Abstract: A semiconductor wafer pod includes a measurement sensor configured within a housing. The sensor faces towards a surface of a wafer being accommodated in the pod. The pod can be connected to the conventional load-port of a semiconductor wafer manufacturing tool. Thereby, measurement data can be collected immediately after wafer processing without a need to transport the wafer. The invention enables the cost-effective development of tool-integrated metrology.

Abstract: A light source (1) emits a light beam (6) into a plasma chamber (5) onto a sensor (2), which provides a measurement of the thickness of a film layer depositing on its surface (58) by means of a reflection or re-emission of light through the depositing layer (10) back on a detector (3), which is preferably mounted outside the plasma chamber (5). The arrangement allows an online measurement of the growing thickness of the depositing layer (10) during, e.g., plasma CVD- or plasma etching processes in semiconductor manufacturing. Providing a mirror layer (53) with sensor (2) the reflected light intensity can be compared with the incident light beam (6) intensity leading to a thickness determination by means of known absorption or interference curves.

Abstract: The apparatus allows monitoring layer depositions in a process chamber. The apparatus has a light source, a sensor element, and at least one light detector. The sensor element is suitably configured in order to influence the intensity of the light beam measured by the detector by the thickness of the layer growing on the sensor element. The novel monitoring method for measuring the transmitted light intensity utilizes the apparatus. The sensor element has a continuous opening through which the intensity of the light is observed as a function of the opening grown over by the thickness of the growing layer.

Abstract: A metrology device is described which is couplable to a load port of a semiconductor product handling and/or processing tool. The tool encloses a mini-environmental atmosphere and has a load port table for supporting devices to be coupled to the load port. The metrology device contains a housing preserving an inner atmosphere, a coupling region for connecting the inner atmosphere to the mini-environmental atmosphere and a measuring device for measuring a property of a semiconductor product. The metrology device further has a support which is movable by a transport device and which is dimensioned such that the metrology device is self-supporting in a position appropriate for coupling the coupling region to the load port. The metrology device is thereby couplable to the load port without being supported by the load port table.

Abstract: A conveyor element (10) for conveying wafer receptacles between a conveyor (12) and a loading station (11) of a manufacturing system in the semiconductor industry has a lifting mechanism (13) to move the wafer receptacle from a first position of the conveyor (12) or the loading station (11) into a second position of the conveyor (12) or of the loading station (11) substantially in a vertical direction. Rollers (14) are provided to move the wafer receptacle from the second position of the conveyor (12) along a substantially horizontal direction to the second position of the loading station (11) or from the second position of the loading station (11) to the second position of the conveyor (12).

Abstract: A semiconductor wafer pod includes a measurement sensor configured within a housing. The sensor faces towards a surface of a wafer being accommodated in the pod. The pod can be connected to the conventional load-port of a semiconductor wafer manufacturing tool. Thereby, measurement data can be collected immediately after wafer processing without a need to transport the wafer. The invention enables the cost-effective development of tool-integrated metrology.

Abstract: A metrology device is described which is couplable to a load port of a semiconductor product handling and/or processing tool. The tool encloses a mini-environmental atmosphere and has a load port table for supporting devices to be coupled to the load port. The metrology device contains a housing preserving an inner atmosphere, a coupling region for connecting the inner atmosphere to the mini-environmental atmosphere and a measuring device for measuring a property of a semiconductor product. The metrology device further has a support which is movable by a transport device and which is dimensioned such that the metrology device is self-supporting in a position appropriate for coupling the coupling region to the load port. The metrology device is thereby couplable to the load port without being supported by the load port table.

Abstract: The apparatus allows monitoring layer depositions in a process chamber. The apparatus has a light source, a sensor element, and at least one light detector. The sensor element is suitably configured in order to influence the intensity of the light beam measured by the detector by the thickness of the layer growing on the sensor element. The novel monitoring method for measuring the transmitted light intensity utilizes the apparatus. The sensor element has a continuous opening through which the intensity of the light is observed as a function of the opening grown over by the thickness of the growing layer.

Abstract: A method for making an electrical contact for a vitreous carbon electrodes includes the steps of making a bore in an electrode blank of a cross-linked artificial resin forming the electrode blank into an electrode body. A solid or hollow pin, or a sleeve, composed of a biocompatible, refractory metal is introduced into the bore. If a pin is to be used, the bore is made to extend only partially into the electrode body, if a sleeve is used the bore extends completely through the body. The pin or sleeve has smaller dimensions than the bore; if a pin is used it projects from one side of the electrode body and if a sleeve is used it projects from both sides of the electrode body. The electrode blank is subjected to a pyrolysis, whereby the cross-linked artificial resin is converted into vitreous carbon and the electrode body shrinks onto the pin or sleeve.