube so as to deform the portion of the collapsible tube. The cam can be configured to rotate in response to a flow of the fluid substance in the flow path.

Abstract: In one aspect, an electric coil structure is disclosed. The electric coil structure includes a magnetic core and a substrate. The substrate comprises a conductive material that is embedded in an insulating material. The substrate has a first portion and a second portion and the first portion of the substrate is wrapped around the core. The substrate can have a first portion having a plurality of contacts and a second portion having a corresponding plurality of edge contacts. The coil structure includes an alignment structure. The alignment structure can facilitate attachment of the first portion to the second portion to define a coil about the magnetic core. The alignment structure can comprise a redistribution substrate. The redistribution substrate can be disposed between the first portion and the second portion with the conductive material of the first portion electrically connected to the conductive material of the second portion through the redistribution substrate to define at least one winding.

Abstract: A flow control system is disclosed. The flow control system can include a flow meter positioned at a first location of a flow path of a fluid substance, and a valve positioned at a second location of the flow path of the fluid substance. The flow meter can include a molded non-conductive housing, a heating element that is at least partially embedded in the housing, and a sensing element that is at least partially embedded in the housing. The valve can open the flow path to allow the fluid substance to flow in the flow path. The valve can include an actuator that includes deformable chamber and a gate in the flow path of the fluid substance.

Abstract: An electronic module is disclosed. The electronic module can include a package substrate, an integrated device die, a dam structure, and a mounting compound. The integrated device die can have an upper side, a lower side, and an outer side edge. The dam structure can have a first sidewall and a second sidewall opposite the first sidewall. The second sidewall can be nearer to the outer side edge than the first sidewall. The first sidewall can be laterally positioned between a center of the lower side of the integrated device die and the outer side edge. The dam structure can be disposed between a portion of the package substrate and a portion of the lower side of the integrated device die. The mounting compound can be disposed between the lower side of the integrated device die and the package substrate.

Abstract: In some embodiments, an electronic module is disclosed. The electronic module can include a carrier and an integrated device die having an upper surface, a lower surface, and an outer side edge. The integrated device die can include a first surface recessed from the lower surface and a second surface extending between the lower surface and the first surface. The second surface can be laterally inset from the outer side edge. The electronic module can include a mounting compound comprising a first portion disposed between the lower surface of the integrated device die and the carrier and a second portion disposed along at least a portion of the second surface of the integrated device die.

Abstract: According to one example configuration, an apparatus enhances functionality of a mobile communication device. The apparatus includes an encasement in which to retain the mobile communication device and supplemental circuitry. The supplemental circuitry is operable to: i) control an optical transmitter in the supplemental circuitry to irradiate matter under test, ii) monitor attributes of an optical signal reflected off the matter under test and received by the optical receiver; and iii) communicate the attributes of the optical signal from the supplemental circuitry to the mobile communication device over a communication link. The supplemental circuitry optionally includes multiple electrodes to further monitor attributes of the matter under test.

Abstract: An integrated device package is disclosed. The package can include a package substrate and an integrated device die having active electronic circuitry. The integrated device die can have a first side and a second side opposite the first side. The first side can have bond pads electrically connected to the package substrate by way of bonding wires. A redistribution layer (RDL) stack can be disposed on a the first side of the integrated device die. The RDL stack can comprise an insulating layer and a conductive redistribution layer. The package can include a passive electronic device assembly mounted and electrically connected to the RDL stack.

Abstract: An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.

Abstract: A battery assembly is disclosed. The battery assembly can include a first electrode disposed in a first substrate section and a second electrode disposed in a second substrate section. The battery assembly can also include an adhesive that bonds the first substrate section to the second substrate section. The adhesive partially defines a chamber between the first and second electrodes. The battery assembly can also include an electrolyte disposed in the chamber between the first and second electrodes.

Abstract: An electronic device is disclosed. The electronic device comprise an elongate electrical connector that is configured to connect to an integrated device package. The elongate electrical connector can comprise an elongate flexible substrate. The elongate flexible substrate has a proximal portion and a distal portion spaced from the proximal portion by a length along a longitudinal axis. The elongate flexible substrate has a width along an axis transverse to the longitudinal axis. The elongate flexible substrate defines an elongation ratio of the length to the width. The elongation ratio is at least 100:1. The elongate electrical connector can be connected to a bobbin. The elongate electrical connector can be configured to unspool from the bobbin.

Abstract: Various embodiments of a compact sensor module are disclosed herein. The sensor module can include a stiffener and a sensor substrate wrapped around a side of the stiffener. A sensor die may mounted on the sensor substrate. A processor substrate may be coupled to the sensor substrate. A processor die may be mounted on the processor substrate and may be in electrical communication with the sensor die.

Abstract: In one aspect, an electric coil structure is disclosed. The electric coil structure includes a magnetic core and a substrate. The substrate comprises a conductive material that is embedded in an insulating material. The substrate has a first portion and a second portion and the first portion of the substrate is wrapped around the core. The substrate can have a first portion having a plurality of contacts and a second portion having a corresponding plurality of edge contacts. The coil structure includes an alignment structure. The alignment structure can facilitate attachment of the first portion to the second portion to define a coil about the magnetic core. The alignment structure can comprise a redistribution substrate. The redistribution substrate can be disposed between the first portion and the second portion with the conductive material of the first portion electrically connected to the conductive material of the second portion through the redistribution substrate to define at least one winding.