Abstract: A plurality of physically separate plastic substates are injection molded, each with at least one pattern of channels formed in a surface of thereof defining a conductive circuit to be formed. The plurality of substrates are then physically connected in a common planar array either by inserting them in corresponding receptacles in a carrier board, by mating peripheral connecting elements, by using adhesive or by some other suitable connecting mechanism. Where a carrier board with pre-formed receptacles is not utilized, the individual substrates in the array are pierced and replaced. The planar array is processed to simultaneously form a conductive circuit on each substrate consisting of metal deposited in its pattern of channels. The planar array of metallized substrates may then be stuffed with electronic components on an automatic insertion machine, wave soldered. The individual finished circuit boards are then pressed out.

Abstract: A plastic substrate is injection molded to provide a pattern of channels in at least one of its sides to define a predetermined set of conductive paths. Both the surfaces of the channels and the non-channel surfaces therebetween are metalling through one or more steps of flame spraying, a combination of electroless plating and electroplating, gas plating or vacuum deposition. In one form of the invention the metallization over the non-channel surfaces is removed by abrading. In another form of the invention the initial metallization over the non-channel surfaces is coated with a resist prior to the deposition of another metal layer. The metal covering the channels is subsequently removed by stripping the resist and etching away the initial metallization.

Abstract: A high temperature circuit board made by flame spraying a high temperature resistant metal film, such as aluminum, zinc or silver solder braze alloy, onto a high temperature resistant insulative substrate in which in one embodiment a reverse circuit image resist is layed on the board surface and the metal is flame sprayed onto the board surface and the reverse image resist screen is then removed leaving the circuit without etching. In the other embodiment aluminum is flame sprayed onto the substrate and then a silver solder braze alloy or copper or nickel is flame sprayed onto the aluminum film, and then resist and etching stops are applied to remove unwanted metal to the substrate and the resist is stripped providing the high temperature printed circuit board.