Abstract: A method for making a high voltage insulated gate field-effect transistor having an insulated gate field-effect device structure with a source and a drain comprises the steps of forming the drain with an extended well region having one or more buried layers of opposite conduction type sandwiched therein. The one or more buried layers create an associated plurality of parallel JFET conduction channels in the extended portion of the well region. A minimal number of processing steps are required to form the parallel JFET conduction channels which provide the HVFET with a low on-state resistance.

Abstract: A trench MOSFET that includes a charge carrier getter region to substantially deplete a plurality of body regions during an off-state of this MOSFET to produce a very low off-state leakage current. In a first class of embodiments, this charge carrier getter region is a thin layer of material, of opposite conductivity type to that of the body regions, and located between a plurality of gate regions and the body regions. In a second class of embodiments, the gate regions are of opposite conductivity type to the body regions to function as a charge carrier getter region as well as a gate region.

Abstract: In a method for constructing a semiconducting device, within a substrate of a first conductivity type there is formed a well of second conductivity type. Within the well, an extended drain region of a first conductivity type is formed. An insulating region over the extended drain region is formed. A gate region is formed on a surface of the substrate. A first side of the gate region is adjacent to a first end of the extended drain region. A drain region of the first conductivity type is formed. The drain region is in contact with a second end of the extended drain region. A source region is formed on a second side of the gate region.

Abstract: A bi-directional switch includes a well region of a first conductivity type placed within a substrate. A first region of second conductivity type is placed within the well. A second contact region of second conductivity type is placed within the well. A drift region of second conductivity is placed between the first contact and the second contact. The drift region is separated from the first contact by a first channel region and is separated from the second contact by a second channel region. A first gate region is placed over the first channel region and a second gate region over the second channel region.

Abstract: In a method for constructing a semiconducting device, within a substrate of a first conductivity type there is formed a well of second conductivity type. Within the well, an extended drain region of a first conductivity type is formed. An insulating region over the extended drain region is formed. A gate region is formed on a surface of the substrate. A first side of the gate region is adjacent to a first end of the extended drain region. A drain region of the first conductivity type is formed. The drain region is in contact with a second end of the extended drain region. A source region is formed on a second side of the gate region.

Abstract: A field effect transistor (FET), according to the present invention, comprises a source and drain pair of electrodes having non-uniform charge distributions between them, such as results from small radius tips, and has a gate and channel structure that exists only between points of the source and drain pair that have the less intense charge distributions, e.g., areas not involving any small radius tips. The gate and channel structure is such that, given the non-uniform charge distributions between the source and drain pair of electrodes, the electric field is reduced around the tip by eliminating the n-well junction near the source-drain fingertips.

Abstract: A high power MOSFET has a plurality of closely packed polygonal sources spaced from one another on one surface of a semiconductor body. An elongated gate electrode is exposed in the spacing between the polygonal sources and cooperates with two channels, one for each adjacent source electrode, to control conduction from the source electrode through the channel and then to a drain electrode on the opposite surface of the semiconductor body. The conductive region adjacent the channel and between adjacent sources is relatively highly conductive in the section of the channel adjacent to the surface containing the sources. The polygonal shaped source members are preferably hexagonal so that the distance between adjacent sources is relatively constant throughout the device. Each polygonal region has a relatively deep central portion and a shallow outer shelf portion. The shelf generally underlies an annular source region.

Abstract: A high voltage transistor includes a substrate of a first conductivity type. Within the substrate is a well region of a second conductivity type. A source region is within the substrate and adjoins the substrate surface. The source region includes a pocket of semiconductor material of the first conductivity type and a pocket of semiconductor material of the second conductivity type. A drain region is placed within the well region and adjoins the substrate surface. The drain region includes a pocket of semiconductor material of the first conductivity type and a pocket of semiconductor material of the second conductivity type. A source contact is electrically connected to the source region. A drain contact is electrically connected to the drain region. A top region of the first conductivity type is within the well region separate from the drain region and extends laterally from the drain region toward the source region.

Abstract: A high power MOSFET has a plurality of closely packed polygonal sources spaced from one another on one surface of a semiconductor body. An elongated gate electrode is exposed in the spacing between the polygonal sources and cooperates with two channels, one for each adjacent source electrode, to control conduction from the source electrode through the channel and them to a drain electrode on the opposite surface of the semiconductor body. The conductive region adjacent the channel and between adjacent sources is relatively highly conductive in the section of the channel adjacent to the surface containing the sources. The polygonal shaped source members are preferably hexagonal so that the distances between adjacent sources is relatively constant throughout the device. Each polygonal region has a relatively deep central portion and a shallow outer shelf portion. The shelf portion generally underlies an annular source region.

Abstract: A VLSI enhancement mode metal oxide semiconductor field effect transistor operative to be Normally-On except during those periods when a negative threshold voltage is applied to the gate electrode. A submicron MOSFET channel having relatively high resistivity substrate allows for source and drain PN junction with overlapping depletion regions to create an electric field that promotes a surface inversion layer in the channel for conduction between the source and drain in a Normally-On mode except upon application of a negative gate threshold that acts to invert the channel surface to a non-conducting mode.

Abstract: A fast recovery diode consists of a relatively thick wafer of monocrystalline silicon material which has a relatively deep central well therein. The central well defines a relatively thin intermediate base region for the diode which is surrounded by a relatively thick rim region which imparts physical strength to the wafer. The upper periphery of the rim is surrounded by a conductivity-type material which is opposite to that of the base, but is short-circuited by the contact on the well side of the wafer.