Abstract: The present invention discloses that a multi-laser cutting method and system, which is applied to a substrate to form a primary substrate having a pattern of rounded corners and a line, the throughput could be improved because CO2 laser cannot cut the round corner at the high speed, but the substrate strength could be kept due to the high cutting quality of the lines by CO2 laser. The poor quality of the cutting edges of the round corners will not affect on the substrate strength but the round corner cutting by the second laser unit will speed up the cutting process. The present invention applies the method by the 2 different laser machines to balance the throughput. Because at the same speed, for example 150 mm/sec, the cycle time per 1 substrate will be different due to the different length of the cutting lines.

Abstract: A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.

Abstract: The present invention discloses that a multi-laser cutting method and system, which is applied to a substrate to form a primary substrate having a pattern of rounded corners and a line, the throughput could be improved because CO2 laser cannot cut the round corner at the high speed, but the substrate strength could be kept due to the high cutting quality of the lines by CO2 laser. The poor quality of the cutting edges of the round corners will not affect on the substrate strength but the round corner cutting by the second laser unit will speed up the cutting process. The present invention applies the method by the 2 different laser machines to balance the throughput. Because at the same speed, for example 150 mm/sec, the cycle time per 1 substrate will be different due to the different length of the cutting lines.

Abstract: The present disclosures relates to a leakage sensor cable comprising a first conductive wire and a second conductive wire; a first conductive coating layer formed around the first conductive wire; a second conductive coating layer formed around the second conductive wire; a first permeable shell formed around the first conductive coating layer to form a first sensor cord; a second permeable shell formed around the second conductive coating layer to form a second sensor cord; wherein the first sensor cord and the second sensor cord are arranged together along their lengths to form a leakage sensor cable; and wherein the permeable shell is impregnated with electrolyte particles. The leakage sensor can be combined with a resistance-meter connected to the leakage sensor cable to form a leakage sensor assembly.

Abstract: The present disclosures relates to a leakage sensor cable comprising a first conductive wire and a second conductive wire; a first conductive coating layer formed around the first conductive wire; a second conductive coating layer formed around the second conductive wire; a first permeable shell formed around the first conductive coating layer to form a first sensor cord; a second permeable shell formed around the second conductive coating layer to form a second sensor cord; wherein the first sensor cord and the second sensor cord are arranged together along their lengths to form a leakage sensor cable; and wherein the permeable shell is impregnated with electrolyte particles. The leakage sensor can be combined with a resistance-meter connected to the leakage sensor cable to form a leakage sensor assembly.

Abstract: A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.

Abstract: A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.

Abstract: In accordance with the method of the invention, flat workpieces of brittle material, e.g., sapphire, glass ceramic, or glass, can be severed by inducing thermomechanical stresses, particularly along severing lines of the same direction, with a laser beam having a beam spot with asymmetric radiation density distribution on the workpiece by a relative movement in different directions in that a mirror-symmetric change in radiation density is brought about exclusively by changing the method parameters.