Abstract: A method and laser cutting system for cutting a secondary piece from a board is disclosed. A board is provided having a generally planar first and second surfaces separated by a predetermined distance or thickness and having a central plane located midway between the first and second surfaces. First and second lenses are arranged relative to the board with the focal point of the respective first and second lenses disposed intermediate the first and second surfaces of the board. Laser beams from a pair of lasers are propagated through the respective lenses with each laser beam converging at the focal point of its respective lens and cutting the workpiece from its respective surface toward the other surface. Ideally, the focused beams diverge sufficiently along the cutting path such that each laser beam reduces in intensity sufficiently so as not to cause harm to the opposing laser delivering systems or support structure.