Abstract: Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.

Abstract: Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.

Abstract: Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.

Abstract: Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.

Abstract: Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.

Abstract: A method of tuning transmission line impedance includes the step of determining a desired impedance for a transmission line. A capacitive stub is periodically added to the transmission line. A physical quantity to be removed from each of the capacitive stubs to achieve the desired impedance is identified. The identified physical quantity is then removed to establish the desired transmission line impedance. A method of forming an impedance bridge includes the step of affixing a set of capacitive stubs to a bridging transmission line that has a first end and a second end. The vertical height of the set of capacitive stubs is tapered from the first end to the second end to form an increasingly high impedance between the first end and the second end.

Abstract: Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.

Abstract: A system and method are presented for stabilizing the electrical impedance of a structure (e.g., an electrical interconnecting apparatus) including a pair of parallel planar conductors separated by a dielectric layer. The structure may be, for example, a PCB, a component of a semiconductor device package, or formed upon a surface of an integrated circuit substrate. An electrical resistance connected between the planar conductors about a periphery of the structure serves to stabilize the electrical impedance of the structure, thereby reducing an amount of electromagnetic energy radiated from the structure. The electrical resistance may be multiple discrete electrical resistances dispersed about the periphery of the structure, and the structure need not be rectangular. For example, a portion of the periphery of the structure may define a curve. A general method for stabilizing the electrical impedance of the structure includes selecting a spacing distance.

Abstract: A method of electrically modeling a semiconductor package is provided. The method reduces computation time for mutual inductance calculations between interconnect lines of the semiconductor package. Only interconnect within a predetermined distance of an interconnect line being modeled is calculated for mutual inductance. The predetermined distance is selected such that any interconnect line greater than the predetermined distance away from the interconnect line being modeled produces a negligible or small mutual inductance. This greatly reduces the number of calculations for semiconductor packages having a large number of interconnect lines. Each interconnect line modeled is broken into segments for calculating mutual inductance. An algorithm is used that calculates the mutual inductance between a pair of arbitrarily oriented straight line metal segments.

Abstract: A method for automated artwork building which comprises determining a desired die pad pitch, assigning inner lead bonding positions for each lead based on the average die pitch. The desired outer lead bonding position is then determined for each lead. The allowable range of fan in and fan out angles for each lead is computed according to design and manufacturing constraints. An electrical cost function is formulated based on signal lead crosstalk and ground lead simultaneous switching noise. Each lead is then routed. The routing is repeated for each lead for each allowable combination of fan in and fan out angles. Finally the optimal routing is selected based on electrical characteristics.

Abstract: A plurality of conductors (10, 11, 12, 15) are formed into sections (13, 14, 16, 17, 18, 19) having uniform cross-sectional area. Per unit electrical parameters are developed for each section (13, 14, 16, 17, 18, 19). A conductor of the plurality of conductors (10, 11, 12, 15) is partitioned into a number of equal length segments. All other conductors are partitioned into the same number of segments. For each segment, a lumped element model (24, 26, 28, 29) is developed. The model (24, 26, 28, 29) includes a capacitor (33), an inductor (32), a plurality of mutual inductors (36, 38, 31), and a plurality of mutual capacitors (37, 39, 40). Each model (24, 26, 28, 29) of a conductor (10, 11, 12, 15) is serially connected to provide an equivalent circuit (23, 27) of each conductor (10, 11, 12, 15). The circuits (23, 27) are simulated to determine the amount of signal coupling. The conductors (10, 11, 12, 15) are then modified to limit the signal coupling to desired values, and the procedure is repeated.