Abstract: An apparatus for weighing aircraft, particularly aircraft prior to take-off, the aircraft having differing undercarriage wheel configurations (footprints), one to another, the apparatus for use on or in an aircraft roadway or the like. The apparatus comprises a plurality of spaced apart wheel load measuring devices and wherein at least the wheel load measuring devices for the respective main undercarriage wheels are mounted for lateral movement one to another, and in some cases computer controlled motorized movement controlled from the aircraft, so that they may be selectively positioned in spaced relation one to another to suit the various main undercarriage wheel spacings of the various aircraft to be weighed. A readout means is operatively linked to the load measuring devices in order to display the respective wheel loads registered by the respective load measuring devices. In some cases, a computer is included for calculating the center of gravity of the respective aircraft.

Abstract: A solder nozzle to produce a smooth turbulent free solder wave has at least one air jet associated therewith to remove solder icicles and bridges that can form on the under surface of circuit boards and other elements. The circuit boards move in an upward inclined path in the direction of travel and after passing through the solder wave an air knife projects a non-oxidizing gas with sufficient force to remove excess solder. The soldering can occur in a non-oxidizing gas enclosure such as an inert gas, or a reducing gas, and vibrating the solder wave below ultrasonic frequencies can assist in the soldering.

Abstract: A tunnel for fluxless soldering, is a straight linear tunnel which contains vibrating means to vibrate a solder wave and a non-explosive gas atmosphere. The gas atmosphere includes a small portion of hydrogen or other gaseous reducing agent, sufficient to achieve a fluxing action. A process for soldering an element comprises the steps of conveying the element through a tunnel containing a non-explosive gas atmosphere substantially excluding oxygen, heating the element in the tunnel, soldering the element, and retaining the element in the gas atmosphere of the tunnel until solder on the element has solidified.