Abstract: The present invention provides a security assembly for protecting a device includes first and second security wraps fitted to the device. The first security wrap covers a first area of the device. The second security wrap partially overlaps the first security wrap and covers a second area of the device. Each of the first and second security wraps has a security screen having first and second screen terminals and a conductive track extending between the first and second screen terminals. A conductive structure is disposed in an overlapping area between the first and second security wraps and coupled to the second screen terminal of the first security screen and to the first screen terminal of the second security screen.

Abstract: An electronic device is protected from unauthorized access by use of a security wrap having a security screen connected to an alarm circuit of the electronic device. The security screen has a pair of screen terminals interconnected by a conductor. The conductor is formed on a substrate. The substrate is arranged such that attempts to remove the security wrap will result in the substrate being torn and the conductor being damaged or broken whereby the resistance of the conductive path formed by the conductor changes to indicate an alarm condition.

Abstract: A security wrap (20) for protecting an electronic component includes a substrate (22) having a first side and a second side opposite to each other. A security screen (26) is disposed over the first side of the substrate (22) and includes a pair of screen terminals (48) and a frangible and electrically conductive path (46) between the pair of screen terminals (48). A layer of adhesive (30) is over the first side of the substrate (22) and bonds the first side of the substrate (22) to the electronic component with the security screen (26) sandwiched there between.

Abstract: A contact smart card has a smart card contact pad and an IC chip. The smart card contact pad includes a circuit substrate, a card-reader contact element on a first side of the circuit substrate, and a connection element on a second side of the circuit substrate. The card-reader contact element has a noble metal electrically conductive surface, and the connection element has a chip terminal connection surface which is not a noble metal. The IC chip is preferably flip-chip mounted at the second side of the circuit substrate and electrically connected to the chip terminal connection surface. Furthermore, the chip terminal connection surface is preferably an organometallic electrically conductive corrosion protection layer.

Abstract: The present invention provides a security assembly for protecting a device includes first and second security wraps fitted to the device. The first security wrap covers a first area of the device. The second security wrap partially overlaps the first security wrap and covers a second area of the device. Each of the first and second security wraps has a security screen having first and second screen terminals and a conductive track extending between the first and second screen terminals. A conductive structure is disposed in an overlapping area between the first and second security wraps and coupled to the second screen terminal of the first security screen and to the first screen terminal of the second security screen.

Abstract: A security assembly for protecting a device including first and second security wraps fitted to the device. The first security wrap covers a first area of the device. The second security wrap partially overlaps the first security wrap and covers a second area of the device. Each of the first and second security wraps has a security screen having a pair of screen terminals and a conductive track extending between the screen terminals A conductive structure is disposed in an overlapping area between the first and second security Wraps and coupled to the first screen terminals of the first security screen and to the second screen terminals of the second security screen.

Abstract: A contact smart card has a smart card contact pad and an IC chip. The smart card contact pad includes a circuit substrate, a card-reader contact element on a first side of the circuit substrate, and a connection element on a second side of the circuit substrate. The card-reader contact element has a noble metal electrically conductive surface, and the connection element has a chip terminal connection surface which is not a noble metal. The IC chip is preferably flip-chip mounted at the second side of the circuit substrate and electrically connected to the chip terminal connection surface. Furthermore, the chip terminal connection surface is preferably an organometallic electrically conductive corrosion protection layer.

Abstract: A contact pad carrier strip includes a substrate having a lateral extent of or substantially of 35 mm or a multiple of or substantially of 35 mm, and at least three smart card contact pads formed along the lateral extent of the substrate. The contact pads are aligned widthwisely across the lateral extent of the substrate. Each smart card contact pad includes a plurality of contacts. A majority of contacts of the contact pads are oriented to extend widthwisely across the lateral extent of the carrier strip.

Abstract: A contact smart card has a smart card contact pad and an IC chip. The smart card contact pad includes a circuit substrate, a card-reader contact element on a first side of the circuit substrate, and a connection element on a second side of the circuit substrate. The card-reader contact element has a noble metal electrically conductive surface, and the connection element has a chip terminal connection surface which is not a noble metal. The IC chip is preferably flip-chip mounted at the second side of the circuit substrate and electrically connected to the chip terminal connection surface. Furthermore, the chip terminal connection surface is preferably an organometallic electrically conductive corrosion protection layer.

Abstract: A security wrap (20) for protecting an electronic component (16) includes a substrate (26) having a first side and a second side opposite to each other. A conductive path (22) is disposed over the first side of the substrate (26) and has first and second ends coupled to the electronic component (16), and a pattern selected from a plurality of predetermined patterns. A layer of adhesive (28) is over the first side of the substrate (26) and bonds the first side of the substrate (26) to the electronic component (16) with the conductive path (22) sandwiched there between.

Abstract: A security wrap (20) for protecting an electronic component (16) having a bonding surface includes a substrate (22) having a first side and a second side opposite to each other. A first security screen (26) is disposed over the first side of the substrate (22) and includes a first pair of screen terminals (48) and a first conductive track (46) between the first pair of screen terminals (48). A second security screen (26) includes a second pair of screen terminals (48) and a second conductive track (46) between the second pair of screen terminals (48) and overlaying the first conductive track (46) on the first security screen (26). A layer of adhesive (30) is over a side of the second security screen (26) remote from the substrate (22) and bonds the second security screen (22) to the bonding surface of the electronic component (16).

Abstract: A contact smart card has a smart card contact pad and an IC chip. The smart card contact pad includes a circuit substrate, a card-reader contact element on a first side of the circuit substrate, and a connection element on a second side of the circuit substrate. The card-reader contact element has a noble metal electrically conductive surface, and the connection element has a chip terminal connection surface which is not a noble metal. The IC chip is preferably flip-chip mounted at the second side of the circuit substrate and electrically connected to the chip terminal connection surface. Furthermore, the chip terminal connection surface is preferably an organometallic electrically conductive corrosion protection layer.

Abstract: An electronic device is protected from unauthorized access by use of a security wrap having a security screen connected to an alarm circuit of the electronic device. The security screen has a pair of screen terminals interconnected by a conductor. The conductor is formed on a substrate. The substrate is arranged such that attempts to remove the security wrap will result in the substrate being torn and the conductor being damaged or broken whereby the resistance of the conductive path formed by the conductor changes to indicate an alarm condition.

Abstract: The present invention provides a security assembly for protecting a device includes first and second security wraps fitted to the device. The first security wrap covers a first area of the device. The second security wrap partially overlaps the first security wrap and covers a second area of the device. Each of the first and second security wraps has a security screen having first and second screen terminals and a conductive track extending between the first and second screen terminals. A conductive structure is disposed in an overlapping area between the first and second security wraps and coupled to the second screen terminal of the first security screen and to the first screen terminal of the second security screen.

Abstract: A security wrap (20) for protecting an electronic component includes a substrate (22) having a first side and a second side opposite to each other. A security screen (26) is disposed over the first side of the substrate (22) and includes a pair of screen terminals (48) and a frangible and electrically conductive path (46) between the pair of screen terminals (48). A layer of adhesive (30) is over the first side of the substrate (22) and bonds the first side of the substrate (22) to the electronic component with the security screen (26) sandwiched there between.

Abstract: A security wrap (20) for protecting an electronic component (16) having a bonding surface includes a substrate (22) having a first side and a second side opposite to each other. A first security screen (26) is disposed over the first side of the substrate (22) and includes a first pair of screen terminals (48) and a first conductive track (46) between the first pair of screen terminals (48). A second security screen (26) includes a second pair of screen terminals (48) and a second conductive track (46) between the second pair of screen terminals (48) and overlaying the first conductive track (46) on the first security screen (26). A layer of adhesive (30) is over a side of the second security screen (26) remote from the substrate (22) and bonds the second security screen (22) to the bonding surface of the electronic component (16).

Abstract: A security wrap (20) for protecting an electronic component (16) includes a substrate (26) having a first side and a second side opposite to each other. A conductive path (22) is disposed over the first side of the substrate (26) and has first and second ends coupled to the electronic component (16), and a pattern selected from a plurality of predetermined patterns. A layer of adhesive (28) is over the first side of the substrate (26) and bonds the first side of the substrate (26) to the electronic component (16) with the conductive path (22) sandwiched there between.

Abstract: A contact pad carrier strip includes a substrate having a lateral extent of or substantially of 35 mm or a multiple of or substantially of 35 mm, and at least three smart card contact pads formed along the lateral extent of the substrate. The contact pads are aligned widthwisely across the lateral extent of the substrate. Each smart card contact pad includes a plurality of contacts. A majority of contacts of the contact pads are oriented to extend widthwisely across the lateral extent of the carrier strip.