Patents by Inventor Vivek Mehrotra

Vivek Mehrotra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100091522
    Abstract: A matrix integrated magnetics (MIM) “Extended E” core in which a plurality of outer legs are disposed on a base and separated along a first outer edge to define windows therebetween. A center leg is disposed on the top region of the base and separated from the outer legs to define a center window. The center leg is suitably positioned along a second outer edge opposite the first or between outer legs positioned along opposing outer edges. A plate is disposed on the outer legs opposite the base.
    Type: Application
    Filed: December 14, 2009
    Publication date: April 15, 2010
    Inventors: Sriram Chandrasekaran, Vivek Mehrotra
  • Publication number: 20100061877
    Abstract: In a soft magnetic material, multiple flake-shaped magnetic particles: are coated by respective magnetic insulators; contain respective groups of magnetic nanoparticles; and are compacted to achieve magnetic exchange coupling between adjacent flake-shaped magnetic particles, and between adjacent magnetic nanoparticles within at least one of the flake-shaped magnetic particles.
    Type: Application
    Filed: September 11, 2008
    Publication date: March 11, 2010
    Inventors: Mariam Sadaka, Chris Young, Vivek Mehrotra, Rahul Ganguli
  • Patent number: 7675764
    Abstract: A power converter having input and output nodes and a method of operating the same. In one embodiment, the power converter includes a switching circuit including first, second and third active phase legs. Each of the first, second and third active legs includes a first switch coupled to one of the input nodes and a second switch coupled to another of the input nodes and has a common switching node therebetween. The power converter further includes a magnetic device including first, second and third primary windings, and first, second and third secondary windings. The first, second and third primary windings are coupled to the common switching node of the first, second and third active phase legs, respectively. The power converter still further includes a rectifier including first, second and third rectifier elements interposed between the first, second and third secondary windings, respectively, and one of the output nodes.
    Type: Grant
    Filed: August 25, 2008
    Date of Patent: March 9, 2010
    Assignee: Flextronics International USA, Inc.
    Inventors: Sriram Chandrasekaran, Vivek Mehrotra
  • Patent number: 7659614
    Abstract: A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high temperature melting point bonds using in situ formed ternary or quaternary mixtures of conductive metals and the devices created using TLP bonds of ternary or quaternary materials. The compositions meet the conflicting requirements of an interconnect or joint that can be exposed to high temperature, and is thermally and electrically conductive, void and creep resistant, corrosion resistant, and reliable upon temperature and power cycling.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: February 9, 2010
    Inventor: Vivek Mehrotra
  • Publication number: 20100003530
    Abstract: Provided is a magnetic graphite nanoplatelet, and a method of manufacturing nanocomposites by introducing the magnetic nanoplatelets into a composite matrix. Expanded crystalline graphite, in the form of graphite nanoplatelets, is mixed with magnetic particles to adhere the particles to the nanoplatelets. The magnetic graphite nanoplatelets are combined with a composite matrix, typically a polymer, to form a nanocomposite.
    Type: Application
    Filed: July 1, 2008
    Publication date: January 7, 2010
    Inventors: Rahul Ganguli, Julia J. Mack, Vivek Mehrotra
  • Patent number: 7633369
    Abstract: A matrix integrated magnetics (MIM) “Extended E” core in which a plurality of outer legs are disposed on a base and separated along a first outer edge to define windows therebetween. A center leg is disposed on the top region of the base and separated from the outer legs to define a center window. The center leg is suitably positioned along a second outer edge opposite the first or between outer legs positioned along opposing outer edges. A plate is disposed on the outer legs opposite the base.
    Type: Grant
    Filed: October 2, 2007
    Date of Patent: December 15, 2009
    Assignee: Flextronics International USA, Inc.
    Inventors: Sriram Chandrasekaran, Vivek Mehrotra
  • Patent number: 7554430
    Abstract: A vertical winding structure for planar integrated magnetics used in switched-mode power converters maintains close coupling between the different windings but reduces the eddy current losses, lowers the DC winding resistance and reduces the number of layers of the PCB. Vertical and horizontal windings can be used together without sacrificing these performance advantages and further minimizing the capacitive coupling between the outer-leg windings and the center-leg winding. This winding structure can be used in a wide range of magnetic structures including isolated and non-isolated CDRs, interleaved CDRs, and buck and boost converters.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: June 30, 2009
    Assignee: Flextronics International USA, Inc.
    Inventors: Vivek Mehrotra, Jian Sun, Sriram Chandrasekaran
  • Publication number: 20090004475
    Abstract: A method and apparatus is provided for creating soft magnetic materials for low-loss inductive devices that achieves low eddy currents, low coercivity, and high permeability at high frequency. The soft magnetic material utilizes magnetic nanoparticles that take advantage of desired properties of two or more particle types. The magnetic nanoparticles are single domain particles that are optimized to enhance exchange coupling.
    Type: Application
    Filed: June 27, 2007
    Publication date: January 1, 2009
    Inventors: Mariam Sadaka, Chris Young, Rahul Ganguli, Vivek Mehrotra
  • Publication number: 20080310190
    Abstract: A power converter having input and output nodes and a method of operating the same. In one embodiment, the power converter includes a switching circuit including first, second and third active phase legs. Each of the first, second and third active legs includes a first switch coupled to one of the input nodes and a second switch coupled to another of the input nodes and has a common switching node therebetween. The power converter further includes a magnetic device including first, second and third primary windings, and first, second and third secondary windings. The first, second and third primary windings are coupled to the common switching node of the first, second and third active phase legs, respectively. The power converter still further includes a rectifier including first, second and third rectifier elements interposed between the first, second and third secondary windings, respectively, and one of the output nodes.
    Type: Application
    Filed: August 25, 2008
    Publication date: December 18, 2008
    Inventors: Sriram Chandrasekaran, Vivek Mehrotra
  • Publication number: 20080250042
    Abstract: A method of determining a state of a Storage Area Network SAN is provided comprising analyzing data collected from components in the SAN, calculating a redundancy level of the SAN based on the analyzed data, and determining the state of the SAN based on the calculated redundancy level. The redundancy levels indicate the sensitivity of the SAN to a fault in one of the components. The method also includes receiving user policy settings allowing automatic correction of the SAN and auto-correcting the SAN in response to a change in the SAN state and in dependence on the user policy settings. The redundancy levels can be used by an administrator to set the user policy settings. An apparatus for carrying out the method is also provided.
    Type: Application
    Filed: April 8, 2008
    Publication date: October 9, 2008
    Applicant: Hewlett Packard Development Co, L.P.
    Inventors: Satish Kumar Mopur, Unnikrishnan Ponnan Katangot, Sathya Prakash Dhanabal, Mukesh Gupta, Vivek Mehrotra, Karthigeyan Kasthurirengan
  • Patent number: 7431862
    Abstract: A method of forming nano composites within a polymer structure comprises exposing a wettable polymer having ion-exchangeable groups pendant therefrom to an aqueous solution of a soluble salt containing metal ions, the metal ions replacing, by ion exchange, the pendant groups on the polymer. After ion exchange the polymer is exposed to a reducing agent forming metal oxides trapped within the polymer structure.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: October 7, 2008
    Assignee: ColdWatt, Inc.
    Inventors: Vivek Mehrotra, Ira Goldberg
  • Patent number: 7427910
    Abstract: Cutout and/or keep away regions are etched in the winding structure near the gapped center leg of a magnetic core. This reduces eddy current losses caused by the leakage field and improves current uniformity and current sharing between windings thereby increasing converter efficiency. Windings closest to the air gap are suitably formed with both keep away regions and cutouts. Windings a little further away are formed with only cutouts, and the windings furthest away are unchanged. This approach keeps the net winding losses low in the presence of a fringing field. The precise configuration is determined by the core structure, air gap and winding arrangements.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: September 23, 2008
    Assignee: ColdWatt, inc.
    Inventors: Vivek Mehrotra, Jian Sun
  • Publication number: 20080211104
    Abstract: A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high temperature melting point bonds using in situ formed ternary or quaternary mixtures of conductive metals and the devices created using TLP bonds of ternary or quaternary materials. The compositions meet the conflicting requirements of an interconnect or joint that can be exposed to high temperature, and is thermally and electrically conductive, void and creep resistant, corrosion resistant, and reliable upon temperature and power cycling.
    Type: Application
    Filed: May 7, 2008
    Publication date: September 4, 2008
    Inventor: Vivek Mehrotra
  • Patent number: 7417875
    Abstract: A power converter having input and output nodes and a method of operating the same. In one embodiment, the power converter includes a switching circuit including first, second and third active phase legs. Each of the first, second and third active legs includes a first switch coupled to one of the input nodes and a second switch coupled to another of the input nodes and has a common switching node therebetween. The power converter further includes a magnetic device including first, second and third primary windings, and first, second and third secondary windings. The first, second and third primary windings are coupled to the common switching node of the first, second and third active phase legs, respectively. The power converter still further includes a rectifier including first, second and third rectifier elements interposed between the first, second and third secondary windings, respectively, and one of the output nodes.
    Type: Grant
    Filed: February 8, 2006
    Date of Patent: August 26, 2008
    Assignee: ColdWatt, Inc.
    Inventors: Sriram Chandrasekaran, Vivek Mehrotra
  • Patent number: 7390735
    Abstract: A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high temperature melting point bonds using in situ formed ternary or quaternary mixtures of conductive metals and the devices created using TLP bonds of ternary or quaternary materials. The compositions meet the conflicting requirements of an interconnect or joint that can be exposed to high temperature, and is thermally and electrically conductive, void and creep resistant, corrosion resistant, and reliable upon temperature and power cycling.
    Type: Grant
    Filed: January 7, 2005
    Date of Patent: June 24, 2008
    Assignee: Teledyne Licensing, LLC
    Inventor: Vivek Mehrotra
  • Publication number: 20080145647
    Abstract: Metal-impregnated composite materials and methods of making these are provided. The materials include a reinforcing material of reinforcing fibers, in which the fibers are tightly packed and have discontinuous inter-fiber spaces. In addition, the composite includes metal particulates distributed in at least some of the discontinuous inter-fiber spaces. A polymer encases the reinforcing material and the metal particulates. Methods may include the step of subjecting plies, to which polymer and metal particulates are applied, concurrently to (1) a magnetic field oriented to urge the metal particulates into the plies and (2) to vibration forces. Thereafter, the polymer and metal particulate-containing plies are consolidated under heat and pressure.
    Type: Application
    Filed: December 10, 2007
    Publication date: June 19, 2008
    Inventors: Rahul Ganguli, Vivek Mehrotra, Brian N. Cox
  • Publication number: 20080128649
    Abstract: A method of forming nanocomposites within a polymer structure includes exposing a wettable polymer having ion-exchangeable groups pendant therefrom to an aqueous solution of a soluble salt containing metal ions, the metal ions replacing, by ion exchange, the pendant groups on the polymer. After ion exchange, the polymer is repetitively exposed to an oxidizing and/or reducing agent to form metal oxides, metal particles, metallic alloys, or combinations and mixtures thereof, trapped within the polymer structure.
    Type: Application
    Filed: September 13, 2007
    Publication date: June 5, 2008
    Inventors: Vivek Mehrotra, Ira Goldberg
  • Publication number: 20080111657
    Abstract: A vertical winding structure for planar integrated magnetics used in switched-mode power converters maintains close coupling between the different windings but reduces the eddy current losses, lowers the DC winding resistance and reduces the number of layers of the PCB. Vertical and horizontal windings can be used together without sacrificing these performance advantages and further minimizing the capacitive coupling between the outer-leg windings and the center-leg winding. This winding structure can be used in a wide range of magnetic structures including isolated and non-isolated CDRs, interleaved CDRs, and buck and boost converters.
    Type: Application
    Filed: January 16, 2008
    Publication date: May 15, 2008
    Inventors: Vivek Mehrotra, Jian Sun, Sriram Chandrasekaran
  • Publication number: 20080024259
    Abstract: A matrix integrated magnetics (MIM) “Extended E” core in which a plurality of outer legs are disposed on a base and separated along a first outer edge to define windows there between. A center leg is disposed on the top region of the base and separated from the outer legs to define a center window. The center leg is suitably positioned along a second outer edge opposite the first or between outer legs positioned along opposing outer edges. A plate is disposed on the outer legs opposite the base.
    Type: Application
    Filed: October 2, 2007
    Publication date: January 31, 2008
    Inventors: Sriram Chandrasekaran, Vivek Mehrotra
  • Patent number: 7321283
    Abstract: A vertical winding structure for planar integrated magnetics used in switched-mode power converters maintains close coupling between the different windings but reduces the eddy current losses, lowers the DC winding resistance and reduces the number of layers of the PCB. Vertical and horizontal windings can be used together without sacrificing these performance advantages and further minimizing the capacitive coupling between the outer-leg windings and the center-leg winding. This winding structure can be used in a wide range of magnetic structures including isolated and non-isolated CDRs, interleaved CDRs, and buck and boost converters.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: January 22, 2008
    Assignee: ColdWatt, Inc.
    Inventors: Vivek Mehrotra, Jian Sun, Sriram Chandrasekaran