Abstract: An electronic assembly comprises an electronic module and a baseplate module. The electronic module comprises a printed circuit board having a signal line and a ground plane. The baseplate module comprises a ground plane and a signal conductor, wherein the signal conductor is electrically connected to the signal line of the printed circuit board. A bushing opening extends through the printed circuit board. An electrically conductive bushing is inserted through the bushing opening in the printed circuit board and is galvanically connected to the ground plane. A screw extends through the bushing into a mounting opening of the baseplate module to form a screw connection, whereby the bushing is pressed onto the ground plane of the baseplate module to form a galvanic connection.

Abstract: According to an exemplary embodiment of the present invention, a device to cleave an optical fiber is provided. The device includes a base and a cover that is rotatably connected to the base. The base has a work surface and a mandrel disposed in the base and extending above the work surface. An optical fiber can be bent over a radiused surface of the mandrel and tensioned prior to cleaving. A shuttle is disposed in the cover over the mandrel, wherein the shuttle includes a flexible abrasive material that is configured to contact the optical fiber and create a flaw on a top surface of the optical fiber to initiate a crack in the optical fiber.