Abstract: Embodiments improve software defect diagnosis. Analytic focus is automatically walked back from an initial symptomatic diagnostic context to a previous diagnostic context that is closer to underlying causes. Diagnosis may obtain diagnostic artifacts such as traces or dumps, extract diagnostic context, decompile executables, lookup likely causes based on symptoms, scan logs, and submit diagnostic context to software analysis services. An analysis service may perform static analysis, security testing, symptom-pair lookups, or antipattern scanning, for example, and may include a neural network or other machine learning model, for example. Root causes are culled from analysis results and identified to a software developer. Changes to mitigate the defect's impact are suggested in some cases. Thus, the software developer receives debugging leads without manually navigating through all the tool interfaces or unrelated details of diagnostic contexts.

Abstract: A system and method for assessing deterioration of a metallurgical runner using acoustic emissions. The system may be referred to as an acoustic emission runner integrity system (AERIS). The system comprises acoustic emission sensors mounted on the runner. At least some of the sensors can detect acoustic emission signals in the runner. The sensors may be able to emit acoustic emission signals into the runner. The sensors are in communication with a controller. The controller is configured to one or more of identify and monitor deterioration of the runner based on the acoustic emission signals of the sensors. The method comprises affixing AE sensors to the runner, detecting AE signals with the sensors, and assessing deterioration of the runner based on the AE signals of the sensors.

Abstract: A safety system for a load carrying machine including: a controller, a location sensing arrangement in electronic communication with the processor, the location sensing arrangement configured to determine a location parameter of a load, a monitoring arrangement, the controller configured to receive the location parameter and determine a projected area of the load and control the monitoring arrangement to focus on the projected area to monitor the projected area.

Abstract: A system and a method for a security strap device including a strap; a lock, the lock comprising a locking mechanism; a fixed portion of the strap being secured inside the lock; a free end of the strap insertable into the lock to form a loop in the strap, the lock is configured to lock a portion of the strap to form the loop in the strap, wherein; the locking mechanism comprises a plurality of latches moveable between a locking position and an unlocking position; the plurality of latches engaging one or more locking slots within the lock when in the locking position to the lock the strap within the lock; and wherein the latches are all simultaneously biased toward the locked position and the latches are required to be simultaneously displaced to an unlocking position to unlock the strap.

Abstract: A system and a method for a security strap device including a strap; a lock, the lock comprising a locking mechanism; a fixed portion of the strap being secured inside the lock; a free end of the strap insertable into the lock to form a loop in the strap, the lock is configured to lock a portion of the strap to form the loop in the strap, wherein; the locking mechanism comprises a plurality of latches moveable between a locking position and an unlocking position; the plurality of latches engaging one or more locking slots within the lock when in the locking position to the lock the strap within the lock; and wherein the latches are all simultaneously biased toward the locked position and the latches are required to be simultaneously displaced to an unlocking position to unlock the strap.

Abstract: A safety system for a load carrying machine comprising: a controller, a location sensing arrangement in electronic communication with the processor, the location sensing arrangement configured to determine a location parameter of a load, a monitoring arrangement, the controller configured to receive the location parameter and determine a projected area of the load and control the monitoring arrangement to focus on the projected area to monitor the projected area.

Abstract: A printed circuit board includes a body, a first conductive pattern layer disposed on a first surface of the body, and a second conductive pattern layer disposed on a second surface of the body. The first conductive pattern layer and the second conductive pattern layer form a capacitor. The present disclosure further provides an motor having the printed circuit board.

Abstract: Described is a multiple-camera system and process for disambiguating between multiple users and identifying which of the multiple users performed an event. For example, when an event is detected, user patterns near the location of the event are determined, along with touch points at the location of the event. User pattern orientation and/or arm trajectories between the event location and the user patterns may be determined and processed to disambiguate between multiple users and determine which user pattern is involved in the event.

Abstract: A brush assembly includes a circuit board, at least two brushes, power connecting terminals for connecting with an external power supply, and a power supply branch circuit connected in series between a corresponding one of the power connecting terminals and a corresponding one of the brushes. The brush assembly further comprises an EMI suppressor connected between the power supply branch circuit and ground. The EMI suppressor is an axial capacitor formed by a conductor core, a cover, and a filling medium. The cover is attached around the conductor core, and the filling medium is filled between the conductor core and the cover. A motor utilizing the brush assembly is also provided.

Abstract: An IP network topology update system may update IP network topology in near real-time and on-demand with minimum overheads. It identifies likely impact area (e.g., layer 2 or layer 3), objects (e.g., link or node such a device), and timing (e.g., what topology objects located where or when the topology update process should be performed) in the IP Layer 3 network and its underlying SDN Layer 2 network under virtualized networking infrastructure as candidates of impacts for topology update.

Abstract: An end cap assembly for an electric motor has a brush assembly, a circuit board, an inductor and a grounded metal element. The brush assembly has a plurality of brushes. The circuit board is fixed relative to the brush assembly. The inductor is electrically connected to the circuit board. The grounded metal element is positioned between the brushes and the inductor to absorb high frequency electromagnetic radiation transmitted from the brushes to the inductor.

Abstract: An IP network topology update system may update IP network topology in near real-time and on-demand with minimum overheads. It identifies likely impact area (e.g., layer 2 or layer 3), objects (e.g., link or node such a device), and timing (e.g.

Abstract: Various distribution side controllers for power systems are disclosed. Power systems includes a power generation subsystem and one or more distribution networks. Power systems may also include a transmission system coupled between the power generation subsystem and the distribution networks. The distribution side controller monitors the operation and availability of power from distributed power sources coupled to its respective distribution network, as well as load demand from loads on the distribution network. The distribution side controller may also monitor conditions on the distribution network to identify a power imbalance within the distribution network. The distribution side controller responds to such imbalances to reduce their effect on the power system as a whole. In some embodiments, multiple distribution side controllers for various distribution networks may cooperate to provide efficient power generation for the whole power systems.

Abstract: A power module includes a substrate, a first sub-module and a second sub-module. Each of the first sub-module and the second sub-module includes a semiconductor switch and a diode. The first sub-module is formed as the high-voltage-side switching element. The second sub-module is formed as the low-voltage-side switching element. The plural electrodes of the high-voltage-side switching element and the plural electrodes of the low-voltage-side switching element are electrically connected with the conducting terminals of the corresponding semiconductor switches and the corresponding diodes. The high-voltage-side switching element is disposed on the substrate and electrically connected with the corresponding conducting parts of the substrate. The low-voltage-side switching element is disposed on the high-voltage-side switching element and electrically connected with the corresponding conducting parts of the substrate through the high-voltage-side switching element.

Abstract: A power module includes a substrate, a first sub-module, a second sub-module and a circuit board. The semiconductor switches and the diodes of the first sub-module and the second sub-module are embedded within insulation layers. Consequently, the first sub-module and the second sub-module are formed as a high-voltage-side switching element and a low-voltage-side switching element of a bridge circuit. The first sub-module and the second sub-module are disposed on a first surface of the substrate. An electrode of the first sub-module and some electrodes of the second sub-module are electrically connected with corresponding conducting parts of a circuit board. A heat sink is disposed on a second surface of the substrate.

Abstract: A commutator has a conductive layer, a segment layer and an insulating layer separating the conductive layer and the segment layer. The segment layer includes multiple commutator segments. A mounting hole is defined along an axis of the commutator passing through the conductive layer. The three-layer structure of the commutator forms a capacitor having an increased confronting area and reduced inter-plate distance. The capacitor thus has a greater capacitance and hence greater EMI absorbing capability, making it possible to reduce EMI emissions without additional EMI reduction components outside the commutator. A rotor and a motor employing the commutator are also disclosed.

Abstract: The present invention provides an electric motor which includes a stator and a rotor rotatable relative to the stator. The stator includes a stator core and a winding. The stator core includes a yoke and a plurality of teeth extending from the yoke. The winding is wound on the teeth. The stator further comprises a shielding member mounted to at least one axial end of the stator core, and at least one of opposite axial ends of the winding is completely covered by the shielding member. The electric motor of the present invention has a reduced electromagnetic interference (EMI) and improved electromagnetic compatibility (EMC).

Abstract: An embedded package structure includes an insulation substrate, a first conductive layer, a second conductive layer, an electronic component and a passive component. The insulation substrate has a first conductive via and a second conductive via. The first conductive layer is formed on a top surface of the insulation substrate and contacted with the first conductive via. The second conductive layer is formed on a bottom surface of the insulation substrate, and contacted with the second conductive via. The electronic component is embedded within the insulation substrate. Moreover, plural conducting terminals of the electronic components are electrically connected with the first conductive layer and the second conductive layer through the first conductive via and the second conductive via. The passive component is located near a first side of the electronic component and separated from the electronic component. The passive component is at least partially embedded within the insulation substrate.

Abstract: A power module includes a substrate, a first sub-module and a second sub-module. The substrate includes plural first conducting parts, plural second conducting parts and a third conducting part. The first sub-module is disposed on the substrate, and includes a first semiconductor switch, a first diode, a first electrode, a second electrode and a third electrode. The first electrode and the second electrode are electrically connected with the corresponding first conducting parts. The third electrode is electrically connected with the third conducting part. The second sub-module is disposed on the substrate, and includes a second semiconductor switch, a second diode, a fourth electrode, a fifth electrode and a sixth electrode. The fourth electrode and the fifth electrode are electrically connected with the corresponding second conducting parts. The sixth electrode is electrically connected with the third conducting part.

Abstract: An embedded package structure includes an insulation substrate, a first conductive layer, a second conductive layer, an electronic component and a passive component. The insulation substrate has a first conductive via and a second conductive via. The first conductive layer is formed on a top surface of the insulation substrate and contacted with the first conductive via. The second conductive layer is formed on a bottom surface of the insulation substrate, and contacted with the second conductive via. The electronic component is embedded within the insulation substrate. Moreover, plural conducting terminals of the electronic components are electrically connected with the first conductive layer and the second conductive layer through the first conductive via and the second conductive via. The passive component is located near a first side of the electronic component and separated from the electronic component. The passive component is at least partially embedded within the insulation substrate.