Patents by Inventor Vinh D. Nguyen

Vinh D. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ORGANICALLY MODIFIED CHALCOGENIDE POLYMERS FOR USE AS OPTICAL ADHESIVE MATERIALS
    Publication number: 20240066834
    Abstract: A bonded optical assembly comprising infrared-transparent materials. The assembly comprises two or more infrared transparent optical elements and a polymer comprising at least one chalcogenide element and crosslinking moieties between the infrared-transparent optical elements. The crosslinking moieties may be organic, inorganic, or both.
    Type: Application
    Filed: November 7, 2023
    Publication date: February 29, 2024
    Inventors: Darryl A. Boyd, Jason D. Myers, Vinh Q. Nguyen, Daniel J. Gibson, Colin C. Baker, Woohong Kim, Jasbinder S. Sanghera
  • Photonic integrated circuit (PIC) chips
    Patent number: 7519246
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: April 14, 2009
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Jr., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Ting-Kuang Chiang, Robert Grencavich, Vinh D. Nguyen, Donald J. Pavinski, Jr., Marco E. Sosa
  • Submount for a photonic integrated circuit (PIC) chip
    Patent number: 7062114
    Abstract: A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: June 13, 2006
    Assignee: Infinera Corporation
    Inventors: Jonas Webjorn, Robert Grencavich, Vinh D. Nguyen, Donald J. Pavinski, Jr.
  • Transmitter photonic integrated circuit ( TxPIC) chips
    Publication number: 20040067006
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Application
    Filed: December 11, 2002
    Publication date: April 8, 2004
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Ting-Kuang Chiang, Robert Grencavich, Vinh D. Nguyen, Donald J. Pavinski, Marco E. Sosa