Abstract: Techniques and systems for enhanced adjustment of quantities and placement of decoupling capacitance on circuit boards for integrated circuits is provided herein. An example method includes iterating application of a load profile across different populations of decoupling capacitors on a circuit board for supply voltage domains of an integrated circuit device until a target transient performance is reached for the supply voltage domains. The load profile is applied onto electrical connections corresponding to the supply voltage domains for the integrated circuit device. The method also includes generating a capacitor population configuration for the circuit board based on a population of the decoupling capacitors that achieves the target transient performance.

Abstract: Techniques and systems for enhanced adjustment of quantities and placement of decoupling capacitance on circuit boards for integrated circuits is provided herein. An example method includes iterating application of a load profile across different populations of decoupling capacitors on a circuit board for supply voltage domains of an integrated circuit device until a target transient performance is reached for the supply voltage domains. The load profile is applied onto electrical connections corresponding to the supply voltage domains for the integrated circuit device. The method also includes generating a capacitor population configuration for the circuit board based on a population of the decoupling capacitors that achieves the target transient performance.

Abstract: An electronic device includes an AI power controller that predicts future load transients within a system and that dynamically alters power settings in anticipation of the predicted future load transients. To predict a future load transients, the AI power controller receives as an input application signature data from an application executing on the device. The application signature data includes at least media frame data generated by the application during a time interval. The AI power controller executes logic to compare the received application signature data to historical application signature data, where the historical application signature data includes media frame data generated by the application during one or more past execution instances of the application. Based on the comparison, the AI power controller predicts a load transient of the application at a future point in time and dynamically adjusts a power control setting of the device in anticipation of the predicted load transient.

Abstract: Techniques and systems for enhanced adjustment of quantities and placement of decoupling capacitance on circuit boards for integrated circuits is provided herein. An example method includes iterating application of a load profile across different populations of decoupling capacitors on a circuit board for supply voltage domains of an integrated circuit device until a target transient performance is reached for the supply voltage domains. The load profile is applied onto electrical connections corresponding to the supply voltage domains for the integrated circuit device. The method also includes generating a capacitor population configuration for the circuit board based on a population of the decoupling capacitors that achieves the target transient performance.

Abstract: An electronic device includes an AI power controller that predicts future load transients within a system and that dynamically alters power settings in anticipation of the predicted future load transients. To predict a future load transients, the AI power controller receives as an input application signature data from an application executing on the device. The application signature data includes at least media frame data generated by the application during a time interval. The AI power controller executes logic to compare the received application signature data to historical application signature data, where the historical application signature data includes media frame data generated by the application during one or more past execution instances of the application. Based on the comparison, the AI power controller predicts a load transient of the application at a future point in time and dynamically adjusts a power control setting of the device in anticipation of the predicted load transient.

Abstract: An adapter includes a first coupling component and a second coupling component to establish bidirectional communications between two processing devices by passing data signals through a memory card slot on one of the devices. The adapter includes a first coupling interface configured to couple with the memory card slot on a first one of the two processing devices and further includes a second coupling interface configured to couple with a second processing device. The second coupling interface is of a different form factor than the first coupling interface.

Abstract: An integrated circuit (IC) chip design for symmetric power delivery includes an integrated circuit (IC) chip package with I/O connections exposed on a first surface and power connections exposed on a second opposite surface. At least one voltage regulation module (VRM) is positioned on the second opposite surface and electrically coupled to the power connections on the second opposite surface.

Abstract: An adapter includes a first coupling component and a second coupling component to establish bidirectional communications between two processing devices by passing data signals through a memory card slot on one of the devices. The adapter includes a first coupling interface configured to couple with the memory card slot on a first one of the two processing devices and further includes a second coupling interface configured to couple with a second processing device. The second coupling interface is of a different form factor than the first coupling interface.

Abstract: An integrated circuit (IC) chip design for symmetric power delivery includes an integrated circuit (IC) chip package with I/O connections exposed on a first surface and power connections exposed on a second opposite surface. At least one voltage regulation module (VRM) is positioned on the second opposite surface and electrically coupled to the power connections on the second opposite surface.