Abstract: Described is a cooling lubricant for cold rolling aluminum, which includes a mineral oil-based or synthetic base oil and a polyalkylene glycol or a compound with a polyalkylene oxide structure. Further, the cooling lubricant is not water-soluble or miscible with water, and the cooling lubricant is substantially free of fatty acids and fatty alcohols.

Abstract: An aluminum foil is formed from an alloy of type AA1xxx, AA3xxx, and/or AA8xxx, which has a cold-solidified state and contains on its surface a rolling oil layer with a polyalkylene glycol or a compound containing a polyalkylene oxide structure. The aluminum foil has a thickness of 4 ?m to 100 ?m and can be easily coated with an electrode suspension for producing a battery film.

Abstract: A method for bonding wafers eutectically, including the steps: (a) providing a first wafer having a first bonding layer and a second wafer having a second bonding layer and a spacer; (b) bringing the first wafer in juxtaposition with the second wafer, the spacer resting against the first bonding layer; (c) pressing the first wafer and the second wafer together, until the first bonding layer and the second bonding layer abut, the spacer penetrating the first bonding layer; (d) bonding the first wafer to the second wafer eutectically, by forming a eutectic alloy of at least parts of the first bonding layer and the second bonding layer. Also described is a eutectically bonded wafer composite and a micromechanical device having such a eutectically bonded wafer composite.

Abstract: A method for producing a micromechanical component is provided, In a preparatory step, a substrate device of the micromechanical component and/or a cap device of the micromechanical component is patterned. In a first sub-step, a first pressure and/or a first chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a first cavern is formed, sealed from an environment of the micromechanical component, the first pressure prevailing in the first cavity and/or the first chemical composition being enclosed. In a second sub-step, a second pressure and/or a second chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a second cavity is formed, sealed from the environment of the micromechanical component and from the first cavity, the second pressure prevailing in the second cavity and/or the second chemical composition being enclosed.

Abstract: A method for bonding wafers eutectically, including the steps: (a) providing a first wafer having a first bonding layer and a second wafer having a second bonding layer and a spacer; (b) bringing the first wafer in juxtaposition with the second wafer, the spacer resting against the first bonding layer; (c) pressing the first wafer and the second wafer together, until the first bonding layer and the second bonding layer abut, the spacer penetrating the first bonding layer; (d) bonding the first wafer to the second wafer eutectically, by forming a eutectic alloy of at least parts of the first bonding layer and the second bonding layer. Also described is a eutectically bonded wafer composite and a micromechanical device having such a eutectically bonded wafer composite.

Abstract: A micromechanical component having a main extension plane is provided; the micromechanical component encloses a first cavern and a second cavern, and a first pressure prevails in the first cavern while a second pressure prevails in the second cavern, and a first layer of the micromechanical component, which extends essentially parallel to the main extension plane, projects into a second layer of the micromechanical component, which extends essentially parallel to the main extension plane, between the first cavern and the second cavern, essentially in a perpendicular direction to the main extension plane.

Abstract: A method for producing a micromechanical component is provided, In a preparatory step, a substrate device of the micromechanical component and/or a cap device of the micromechanical component is patterned. In a first sub-step, a first pressure and/or a first chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a first cavern is formed, sealed from an environment of the micromechanical component, the first pressure prevailing in the first cavity and/or the first chemical composition being enclosed. In a second sub-step, a second pressure and/or a second chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a second cavity is formed, sealed from the environment of the micromechanical component and from the first cavity, the second pressure prevailing in the second cavity and/or the second chemical composition being enclosed.

Abstract: A micromechanical component having a main extension plane is provided; the micromechanical component encloses a first cavern and a second cavern, and a first pressure prevails in the first cavern while a second pressure prevails in the second cavern, and a first layer of the micromechanical component, which extends essentially parallel to the main extension plane, projects into a second layer of the micromechanical component, which extends essentially parallel to the main extension plane, between the first cavern and the second cavern, essentially in a perpendicular direction to the main extension plane.

Abstract: A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided.

Abstract: A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided.

Abstract: A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided.

Abstract: An integrated component having a substrate, the substrate having a cavity which surrounds a mechanical structure. The cavity is filled by a fluid of a specific composition under a specific pressure, and the mechanical properties of the mechanical structure are influenced by the fluid.

Abstract: A micromechanical component having a substrate, having a cavity and having a cap that bounds the cavity. The cap has an access opening to the cavity. The cap has a diaphragm for closing the access opening.

Abstract: A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided.

Abstract: An integrated component having a substrate, the substrate having a cavity which surrounds a mechanical structure. The cavity is filled by a fluid of a specific composition under a specific pressure, and the mechanical properties of the mechanical structure are influenced by the fluid.

Abstract: A micromechanical component having a substrate, having a cavity and having a cap that bounds the cavity. The cap has an access opening to the cavity. The cap has a diaphragm for closing the access opening.

Abstract: A method for controlling a reluctance motor comprising a rotor (1) and a stator (10), the stator (10) having individual stator coils (22) and a predefined current flowing in the coils (22) according to loading of the motor, the method comprising the steps of applying different control methods depending on number of revolutions of the rotor (1), namely by prescribing a fixed rotary field with smaller number of revolutions.

Abstract: A method for nondestructive, three-dimensional detection of structural elements in structures, especially those made of concrete or similar materials, allows an area to be investigated to be scanned areawise using ultrasound and by recording high-frequency, travel-time-dependent data for the individual points. In an imaging method, the respective volume image of the area being investigated is determined. This method is improved in such fashion that the accuracy of the location of structures is improved. It is proposed that the area to be investigated be scanned by both ultrasound and radar and that a structural representation of the area investigated be performed both on the basis of data acquired using sound and on the basis of data acquired using radar, with these two representations being calibrated.

Abstract: A food processor with an agitator within a mixing vessel includes a drive mechanism for driving the agitator. Heat is applied to a lower region of the vessel during a holding of the vessel in a narrowly enclosing seat having a cylindrical wall region encircling a part of the vessel exclusive of a gap in the wall. An adjustment device enables enlargement and contraction of the wall region to facilitate emplacement and removal of the vessel with respect to the seat.