Patents by Inventor Vorajit Suwannaset

Vorajit Suwannaset has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame land grid array with routing connector trace under unit
    Patent number: 8685794
    Abstract: A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: April 1, 2014
    Assignee: UTAC Thai Limited
    Inventors: Somchai Nondhasitthichai, Saravuth Sirinorakul, Kasemsan Kongthaworn, Vorajit Suwannaset
  • Lead frame ball grid array with traces under die
    Patent number: 8652879
    Abstract: A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: February 18, 2014
    Assignee: UTAC Thai Limited
    Inventors: Somchai Nondhasitthichai, Saravuth Sirinorakul, Kasemsan Kongthaworn, Vorajit Suwannaset
  • LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT
    Publication number: 20130337609
    Abstract: A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
    Type: Application
    Filed: May 29, 2013
    Publication date: December 19, 2013
    Applicant: UTAC Thai Limited
    Inventors: Somchai Nondhasitthichai, Saravuth Sirinorakul, Kasemsan Kongthaworn, Vorajit Suwannaset
  • LEAD FRAME BALL GRID ARRAY WITH TRACES UNDER DIE
    Publication number: 20130280866
    Abstract: A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
    Type: Application
    Filed: May 29, 2013
    Publication date: October 24, 2013
    Inventors: Somchai Nondhasitthichai, Saravuth Sirinorakul, Kasemsan Kongthaworn, Vorajit Suwannaset
  • Lead frame ball grid array with traces under die
    Patent number: 8492906
    Abstract: A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
    Type: Grant
    Filed: April 5, 2011
    Date of Patent: July 23, 2013
    Assignee: UTAC Thai Limited
    Inventors: Somchai Nondhasitthichai, Saravuth Sirinorakul, Kasemsan Kongthaworn, Vorajit Suwannaset
  • Lead frame land grid array with routing connector trace under unit
    Patent number: 8487451
    Abstract: A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: July 16, 2013
    Assignee: UTAC Thai Limited
    Inventors: Somchai Nondhasitthichai, Saravuth Sirinorakul, Kasemsan Kongthaworn, Vorajit Suwannaset
  • LEAD FRAME BALL GRID ARRAY WITH TRACES UNDER DIE
    Publication number: 20110198752
    Abstract: A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
    Type: Application
    Filed: April 5, 2011
    Publication date: August 18, 2011
    Applicant: UTAC THAI LIMITED
    Inventors: Somchai Nondhasitthichai, Saravuth Sirinorakul, Kasemsan Kongthaworn, Vorajit Suwannaset
  • LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT
    Publication number: 20110147931
    Abstract: A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
    Type: Application
    Filed: March 3, 2011
    Publication date: June 23, 2011
    Applicant: UTAC THAI LIMITED
    Inventors: Somchai Nondhasitthichai, Saravuth Sirinorakul, Kasemsan Kongthaworn, Vorajit Suwannaset