Patents by Inventor Vytautas Sabonis

Vytautas Sabonis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING MODIFIED PULSE BURST PROFILES
    Publication number: 20210379695
    Abstract: A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration Tbd of 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength ?, a spot size wo, and a Rayleigh range ZR that is greater than F D ? ? ? w o 2 ? , where FD is a dimensionless divergence factor comprising a value of 10 or greater.
    Type: Application
    Filed: May 25, 2021
    Publication date: December 9, 2021
    Inventors: Valdemaras Juzumas, Reinhard Moritz Malchus, Sasha Marjanovic, Garrett Andrew Piech, Vytautas Sabonis, Ralf Joachim Terbrueggen
  • High speed laser processing of transparent materials
    Patent number: 9850159
    Abstract: A method and system for laser pre-cutting a layered material (31) with a laser beam (14) is disclosed. The layered material (31) comprises at least one tensile stress layer (TSL), at least one compression stress layer (CSL1, CSL2), and at least one interface region (IR1, IR2) between the at least one tensile stress layer (TSL) and the at least one compression stress layer (CSL1, CSL2) and is transparent to allow propagation of the laser beam (14) through the layered material (31).
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: December 26, 2017
    Assignee: Corning Incorporated
    Inventors: Manoj K. Bhuyan, Ottavia Jedrkiewicz, Paolo Di Trapani, Vytautas Sabonis, Mindaugas Mikutis
  • High Speed Laser Processing of Transparent Materials
    Publication number: 20150299018
    Abstract: A method and system for laser pre-cutting a layered material (31) with a laser beam (14) is disclosed. The layered material (31) comprises at least one tensile stress layer (TSL), at least one compression stress layer (CSL1, CSL2), and at least one interface region (IR1, IR2) between the at least one tensile stress layer (TSL) and the at least one compression stress layer (CSL1, CSL2) and is transparent to allow propagation of the laser beam (14) through the layered material (31).
    Type: Application
    Filed: November 20, 2013
    Publication date: October 22, 2015
    Applicant: UAB ALTECHNA R&D
    Inventors: Manoj K. Bhuyan, Ottavia Jedrkiewicz, Paolo Di Trapani, Vytautas Sabonis, Mindaugas Mikutis