Patents by Inventor Vikrant J. Gokhale

Vikrant J. Gokhale has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230387877
    Abstract: Method for forming an integrated acoustic device. A thin film piezoelectric acoustic transducer is epitaxially formed on a host substrate and is then transferred to a functional target substrate wherein physical phenomena from the piezoelectric transducer and the arbitrary functional substrate interact to form a hybrid acoustic microsystem comprising the piezoelectric transducer and the arbitrary functional substrate.
    Type: Application
    Filed: May 11, 2023
    Publication date: November 30, 2023
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Vikrant J. GOKHALE, Brian P. DOWNEY, Shawn C. MACK, D. Scott KATZER, David J. MEYER, Pallavi DHAGAT, Albrecht JANDER
  • Patent number: 11831295
    Abstract: Acoustic wave devices based on epitaxially grown heterostructures comprising appropriate combinations of epitaxially grown metallic transition metal nitride (TMN) layers, epitaxially grown Group III-nitride (III-N) piezoelectric semiconductor thin film layers, and epitaxially grown perovskite oxide (PO) layers. The devices can include bulk acoustic wave (BAW) devices, surface acoustic wave (SAW) devices, high overtone bulk acoustic resonator (HBAR) devices, and composite devices comprising HBAR devices integrated with high-electron-mobility transistors (HEMTs).
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: November 28, 2023
    Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Vikrant J. Gokhale, Brian P. Downey, Matthew T. Hardy, Eric N. Jin, Neeraj Nepal, D. Scott Katzer, David J. Meyer
  • Patent number: 11050405
    Abstract: A micromechanical vibrasolator isolates vibration of a micromechanical resonator and includes: phononic bandgap mirrors, monophones connected serially; phonophore arms in an alternating sequence of phonophore arm-monophone-phonophore arm; abutments in acoustic communication with the phononic bandgap mirrors; wherein the micromechanical resonator is interposed between the phononic bandgap mirrors with phononic bandgap mirror arranged in parallel on opposing sides of the micromechanical resonator arranged perpendicular to a direction of vibration of an in-plane vibrational mode of the micromechanical resonator.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: June 29, 2021
    Assignee: GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE
    Inventors: Jason J. Gorman, Vikrant J. Gokhale
  • Publication number: 20210091746
    Abstract: Acoustic wave devices based on epitaxially grown heterostructures comprising appropriate combinations of epitaxially grown metallic transition metal nitride (TMN) layers, epitaxially grown Group III-nitride (III-N) piezoelectric semiconductor thin film layers, and epitaxially grown perovskite oxide (PO) layers. The devices can include bulk acoustic wave (BAW) devices, surface acoustic wave (SAW) devices, high overtone bulk acoustic resonator (HBAR) devices, and composite devices comprising HBAR devices integrated with high-electron-mobility transistors (HEMTs).
    Type: Application
    Filed: September 14, 2020
    Publication date: March 25, 2021
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Vikrant J. Gokhale, Brian P. Downey, Matthew T. Hardy, Eric N. Jin, Neeraj Nepal, D. Scott Katzer, David J. Meyer
  • Publication number: 20190267965
    Abstract: A micromechanical vibrasolator isolates vibration of a micromechanical resonator and includes: phononic bandgap mirrors, monophones connected serially; phonophore arms in an alternating sequence of phonophore arm-monophone-phonophore arm; abutments in acoustic communication with the phononic bandgap mirrors; wherein the micromechanical resonator is interposed between the phononic bandgap mirrors with phononic bandgap mirror arranged in parallel on opposing sides of the micromechanical resonator arranged perpendicular to a direction of vibration of an in-plane vibrational mode of the micromechanical resonator.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 29, 2019
    Inventors: Jason J. Gorman, Vikrant J. Gokhale