Patents by Inventor Wah Pheng Chua

Wah Pheng Chua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130241587
    Abstract: A wafer stage and a method of supporting a wafer for inspection. the wafer stage comprises a platform for supporting a wafer such that a backside of the wafer is suspended above a cavity of the platform; and a support structure disposed substantially within the cavity for supporting a portion of the wafer; wherein the wafer stage is adapted for relative movement of the platform with respect to the support structure for alignment of the wafer with respect to a probe.
    Type: Application
    Filed: May 6, 2013
    Publication date: September 19, 2013
    Applicant: SEMICAPS PTE LTD
    Inventors: Choon Meng Chua, Lian Ser Koh, Wah Pheng Chua, Chee Hong Jacob Phang, Soon Huat Tan
  • Patent number: 8436631
    Abstract: A wafer stage and a method of supporting a wafer for inspection. the wafer stage comprises a platform for supporting a wafer such that a backside of the wafer is suspended above a cavity of the platform; and a support structure disposed substantially within the cavity for supporting a portion of the wafer; wherein the wafer stage is adapted for relative movement of the platform with respect to the support structure for alignment of the wafer with respect to a probe.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: May 7, 2013
    Assignee: Semicaps Pte Ltd
    Inventors: Choon Meng Chua, Lian Ser Koh, Wah Pheng Chua, Chee Hong Jacob Phang, Soon Huat Tan
  • Patent number: 8278959
    Abstract: A method and system for measuring laser induced phenomena changes of at least one of a resistance, a capacitance and an inductance in a semiconductor device. The method comprises applying a biasing voltage from an emitter-follower circuit to a device under test (DUT); inducing said changes in the DUT; and measuring a voltage change in a collector portion of the emitter-follower circuit as a measure for said changes.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: October 2, 2012
    Assignee: Semicaps Pte Ltd
    Inventors: Choon Meng Chua, Lian Ser Koh, Soon Huat Tan, Wah Pheng Chua, Chee Hong Jacob Phang
  • Patent number: 8072699
    Abstract: A solid immersion lens optics assembly, a test station for probing and testing of integrated circuits on a semiconductor wafer, and a method of landing a SIL on an object. The optics assembly comprises an objective lens housing for receiving an objective lens, and a solid immersion lens (SIL) housing for mounting an SIL and adapted for connection to the objective lens housing; wherein a peripheral wall of the SIL housing comprises an integrated spring section adapted to provide a biased support for the SIL.
    Type: Grant
    Filed: June 17, 2009
    Date of Patent: December 6, 2011
    Assignee: Semicaps Pte Ltd
    Inventors: Lian Ser Koh, Choon Meng Chua, Wah Pheng Chua, Chee Hong Jacob Phang, Soon Huat Tan
  • Publication number: 20100321678
    Abstract: A solid immersion lens optics assembly, a test station for probing and testing of integrated circuits on a semiconductor wafer, and a method of landing a SIL on an object. The optics assembly comprises an objective lens housing for receiving an objective lens, and a solid immersion lens (SIL) housing for mounting an SIL and adapted for connection to the objective lens housing; wherein a peripheral wall of the SIL housing comprises an integrated spring section adapted to provide a biased support for the SIL.
    Type: Application
    Filed: June 17, 2009
    Publication date: December 23, 2010
    Applicant: SEMICAPS PTE LTD
    Inventors: Lian Ser Koh, Choon Meng Chua, Wah Pheng Chua, Chee Hong Jacob Phang, Soon Huat Tan
  • Publication number: 20100315617
    Abstract: A wafer stage and a method of supporting a wafer for inspection. the wafer stage comprises a platform for supporting a wafer such that a backside of the wafer is suspended above a cavity of the platform; and a support structure disposed substantially within the cavity for supporting a portion of the wafer; wherein the wafer stage is adapted for relative movement of the platform with respect to the support structure for alignment of the wafer with respect to a probe.
    Type: Application
    Filed: June 12, 2009
    Publication date: December 16, 2010
    Applicant: SEMICAPS PTE LTD
    Inventors: Choon Meng Chua, Lian Ser Koh, Wah Pheng Chua, Chee Hong Jacob Phang, Soon Huat Tan
  • Publication number: 20100156451
    Abstract: A method and system for measuring laser induced phenomena changes of at least one of a resistance, a capacitance and an inductance in a semiconductor device. The method comprises applying a biasing voltage from an emitter-follower circuit to a device under test (DUT); inducing said changes in the DUT; and measuring a voltage change in a collector portion of the emitter-follower circuit as a measure for said changes.
    Type: Application
    Filed: February 18, 2009
    Publication date: June 24, 2010
    Applicant: SEMICAPS Pte Ltd
    Inventors: Choon Meng Chua, Lian Ser Koh, Soon Huat Tan, Wah Pheng Chua, Chee Hong Jacob Phang