Abstract: The present disclosure relates to a socket with a fixing device and a charging cabinet for electric vehicles with the socket. The fixing device includes a connection mechanism, which is provided on one side of a mainbody of the socket and is adapted to releasably connect the socket to a mounting object to which the socket is to be mounted by means of a first fixing member, and a pivot mechanism, which is provided between the other side of the mainbody opposite to the connection mechanism and the mounting object, so that the socket is pivotable relative to the mounting object when released from the mounting object. Through the fixing device for the electric vehicle charging gun socket, the charging gun socket can be easily and quickly fixed on a mounting object, such as a charging cabinet, since the number of required fixing parts is reduced.

Abstract: The present disclosure generally provides compounds that antagonize certain T2R taste receptors, including related uses, methods, and compositions for the reduction of bitter taste and/or the enhancement of sweet taste. In certain aspects, the disclosure provides flavored articles or flavored compositions comprising such compounds, as well as uses of such compounds to reduce the bitter taste and/or enhance the sweet taste of such flavored articles or flavored compositions.

Abstract: A gene editing system of Candida viswanathii includes a Candida viswanathii, a first gene editing fragment and a second gene editing fragment. The first gene editing fragment successively includes a first homology arm and a screening gene. The second gene editing fragment is connected to a C-terminus of the first gene editing fragment and includes a second homology arm, a Cas9 expression cassette and a sgRNA cassette. The Cas9 expression cassette successively includes a Cas9 promoter, a Cas9 gene and three nuclear localization sequences. The sgRNA cassette successively includes a sgRNA promoter, a first ribozyme, a targeting sequence, a scaffold and a second ribozyme. The first gene editing fragment and the second gene editing fragment are constructed as a linear fragment for gene editing of a chromosome of the Candida viswanathii.

Abstract: A digital predistortion (DPD) system includes an input configured to receive an input signal. In some examples, a first signal path configured to generate a first signal based on the input signal. In some examples, an error model provider configured to generate an error model signal modeled after a gate bias error voltage associated with the DPD system. In some examples, a first combiner configured to combine the first signal and the error model signal to generate a first intermediate signal, and the DPD system generates an output signal based at least on the first intermediate signal.

Abstract: A screen repair patch and a screen flaw repair method. The screen repair patch includes an optical layer, a substrate layer, and an adhesion layer. The optical layer and a screen to be repaired have the same or similar optical performance. The substrate layer has a thickness of 10 to 250 microns. The adhesion layer has a thickness of 5 to 200 microns. In the screen flaw repair method, a repair patch is cut off from a region on a patch sheet corresponding to the position of a flaw of a screen, and the repair patch is attached to the corresponding position of the flaw of the screen by using a joining direction of the screen as an affixing direction of the repair patch.

Abstract: A method for manufacturing a loudspeaker vibrating membrane with hard and elastic soft properties, comprising: (a) adhering a curable polymer to all areas on the outer surface of a base material; (b) drying the curable polymer to form a hard structure; (c) forming a loudspeaker vibrating membrane; and (d) separating the loudspeaker vibrating membrane from the base material. The method further comprises the following steps between steps (b) and (c) or steps (c) and (d), or after step (d): (e) adhering an elastic soft polymer to all or partial areas on the outer surface of the hard structure; and (f) drying the elastic soft polymer to form an elastic soft structure covering all or partial areas on the outer surface of the hard structure. In the present invention, the hardness and elastic coefficient of the loudspeaker vibrating membrane can be adjusted by the hard structure and the elastic soft structure.

Abstract: A method for manufacturing a loudspeaker vibrating membrane with hard and elastic soft properties, comprising: (a) adhering a curable polymer to all areas on the outer surface of a base material; (b) drying the curable polymer to form a hard structure; (c) forming a loudspeaker vibrating membrane; and (d) separating the loudspeaker vibrating membrane from the base material. The method further comprises the following steps between steps (b) and (c) or steps (c) and (d), or after step (d): (e) adhering an elastic soft polymer to all or partial areas on the outer surface of the hard structure; and (f) drying the elastic soft polymer to form an elastic soft structure covering all or partial areas on the outer surface of the hard structure. In the present invention, the hardness and elastic coefficient of the loudspeaker vibrating membrane can be adjusted by the hard structure and the elastic soft structure.

Abstract: Relates to a compound of Formula I a salt, hydrate, solvate, tautomer, enantiomer, racemate, diastereomer, or combination thereof. Also, relates to a compound of Formula II a salt, hydrate, solvate, tautomer, enantiomer, racemate, diastereomer, or combination thereof. The compounds can be a matrix metalloproteinase (MMP) inhibitor. The compounds can also treat a matrix metalloproteinase mediated condition such as cancer.

Abstract: A method for manufacturing a loudspeaker having a wire damper with locally adjustable elasticity, including preparation, impregnating, drying, wire disposing, forming, cutting and assembling steps. Wherein, a wire damper including a main body and a wire is thermoformed on a base material. The main body includes a wave structure and a wire disposing area. The wave structure includes wave crest and trough, and inner and outer sidewalls. The wire disposing area forms a hollow portion in which the wire extends. The warp yarns at outside and inside of the wire disposing area form an elastic adjustment area. The hollow portion has smaller depths at the inner and outer sidewalls than at the wave crests and troughs. Thereby, the wire will not be damaged by thermal pressurization, and the hardness, elasticity and toughness of the combination of the wire disposing area and the wire are equal to that of other areas.

Abstract: According to one or more aspects of the present disclosure a wearable oral device is provided. The wearable oral device may include a mouthpiece; a bone conduction component; and a processing device. The processing device may detect one or more user interactions by a first user with the wearable oral device; and perform one or more operations in view of the one or more user interactions. The one or more user interactions may include a user interaction by the first user with the mouthpiece. The one or more operations may include presenting a content item via the bone conduction component of the wearable oral device. The content item may include audio content. In some embodiments, the content item comprises a voice message from a second user.

Abstract: A loudspeaker includes a loudspeaker body, a voice coil and a damper. The damper includes a main body, a wire and a first fixing sewing thread. The first fixing sewing thread includes a first sewing part including first to fourth wire winding portions and first to third yarn winding portions. The first and third wire winding portions extend from one side of the wire through upside of the wire to the other side of the wire while the second and fourth wire winding portions extend in the opposite direction The first to third yarn winding portions connect adjacent two wire winding portions and pass under one of the weft yarns, respectively.

Abstract: A method for manufacturing a loudspeaker includes arranging, weaving, impregnating, drying, forming, cutting and assembling steps. In the arranging step, warp yarns and wires are arranged at intervals, and the wires are grouped as a wire group. In the weaving step, weft yarns are arranged at intervals and interwoven with the warp yarns and the wires to form a base material by weaving, and an area where the weft yarns are interwoven with the wires is defined as a wire disposing area. In the forming step, a wire damper is formed on the base material by thermoforming; two elastic adjustment areas are formed at the weft yarns between both sides of the wire group and the warp yarns closest to both sides of the wire group; and widths of the elastic adjustment areas are equal to each other and larger than distances between the remaining warp yarns.

Abstract: A semiconductor device includes a semiconductor die having an insulative layer and a conductive feature in the insulative layer, and a shield in contact with a lateral surface of the conductive feature. In some embodiments, the lateral surface of the conductive feature is aligned with an edge of the insulating material.

Abstract: Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a first molding material disposed around the integrated circuit die, and a through-via disposed within the first molding material. A first side of a redistribution layer (RDL) is coupled to the integrated circuit die, the through-via, and the first molding material. A second molding material is over a second side of the RDL, the second side of the RDL being opposite the first side of the RDL. The packaged semiconductor device includes an antenna over the second molding material.

Abstract: A semiconductor structure includes a transceiver, a molding surrounding the transceiver, and a RDL disposed over the transceiver. The RDL includes an antenna and a dielectric layer. The antenna is disposed over and electrically connected to the transceiver. The dielectric layer surrounds the antenna. The antenna includes an elongated portion and a via portion. The elongated portion extends over the molding, and the via portion is electrically connected to the transceiver.