Patents by Inventor Vincent C. Lopes
Vincent C. Lopes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7894121Abstract: A light valve assembly comprises a holographic optical element and a light valve that comprises an array of individually addressable pixels. The light valve assemblies can be fabricated on the die level or on a wafer-level.Type: GrantFiled: November 15, 2007Date of Patent: February 22, 2011Assignee: Texas Instruments IncorporatedInventors: Vincent C. Lopes, Bradley Morgan Haskett, Steven Monroe Penn
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Publication number: 20090128873Abstract: A light valve assembly comprises a holographic optical element and a light valve that comprises an array of individually addressable pixels. The light valve assemblies can be fabricated on the die level or on a wafer-level.Type: ApplicationFiled: November 15, 2007Publication date: May 21, 2009Applicant: Texas Instruments IncorporatedInventors: Vincent C. Lopes, Bradley Morgan Haskett, Steven Monroe Penn
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Patent number: 7071025Abstract: The method of protecting micromechanical structures during a wafer fabrication process. A protective layer 402 is deposited to protect the fragile microstructures during a wafer separation process and a post separation cleanup process. Suitable protective layers 402 typically are plastic and tend to deform or delaminate when the wafer is sawn. The deformation of the protective overcoat during the saw process destroys the structures it is intended to protect. To prevent deformation of the protective layer 402, a brittle layer 404 is deposited on the protective layer 402 to hold the protective layer in place during the saw process. Cured photoresist is a suitable protective layer. The photoresist can be applied to the protective layer using standard processes and cured, typically by baking the photoresist. Once the wafer is separated, the brittle layer may be removed. After the debris created during the saw process is removed, the protective overcoat may be removed.Type: GrantFiled: December 31, 2001Date of Patent: July 4, 2006Assignee: Texas Instruments IncorporatedInventors: Michael F. Brenner, Vincent C. Lopes
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Patent number: 6879147Abstract: A drop-in environmental control material carrier assembly 55, which improves the performance and lowers the cost of semiconductor packages. The disclosed approach positions the environmental control materials inside the package cavity by means of a drop-in environmental control material carrier assembly 54, which can hold up to eight materials. In the case of a packaged micromirror, the getters consist of at least three types; i.e., (1) one for absorbing moisture inside the package, (2) one for absorbing adhesive outgassing constituents inside the package, and (3) one for storing the PFDA lubricant used to prevent the micromirror mirrors from sticking. The performance and lifetime of the micromirror devices are improved and the cost of projection display systems, in which these micromirrors are central components, is lowered.Type: GrantFiled: September 30, 2003Date of Patent: April 12, 2005Assignee: Texas Instruments IncorporatedInventors: Vincent C. Lopes, Jwei Wien Liu
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Patent number: 6856014Abstract: A method of individually packaging a multiplicity of devices, such as a spatial light modulator, before the multiplicity of devices formed on a substrate wafer are separated. The method and structure comprises individually sealing each device while the device is still part of sealed by the combination interposer wafer and a cover or window wafer. After each device is sealed by the combination interposer wafer and cover wafer, the combination cover wafer is sawed through down to the substrate wafer. The sealed devices may then be fully separated by scoring and breaking the substrate wafer.Type: GrantFiled: December 29, 2003Date of Patent: February 15, 2005Assignee: Texas Instruments IncorporatedInventors: John C. Ehmke, Vincent C. Lopes, John Paul Harris
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Patent number: 6753037Abstract: A method for coating free-standing micromechanical devices using spin-coating. A solution with high solids loading but low viscosity can penetrate the free areas of a micromachined structure. Spinning this solution off the wafer or die results in film formation over the devices without the expected damage from capillary action. If an organic polymer is used as the solid component, the structures may be re-released by a traditional ash process. This method may be used as a process in the manufacture of micromechanical devices to protect released and tested structures, and to overcome stiction-related deformation of micromechanical devices associated with wet release processes.Type: GrantFiled: June 21, 2001Date of Patent: June 22, 2004Assignee: Texas Instruments IncorporatedInventors: Seth Miller, Vincent C. Lopes, Michael F. Brenner
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Publication number: 20040061492Abstract: A drop-in environmental control material carrier assembly 55, which improves the performance and lowers he cost of semiconductor packages. The disclosed approach positions the environmental control materials inside the package cavity by means of a drop-in environmental control material carrier assembly 54, which can hold up to eight materials. In the case of a packaged micromirror, the getters consist of at least three types; i.e., (1) one for absorbing moisture inside the package, (2) one for absorbing adhesive outgassing constituents inside the package, and (3) one for storing the PFDA lubricant used to prevent the micromirror mirrors from sticking. The performance and lifetime of the micromirror devices are improved and the cost of projection display systems, in which these micromirrors are central components, is lowered.Type: ApplicationFiled: September 30, 2003Publication date: April 1, 2004Inventors: Vincent C. Lopes, Jwei Wien Liu
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Patent number: 6664779Abstract: A drop-in environmental control material carrier assembly 55, which improves the performance and lowers the cost of semiconductor packages. The environmental control materials are positioned inside the package cavity by means of a drop-in environmental control material carrier assembly 54, which can hold up to eight materials. Three types of environmental control materials are typically used in micromirror packages: (1) one for absorbing moisture inside the package, (2) one for absorbing adhesive outgassing constituents inside the package, and (3) one for storing the PFDA lubricant used to prevent the micromirror mirrors from sticking. The performance and lifetime of the micromirror devices are improved and the cost of projection display systems, in which these micromirrors are central components, is lowered.Type: GrantFiled: November 5, 2001Date of Patent: December 16, 2003Assignee: Texas Instruments IncorporatedInventors: Vincent C. Lopes, Jwei Wien Liu
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Publication number: 20020122894Abstract: The method of protecting micromechanical structures during a wafer fabrication process. A protective layer 402 is deposited to protect the fragile microstructures during a wafer separation process and a post separation cleanup process. Suitable protective layers 402 typically are plastic and tend to deform or delaminate when the wafer is sawn. The deformation of the protective overcoat during the saw process destroys the structures it is intended to protect. To prevent deformation of the protective layer 402, a brittle layer 404 is deposited on the protective layer 402 to hold the protective layer in place during the saw process. Cured photoresist is a suitable protective layer. The photoresist can be applied to the protective layer using standard processes and cured, typically by baking the photoresist. Once the wafer is separated, the brittle layer may be removed. After the debris created during the saw process is removed, the protective overcoat may be removed.Type: ApplicationFiled: December 31, 2001Publication date: September 5, 2002Inventors: Michael F. Brenner, Vincent C. Lopes
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Publication number: 20020056898Abstract: A drop-in environmental control material carrier assembly 55, which improves the performance and lowers the cost of semiconductor packages. The disclosed approach positions the environmental control materials inside the package cavity by means of a drop-in environmental control material carrier assembly 54, which can hold up to eight materials. In the case of a packaged micromirror, the getters consist of at least three types; i.e., (1) one for absorbing moisture inside the package, (2) one for absorbing adhesive outgassing constituents inside the package, and (3) one for storing the PFDA lubricant used to prevent the micromirror mirrors from sticking. The performance and lifetime of the micromirror devices are improved and the cost of projection display systems, in which these micromirrors are central components, is lowered.Type: ApplicationFiled: November 5, 2001Publication date: May 16, 2002Inventors: Vincent C. Lopes, Jwei Wien Liu
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Publication number: 20020012744Abstract: A method for coating free-standing micromechanical devices using spin-coating. A solution with high solids loading but low viscosity can penetrate the free areas of a micromachined structure. Spinning this solution off the wafer or die results in film formation over the devices without the expected damage from capillary action. If an organic polymer is used as the solid component, the structures may be re-released by a traditional ash process. This method may be used as a process in the manufacture of micromechanical devices to protect released and tested structures, and to overcome stiction-related deformation of micromechanical devices associated with wet release processes.Type: ApplicationFiled: June 21, 2001Publication date: January 31, 2002Inventors: Seth Miller, Vincent C. Lopes, Michael F. Brenner