Patents by Inventor Vipin A. Vitikkate

Vipin A. Vitikkate has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Data storage device formatting a disk surface with a write format and a read format
    Patent number: 10424334
    Abstract: A data storage device is disclosed comprising a first disk surface comprising a plurality of data tracks, and a first head actuated over the first disk surface. First data is written to the first disk surface based on a first format. At least part of the first disk surface is reformatted based on a second format, wherein the second format defines a lower recording density for the first disk surface as compared to a recording density defined by the first format. After reformatting the at least part of the first disk surface, second data is written to the first disk surface based on the second format and the first data is read from the first disk surface based on the first format.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: September 24, 2019
    Assignee: Western Digital Technologies, Inc.
    Inventors: Shaomin Xiong, Toshiki Hirano, Na Wang, Vipin A. Vitikkate, William B. Boyle
  • Feedthrough connector for hermetically sealed electronic devices
    Patent number: 9431759
    Abstract: Disclosed herein is one embodiment of an apparatus that includes a housing that defines an interior cavity. The housing also includes a spring aperture. The apparatus further includes a spring coupled to the housing over the spring aperture, with the spring having a deflection portion and a feedthrough aperture. The apparatus also has an electrical connector coupled to the spring and extending through the feedthrough aperture and the spring aperture. The electrical connector may have a plurality of electrical traces extending from a location external to the housing to a location within the interior cavity of the housing.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: August 30, 2016
    Assignee: HGST NETHERLANDS B.V.
    Inventors: Toshiki Hirano, Vipin A. Vitikkate
  • FEEDTHROUGH CONNECTOR FOR HERMETICALLY SEALED ELECTRONIC DEVICES
    Publication number: 20160111814
    Abstract: Disclosed herein is one embodiment of an apparatus that includes a housing that defines an interior cavity. The housing also includes a spring aperture. The apparatus further includes a spring coupled to the housing over the spring aperture, with the spring having a deflection portion and a feedthrough aperture. The apparatus also has an electrical connector coupled to the spring and extending through the feedthrough aperture and the spring aperture. The electrical connector may have a plurality of electrical traces extending from a location external to the housing to a location within the interior cavity of the housing.
    Type: Application
    Filed: October 20, 2014
    Publication date: April 21, 2016
    Inventors: Toshiki Hirano, Vipin A. Vitikkate