Abstract: This invention provides a method for producing an adapter for use with an LGA device. The method includes providing a flexible substrate having a conductive base layer. The method also includes forming a plurality of openings through the flexible substrate. The method further includes defining on the flexible substrate a plurality of vias extending through the openings in the flexible substrate, a plurality of conductive pads electrically connected to the vias, and a plurality of conductive paths extending between adjacent pads, wherein spaces are defined between the pads and the paths to prevent direct contact between the pads and the paths, each of the paths being connected to at least one of a plurality of peripheral pads provided on the flexible substrate. The conductive base layer substantially covers a portion of the substrate surface area.

Abstract: An adapter is provided for use with a land grid array (LGA) device that is mounted on a circuit board, wherein an interposer socket having compliant contacts provides electrical coupling between pads provided on the LGA device and pads provided on the circuit board. The adapter includes a flexible substrate and a plurality of conductors extending through the flexible substrate. The flexible substrate is configured to flex in reaction to the force exerted by the compliant contacts of the interposer socket. A circuit board assembly and method are also provided. The adapter may include a periphery pad (416) for solder connection to an external circuit wire (336) and is usable for modification of the circuitry on the circuit board.

Abstract: A system and method for distributing three-phase alternating current on a printed circuit board are provided. The system comprises a connector having a plurality of pins and a corresponding trace on the printed circuit board for each of the pins. The spacing between adjacent traces satisfies a first minimum spacing requirement, and the spacing between alternating traces satisfies a second minimum spacing requirement larger than the first minimum spacing requirement. When the system is employed in an environment that imposes the second minimum spacing requirement, the traces are defined such that the different phases of the alternating current are carried on alternating traces with the traces in between defined as neutrals. When the system is employed in an environment that imposes the first minimum spacing requirement, the traces can be defined such that the different phases of the alternating current are carried on adjacent traces.

Abstract: Apparatus and methods for defining circuit routing paths between electronic components on a substrate are disclosed. A method according to the invention includes associating one or more routing rules with connections between the components, wherein at least one of the routing rules is a minimum length routing rule; defining a first set of routing paths between the components while ignoring the minimum length routing rule; and modifying the first set of routing paths by enforcing the minimum length routing rule. Apparatus for defining circuit routing paths between components on a substrate includes a database and a routing engine that accepts the database as input. The database has an entry that includes a connection that is represented by a signal traveling between a start point and an end point on the substrate, and a set of routing rules associated with the connection. The set of routing rules includes at least a minimum length routing rule.

Abstract: A solder head is adapted to direct the flow of solder from a solder fountain. The solder head includes a wall forming a passage through which solder can flow upwardly and having an edge portion over which solder can flow from the passage. The solder head also includes a shield connected to the wall. The shield and the wall at least partially define an overflow passage through which solder can flow downwardly. The shield is configured to prevent contact between solder and an electronic component adjacent the solder head. Corresponding soldering systems and soldering methods are also provided.

Abstract: A stacked circuit assembly is provided for mounting memory modules in close proximity to an integrated circuit. The assembly includes an integrated circuit mounted on a printed circuit board and at least one stacked printed circuit board mounted in substantially parallel arrangement with respect to the printed circuit board on which the integrated circuit is mounted. A memory module is mounted for electrical connection on a surface of the stacked printed circuit board and an interface connector is mounted on facing surfaces of the printed circuit board and the stacked printed circuit board, thereby providing means for both mechanical and electrical connection between the boards. The integrated circuit and the memory module are mounted in parallel relationship with respect to one another for electrical interconnection through the boards and the interface connectors, thereby reducing the physical distance between the integrated circuit and the memory module.

Abstract: A process for plating gold on a multi-layered printed circuit board, having plated copper on an external surface. In one embodiment, first copper features for plating gold thereon and second copper features for plating copper thereon are selected on the external surface. The first copper features are internally connected to the second copper features. An etch-resist on the first and second copper features is deposited. The second copper features are masked, while a region containing the first copper features is exposed. Copper from the region is etched. The etch-resist on the first copper features is removed. Gold is then plated on the first copper features.

Abstract: An apparatus is provided for dissipating heat from a stacked circuit board assembly. The apparatus includes circuit boards that are oriented in spaced planes that extend substantially parallel to one another. A heat transfer means connected to the circuit boards transfers heat between the circuit boards. A heat dissipation means connected to at least one of the circuit boards dissipates at least a portion of the transferred heat.

Abstract: A mezzanine connector assembly includes connectors engageable to a mating connector assembly such as a motherboard. It includes a circuit card having a surface on which a connector is mounted as well as a mezzanine card having a surface on which another connector is mounted. A mounting member is attached for connection between the cards in order to establish relative positions of the card surfaces. The distance between the card surfaces is set at least in part by the distance between end portions of the mounting member. The distance between the card surfaces is independent of the thickness of the cards so that a variation of the thickness of the cards will not result in a variation of the distance between the card surfaces.