Patents by Inventor Wai Kok
Wai Kok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10450295Abstract: This invention relates to methods of reversing and inhibiting liver fibrosis and hepatitis using a small indolinone molecule Hesperadin and related compounds. Methods of identifying such agents and using them to inhibit the expression of collagens and ECM proteins including MMPs and TIMPs in purified hepatic stellate cells are provided. In vivo data of Hesperadin in inhibiting induced collagen production are presented. This method of specifically targeting drugs to hepatic stellate cells in vivo, provides a novel therapy for liver diseases.Type: GrantFiled: August 9, 2013Date of Patent: October 22, 2019Assignee: Acclaim BioMed USA LLCInventors: Kenneth Ka-Ho Lee, Stanton Hon-Lung Kok, Tsz-Wai Kok, Sing-Wan Wong, John Yeuk-Hon Chan
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Publication number: 20150045395Abstract: This invention relates to methods of reversing and inhibiting liver fibrosis and hepatitis using a small indolinone molecule Hesperadin and related compounds. Methods of identifying such agents and using them to inhibit the expression of collagens and ECM proteins including MMPs and TIMPs in purified hepatic stellate cells are provided. In vivo data of Hesperadin in inhibiting induced collagen production are presented. This method of specifically targeting drugs to hepatic stellate cells in vivo, provides a novel therapy for liver diseases.Type: ApplicationFiled: August 9, 2013Publication date: February 12, 2015Applicant: Acclaim BioMed USA LLCInventors: Kenneth Ka-Ho Lee, Stanton Hon-Lung Kok, Tsz-Wai Kok, Sing-Wan Wong, John Yeuk-Hon Chan
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Patent number: 8569850Abstract: A sensor for acoustic applications such as a silicone microphone is provided containing a backplate provided with apertures and a flexible diaphragm formed from a silicon on insulator (SOI) wafer which includes a layer of heavily doped silicon, a layer of silicon and an intermediate oxide layer that is connected to, and insulated from the backplate. The arrangement of the diaphragm in relation to the rest of the sensor and the sensor location, being mounted over the aperture in a PCB, reduces the acoustic signal pathway which allows the sensor to be both thinner and more importantly, enables there to be a greater back volume.Type: GrantFiled: October 10, 2007Date of Patent: October 29, 2013Assignee: Sensfab Pte LtdInventors: Kitt-Wai Kok, Kok Meng Ong, Kathirgamasundaram Sooriakumar, Bryan Keith Patmon
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Patent number: 8111046Abstract: A constant voltage/constant power AC adapter converts AC voltage to DC voltage to provide power to a plurality of loads. The adapter's output characteristic is approximately a constant voltage as long as the output current draw by the loads is less than a threshold (e.g., a safety threshold for the adapter). If, however, the power draw on the adapter is such that the output current exceeds the threshold, the adapter then decreases its output voltage to maintain the power draw at a safe level. One or more loads that draw power from the adapter may be adapted to detect a drop in the AC adapter's output voltage. When such a voltage drop is detected, that information tells the load that too much current is being drawn from the adapter and that the load should throttle back (e.g., reducing battery charge current, CPU clock frequency, display brightness, etc.).Type: GrantFiled: July 12, 2005Date of Patent: February 7, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Thomas P. Sawyers, James Mun Wai Kok
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Patent number: 8098870Abstract: A silicon microphone comprising a backplate of electrically conductive or semi-conductive material comprising a rigid aperture area and a surrounding area, a diaphragm of electrically conductive or semi-conductive material comprising a flexible member that extends over the aperture area and a surrounding area that is at least partially connected to, and insulated from, the surrounding area of the backplate, the aperture area of the backplate and flexible member of the diaphragm forming two parallel plates of a capacitor spaced apart by a cavity, a bond pad formed on the surrounding area of the diaphragm, a bond pad formed on the surrounding area of the backplate, a channel formed in the diaphragm surrounding the bond pad formed on the surrounding area of the backplate, at least one air channel formed in the surrounding area of the diaphragm and open into the cavity between the flexible member and the aperture area of the backplate, and at least one vent through the surrounding area of the diaphragm connectedType: GrantFiled: May 15, 2006Date of Patent: January 17, 2012Assignee: Sensfab Pte LtdInventors: Kitt-Wai Kok, Kok Meng Ong, Kathirgamasunda Sooriakumar, Bryan Keith Patmon
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Publication number: 20100187646Abstract: A sensor including: a backplate of electrically conductive or semi-conductive material, the backplate including a plurality of backplate holes; a diaphragm of electrically conductive or semi-conductive material that is connected to, and insulated from the backplate, the diaphragm defining a flexible member and an air gap associated with the flexible member; a bond pad formed on an area of the backplate surrounding the cavity; and a bond pad formed on an area of the diaphragm surrounding the air gap; wherein the flexible member and air gap defined by the diaphragm extend beneath the plurality of backplate holes.Type: ApplicationFiled: October 10, 2007Publication date: July 29, 2010Applicant: Mems Technology BHDInventors: Kitt-Wai Kok, Kok Meng Ong, Kathirgamasundaram Sooriakumar, Bryan Keith Patmon
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Publication number: 20090229471Abstract: The present invention relates to a coffee maker and more specifically to a two cups automatic coffee maker with flow control in a precise manner, particular to a one cup coffee in desired volume, a two reservoirs type design to avoid overfill and able to have two different tastes, with a manual reset thermostat controls to turn off the heaters while brewing cycle is completed.Type: ApplicationFiled: March 17, 2008Publication date: September 17, 2009Inventors: Man Fai Lun, Chi Wai Kok
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Publication number: 20080185669Abstract: A silicon microphone includes a diaphragm that is able to flex over an aperture, an area allowing electrical connection to the diaphragm, a backplate parallel to and spaced apart from the diaphragm and extending over the aperture, the backplate being fixed, the backplate and diaphragm forming the parallel plates of a capacitor, the backplate and diaphragm being attached to and insulated from each other around at least a portion the boundary of the aperture, and a backplate support attached to the backplate around the boundary of the aperture, the backplate support not forming an electrical connection with the backplate.Type: ApplicationFiled: October 18, 2005Publication date: August 7, 2008Applicant: SENSFAB PTE, LTD.Inventors: Kitt-Wai Kok, Kok Meng Ong, Kathirgamasundaram Sooriakumar, Bryan Keith Patmon
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Publication number: 20080175417Abstract: A silicon microphone comprising a backplate of electrically conductive or semi-conductive material comprising a rigid aperture area and a surrounding area, a diaphragm of electrically conductive or semi-conductive material comprising a flexible member that extends over the aperture area and a surrounding area that is at least partially connected to, and insulated from, the surrounding area of the backplate, the aperture area of the backplate and flexible member of the diaphragm forming two parallel plates of a capacitor spaced apart by a cavity, a bond pad formed on the surrounding area of the diaphragm, a bond pad formed on the surrounding area of the backplate, a channel formed in the diaphragm surrounding the bond pad formed on the surrounding area of the backplate, at least one air channel formed in the surrounding area of the diaphragm and open into the cavity between the flexible member and the aperture area of the backplate, and at least one vent through the surrounding area of the diaphragm connectedType: ApplicationFiled: May 15, 2006Publication date: July 24, 2008Applicant: Sensfab Pte Ltd.Inventors: Kitt-Wai Kok, Kok Meng Ong, Kathirgamasundaram Sooriakumar, Bryan Keith Patmon
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Patent number: 7361523Abstract: The invention comprises a method of fabricating a three-axis accelerometer. A first wafer having a first and a second major surface provided with etching at least two cavities in the first major surface of the first wafer and patterning metal onto the first major surface of the first wafer to form electrical connections for a third accelerometer. A second wafer, etching a portion of a first major surface of the second wafer and bonding the first major surface of the first wafer to the first major surface of the second wafer. The etching and bonding of the surfaces deposit and pattern metallizating, and deposit and pattern a masking layer on the second major surface of the second wafer, defining the shape of a first, a second and the third accelerometer. The first and second accelerometers are formed over the cavities etched in the first major surface of the first wafer.Type: GrantFiled: August 11, 2004Date of Patent: April 22, 2008Assignee: Sensfab Pte LtdInventors: Kathirgamasundaram Sooriakumar, Kitt-Wai Kok, Bryan Keith Patmon
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Patent number: 7247248Abstract: The invention relates to a method for forming silicon atomic force microscope tips. The method includes the steps of depositing a masking layer onto a first layer of doped silicon so that some square or rectangular areas of the first layer of doped silicon are not covered by the masking layer, etching pyramidal apertures in the first layer of doped silicon, removing the masking layer, depositing a second layer of doped silicon onto the first layer of doped silicon, the second layer of doped silicon being oppositely doped to the first layer of doped silicon and etching away the first layer of doped silicon. Further steps may be added to form the atomic force microscope tips at the end of cantilevers.Type: GrantFiled: May 20, 2003Date of Patent: July 24, 2007Assignee: Sensfab Pte LtdInventors: Lay Har Angeline Tee, Kim Pong Daniel Chir, Kitt-Wai Kok, Kathirgamasundaram Sooriakumar, Bryan Keith Patmon
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Publication number: 20070065968Abstract: A silicon microphone is formed using the steps of providing a first wafer including a layer of heavily doped silicon, a layer of silicon and an intermediate layer of oxide between the two silicon layers. The first wafer has a first major surface on one surface of the layer of heavily doped silicon and a second major surface on the layer of silicon. A second wafer of silicon has a first major surface and a second major surface. A layer of oxide is formed on at least the first major surfaces of the first and second wafers. A cavity is etched through the oxide layer on the first major surface of the first wafer and into the layer of heavily doped silicon. The first major surface of the first wafer is bonded to the first major surface of the second wafer. A metal layer is formed on the second major surface of the second wafer. Acoustic holes are patterned and etched in the metal layer and in the second major surface of the second wafer.Type: ApplicationFiled: May 26, 2004Publication date: March 22, 2007Inventors: Kit-Wai Kok, Kok Ong, Kathirgamasundaram Sooriakumar, Bryan Patmon
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Publication number: 20070059857Abstract: The invention comprises a method of fabricating a three-axis accelerometer. A first wafer having a first and a second major surface provided with etching at least two cavities in the first major surface of the first wafer and patterning metal onto the first major surface of the first wafer to form electrical connections for a third accelerometer. A second wafer, etching a portion of a first major surface of the second wafer and bonding the first major surface of the first wafer to the first major surface of the second wafer. The etching and bonding of the surfaces deposit and pattern metallizating, and deposit and pattern a masking layer on the second major surface of the second wafer, defining the shape of a first, a second and the third accelerometer. The first and second accelerometers are formed over the cavities etched in the first major surface of the first wafer.Type: ApplicationFiled: August 11, 2004Publication date: March 15, 2007Inventors: Kathirgamasundaram Sooriakumar, Kitt-Wai Kok, Bryan Patmon
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Publication number: 20050242786Abstract: A constant voltage/constant power AC adapter converts AC voltage to DC voltage to provide power to a plurality of loads. The adapter's output characteristic is approximately a constant voltage as long as the output current draw by the loads is less than a threshold (e.g., a safety threshold for the adapter). If, however, the power draw on the adapter is such that the output current exceeds the threshold, the adapter then decreases its output voltage to maintain the power draw at a safe level. One or more loads that draw power from the adapter may be adapted to detect a drop in the AC adapter's output voltage. When such a voltage drop is detected, that information tells the load that too much current is being drawn from the adapter and that the load should throttle back (e.g., reducing battery charge current, CPU clock frequency, display brightness, etc.).Type: ApplicationFiled: July 12, 2005Publication date: November 3, 2005Applicant: Hewlett-Packard Development Company, L.P.Inventors: Thomas Sawyers, James Wai Kok
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Patent number: 6950950Abstract: A constant voltage/constant power AC adapter converts AC voltage to DC voltage to provide power to a plurality of loads. The adapter's output characteristic is approximately a constant voltage as long as the output current draw by the loads is less than a threshold (e.g. a safety threshold for the adapter). If, however, the power draw on the adapter is such that the output current exceeds the threshold, the adapter then decreases its output voltage to maintain the power draw at a safe level. One or more loads that draw power from the adapter may be adapted to detect a drop in the AC adapter's output voltage. When such a voltage drop is detected, that information tells the load that too much current is being drawn from the adapter and that the load should throttle back (e.g., reducing battery charge current, CPU clock frequency, display brightness, etc.).Type: GrantFiled: December 28, 2001Date of Patent: September 27, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Thomas P. Sawyers, James Mun Wai Kok
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Publication number: 20050161430Abstract: The invention relates to a method for forming silicon atomic force microscope tips. The method includes the steps of depositing a masking layer onto a first layer of doped silicon so that some square or rectangular areas of the first layer of doped silicon are not covered by the masking layer, etching pyramidal apertures in the first layer of doped silicon, removing the masking layer, depositing a second layer of doped silicon onto the first layer of doped silicon, the second layer of doped silicon being oppositely doped to the first layer of doped silicon and etching away the first layer of doped silicon. Further steps may be added to form the atomic force microscope tips at the end of cantilevers.Type: ApplicationFiled: May 20, 2003Publication date: July 28, 2005Inventors: Tee Angeline, Kim Chir, Kitt-Wai Kok, Kathirgamasundaram Sooriakumar, Bryan Patmon
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Publication number: 20050151653Abstract: There is provided a trap for trapping animals including: at least one radio frequency (RF) device closely associated with the trap for the recording of activation data of the trap, at least one animal containment unit incorporated with the trap, and at least one sensor for detecting activation of the trap and passing an activation signal to the RF device. Preferably, the RF device is for transmitting RF signals to at least one receiving unit for enabling the real-time determination of a status of the trap.Type: ApplicationFiled: July 23, 2004Publication date: July 14, 2005Inventors: Wee Chan, Fook Kuan, Wai Kok
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Patent number: 6668325Abstract: The present invention provides obfuscation techniques for enhancing software security. In one embodiment, a method for obfuscation techniques for enhancing software security includes selecting a subset of code (e.g., compiled source code of an application) to obfuscate, and obfuscating the selected subset of the code. The obfuscating includes applying an obfuscating transformation to the selected subset of the code. The transformed code can be weakly equivalent to the untransformed code. The applied transformation can be selected based on a desired level of security (e.g., resistance to reverse engineering). The applied transformation can include a control transformation that can be creating using opaque constructs, which can be constructed using aliasing and concurrency techniques. Accordingly, the code can be obfuscated for enhanced software security based on a desired level of obfuscation (e.g., based on a desired potency, resilience, and cost).Type: GrantFiled: June 9, 1998Date of Patent: December 23, 2003Assignee: InterTrust TechnologiesInventors: Christian Sven Collberg, Clark David Thomborson, Douglas Wai Kok Low
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Publication number: 20030126474Abstract: A constant voltage/constant power AC adapter converts AC voltage to DC voltage to provide power to a plurality of loads. The adapter's output characteristic is approximately a constant voltage as long as the output current draw by the loads is less than a threshold (e.g. a safety threshold for the adapter). If, however, the power draw on the adapter is such that the output current exceeds the threshold, the adapter then decreases its output voltage to maintain the power draw at a safe level. One or more loads that draw power from the adapter may be adapted to detect a drop in the AC adapter's output voltage. When such a voltage drop is detected, that information tells the load that too much current is being drawn from the adapter and that the load should throttle back (e.g., reducing battery charge current, CPU clock frequency, display brightness, etc.).Type: ApplicationFiled: December 28, 2001Publication date: July 3, 2003Inventors: Thomas P. Sawyers, James Mun Wai Kok