Patents by Inventor Vishwa N. Shukla
Vishwa N. Shukla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7549870Abstract: An electrical interconnect device includes a substrate having opposite outer surfaces and an array of conductive elastomeric columns held by the substrate. Each of the columns have opposite ends that extend beyond respective ones of the outer surfaces of the substrate. Conductive contact caps are disposed over the opposite ends of each said column. An electrical path is defined from one of the contact caps, through the conductive elastomeric column, to another of the contact caps. Optionally, the contact caps may be sized and shaped substantially similarly as the ends of the elastomeric columns. The contact caps may be adhered to the ends of the columns, or alternatively, the contact caps may be adhered to the substrate.Type: GrantFiled: January 3, 2007Date of Patent: June 23, 2009Assignee: Tyco Electronics CorporationInventors: Jeffery W. Mason, Wayne Stewart Alden, III, Chuan Yue, Shiraz Sameja, Peter Wapenski, Vishwa N. Shukla, Edward MacPherson, Robert D. Hilty, George Chou
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Publication number: 20080160794Abstract: An electrical interconnect device includes a substrate having opposite outer surfaces and an array of conductive elastomeric columns held by the substrate. Each of the columns have opposite ends that extend beyond respective ones of the outer surfaces of the substrate. Conductive contact caps are disposed over the opposite ends of each said column. An electrical path is defined from one of the contact caps, through the conductive elastomeric column, to another of the contact caps. Optionally, the contact caps may be sized and shaped substantially similarly as the ends of the elastomeric columns. The contact caps may be adhered to the ends of the columns, or alternatively, the contact caps may be adhered to the substrate.Type: ApplicationFiled: January 3, 2007Publication date: July 3, 2008Inventors: Jeffery W. Mason, Wayne Stewart Alden, Chuan Yue, Shiraz Sameja, Peter Wapenski, Vishwa N. Shukla, Edward MacPherson, Robert D. Hilty, George Chou
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Patent number: 7326068Abstract: A connector assembly includes a first elastomeric connector having a plurality of alternating elastomeric conductors and elastomer insulators. The first elastomeric connector has first and second contact interfaces spaced apart from one another and extending generally perpendicular to the conductors and insulators. The connector assembly also includes a second elastomeric connector having a plurality of alternating elastomeric conductors and elastomer insulators. The second elastomeric connector has first and second contact interfaces spaced apart from one another and extending generally perpendicular to the conductors and insulators. A holder includes a body extending between first and second opposing surfaces, and the body defines a first recess housing the first elastomeric connector and a second recess housing the second elastomeric connector.Type: GrantFiled: July 26, 2005Date of Patent: February 5, 2008Assignee: Tyco Electronics CorporationInventors: Hans B. Sturm, Curtis G. Knaub, Vishwa N. Shukla, Edward J. Pupkiewicz
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Patent number: 5740594Abstract: A capacitive fluid pressure transducer is shown formed of a monolithic ceramic body (10) having a cavity located between a diaphragm portion (12) and a base portion (14). Opposed capacitor plates (22, 24) are disposed on opposed surfaces of the diaphragm portion and the base portion. The capacitor plates (22, 24) are formed of palladium oxide/silver having a ratio selected to create a fluid pressure level in the cavity as a result of oxygen evolution incident to the reduction of palladium oxide during the sintering cycle to offset the tendency of the diaphragm to bow inwardly due to shrinkage mismatch of the metal and ceramic materials.Type: GrantFiled: July 22, 1996Date of Patent: April 21, 1998Assignee: Texas Instruments IncorporatedInventors: Stanley J. Lukasiewicz, Vishwa N. Shukla, Allan J. Siuzdak
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Patent number: 5525280Abstract: A monolithic capacitive pressure transducer is shown composed of ceramic material having a closed cavity formed near a surface thereof and having capacitor plates formed on two opposed surfaces defining the cavity. Vias are formed extending from the capacitor plates to permit electrical connection therewith. The transducer is made by separately forming under pressure a diaphragm and a base having a recess in the top surface using ceramic powder coated with an organic binder. A metal layer is deposited on the two pieces and the pieces are then joined together to form a single unit. A spacer may be inserted in the recess to ensure that a predetermined gap is maintained between the two parts during the joining operation. The parts are then debinderized by heating in air to a first temperature level to allow the binder organics, as well as the spacer organics if a spacer is employed, to be vaporized and/or decomposed and removed through the open pores of the diaphragm and base.Type: GrantFiled: April 7, 1994Date of Patent: June 11, 1996Assignee: Texas Instruments IncorporatedInventors: Vishwa N. Shukla, Stanley J. Lukasiewicz, Francois A. Padovani
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Patent number: 5499158Abstract: A monolithic capacitive pressure transducer (12) is shown composed of ceramic material having a first closed cavity (12) separated from a surface thereof by a flexible wall member and a second closed cavity (16) defined by rigid wall members. Capacitor plates (32, 36; 40, 44) are formed on two opposed surfaces defining each cavity. Vias (33, 37; 41, 45) are formed extending from the capacitor plates to permit electrical connection therewith. The transducer is made by separately forming under pressure a diaphragm (20) and first and second base portions (22, 30) having recesses (24) in the top and bottom surfaces using ceramic powder coated with an organic binder. A metal layer is deposited on the pieces which are then joined together to form a single unit. A spacer (26) may be inserted in the recesses to ensure that a predetermined gap is maintained in each cavity during the joining operation.Type: GrantFiled: November 14, 1994Date of Patent: March 12, 1996Assignee: Texas Instruments IncorporatedInventors: Robert P. Bishop, Paul L. Hainey, Stanley J. Lukasiewicz, Allan J. Siuzdak, Robert E. Luminello, Jr., Vishwa N. Shukla
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Patent number: 5397518Abstract: An array of raised lands disposed in columns and rows formed of ceramic material, particularly barium strontium titanate, is formed by making a die of resist material having a negative image pattern of the array on a ceramic substrate and then forming a slurry having a high solid content of the ceramic material, filling the pattern with the slurry and firing the filled die to produce a sintered array of pixels. In a modified embodiment a pressing pad 18 of deformable ceramic tape is formed and pressed into the die after the die has been filled with slurry 16 in order to compact the material and wipe the ceramic material from the sidewalls 12. In another embodiment a ceramic tape of the type used for the pressing pad is pressed into the die and after a short time removed from the die with the pixel array formed in the tape which is then fired to sinter the array.Type: GrantFiled: April 16, 1993Date of Patent: March 14, 1995Assignee: Texas Instruments IncorporatedInventors: Vishwa N. Shukla, Allan J. Siuzdak, Stanley J. Lukasiewicz
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Patent number: 4401879Abstract: A fuel supply system having means for furnishing a mixture of air and alcohol or gasohol fuels to an automotive engine has a self-regulating, ceramic, electrical resistance heater for enhancing fuel evaporation during cold engine starting and incorporates a heater of improved structure to maintain stable heating properties in the alcohol-based system over a long service life.Type: GrantFiled: February 20, 1981Date of Patent: August 30, 1983Assignee: Texas Instruments IncorporatedInventors: Vishwa N. Shukla, Bernard M. Kulwicki