Abstract: A thermal transfer device (20) comprises a housing having a base assembly (23) and a cover (22). The base assembly (23) comprises a thermal transfer base (25) and a fluid-porous, thermally conductive mesh structure (26). The thermal transfer base (25) and the cover (22) cooperate to define a thermal transfer chamber (24). The thermally conductive mesh structure (26) is configured and positioned in the chamber (24) to provide a tortuous, thermal conduction path for fluid (e.g., a coolant) which turbulently travels from an inlet (40) of the chamber to one or more outlets (42) of the chamber (24). In some embodiments, the mesh structure comprises wires which are fused by diffusion bonding into a mesh, in other embodiments the mesh comprises a metallic wool. Within the chamber the mesh structure (26) can have various configurations for providing an exposure interface between fluid pumped through the chamber and the mesh.

Abstract: Thin chamber diaphragm-operated fluid handling devices, including thin chamber pumps and thin chamber valves, facilitate device compactness and, in some configurations, self-priming. Diaphragm actuators of the thin chamber devices either comprise or are driven by piezoelectric materials. The thinness of the chamber, in a direction parallel to diaphragm movement, is in some embodiments determined by the size of a perimeter seal member which sits on a floor of a device cavity, and upon which a perimeter (e.g. circumferential or peripheral portion) of the diaphragm actuator sits. The diaphragm actuator is typically retained in a device body between the floor seal member and another seal member between which the perimeter of the actuator is sandwiched. The devices have an input port and an output port.

Abstract: A method for making a piezoelectric actuator comprises coating at least one of a first surface and a second surface of a piezoelectric element with a polyimide adhesive. The piezoelectric element is then heated to dry the adhesive. Afterwards, the piezoelectric element is inserted between a first metallic layer and a second metallic layer to form an assembly. The assembly is placed in a press. While the assembly is in the press, the polyimide adhesive is cured at a curing temperature which does not depole the piezoelectric element, thereby bonding the piezoelectric element between the first metallic layer and the second metallic layer.

Abstract: A method of manufacturing piezoelectric actuators (14) is disclosed along with a minimum diaphragm pump (10) using the actuators. The object was an actuator which could be used in miniature diaphragm pumps and other applications and which would be smaller in size and simpler to manufacture than prior art actuators, yet would provide forces and displacements an order of magnitude higher than any previously known devices of similar size. The pump (10) incorporates the new actuator along with a novel one-way valve (200) and a small driver circuit (18). The pump is of direct application in the liquid cooling systems of small computers, and in other fluid systems.

Abstract: Thin chamber diaphragm-operated fluid handling devices, including thin chamber pumps and thin chamber valves, facilitate device compactness and, in some configurations, self-priming. Diaphragm actuators of the thin chamber devices either comprise or are driven by piezoelectric materials. The thinness of the chamber, in a direction parallel to diaphragm movement, is in some embodiments determined by the size of a perimeter seal member which sits on a floor of a device cavity, and upon which a perimeter (e.g. circumferential or peripheral portion) of the diaphragm actuator sits. The diaphragm actuator is typically retained in a device body between the floor seal member and another seal member between which the perimeter of the actuator is sandwiched. The devices have an input port and an output port.