Patents by Inventor Wald Siskens

Wald Siskens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro device encapsulation
    Patent number: 7709940
    Abstract: A packaged die includes a substrate having an upper surface and a micro device on the upper surface and an encapsulation cover comprising one or more grooves on its lower surface. The lower surface of the encapsulation cover and the upper surface of the substrate are bonded together to form a plurality of air-tight closed-loop interfaces and encapsulate the micro device.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: May 4, 2010
    Assignee: Spatial Photonics, Inc.
    Inventors: Shaoher X. Pan, Wald Siskens
  • MICRO DEVICE ENCAPSULATION
    Publication number: 20070249091
    Abstract: A packaged die includes a substrate having an upper surface and a micro device on the upper surface and an encapsulation cover comprising one or more grooves on its lower surface. The lower surface of the encapsulation cover and the upper surface of the substrate are bonded together to form a plurality of air-tight closed-loop interfaces and encapsulate the micro device.
    Type: Application
    Filed: April 24, 2006
    Publication date: October 25, 2007
    Applicant: SPATIAL PHOTONICS, INC.
    Inventors: Shaoher Pan, Wald Siskens