Abstract: An improved electroexplosive device employs a header having contact pins hermetically sealed with glass passing through from a connector end of the header to a cavity filled with a shunt layer of a new nonlinear resistive composition and a heat-sink layer of a new dielectric composition having good thermal conductivity and capacity. A bridge circuit placed across the contact pins in contact with the heat-sink layer is welded to the pins. The header is inserted into a body for the device and welded for a hermetic seal between the connector end and the bridge end. Layers of igniter and output charges are placed in the body over the heat-sink layer and bridge circuit. A closure disk is then placed over the charges and welded to the body to form a hermetic seal. The nonlinear resistive layer and the heat-sink layer are prepared from suitable comminuted materials by mixing with a low temperature polymerizing resin. The resin is dissolved in a suitable solvent and later evaporated.