Abstract: A method is disclosed for forming resistors that are low cost, easy to manufacture and substantially within 5 percent of their desired value. In one aspect of the method, an electrically resistive material, such as nickel, is deposited directly on an insulating layer, such as a substrate. In preferred embodiments a conductive material, such as copper, is then deposited on the resistive material only at a location where a signal trace is desired. Using photo-imaging, signal traces are formed in the conductive and resistive materials. A resistor is created by forming a gap in the conductive material at a location where the resistor is desired. Current is thereby forced to flow through the resistive material at the location of the gap.

Abstract: A method is disclosed for forming resistors that are low cost, easy to manufacture and substantially within 5 percent of their desired value. In one aspect of the method, an electrically resistive material, such as nickel, is deposited directly on an insulating layer, such as a substrate. A conductive material, such as copper, is then deposited on the resistive material. Using photo-imaging, signal traces are formed in the conductive and resistive materials. A resistor is created by forming a gap in the conductive material at a location where the resistor is desired. Current is thereby forced to flow through the resistive material at the location of the gap.