Abstract: A process for recovering a solder contaminant from a substrate surface with a wick structure comprising a plurality of heat conductive metal strands and a desoldering flux comprising a mixture of a first component of a partially polymerized rosin having a melting point of at least 98° C., a second component which is present in the desoldering flux formulation in an amount which is no more than the amount of the first component and comprises an ester of a polyhydric alcohol and benzoic acid, and a third component, which is present in an amount which is less than the amount of the second component, and comprises an aliphatic dicarboxylic acid. The solder contaminant is contacted with the wick structure in the presence of the desoldering flux and the wick structure and the solder contaminant are heated to melt the solder contaminant to cause the melted solder to flow into the wick structure in contact with the heat conductive metal strands.

Abstract: A process for recovering a solder contaminant from a substrate surface with a wick structure comprising a plurality of heat conductive metal strands and a desoldering flux comprising a mixture of a first component of a partially polymerized rosin having a melting point of at least 98° C., a second component which is present in the desoldering flux formulation in an amount which is no more than the amount of the first component and comprises an ester of a polyhydric alcohol and benzoic acid, and a third component, which is present in an amount which is less than the amount of the second component, and comprises an aliphatic dicarboxylic acid. The solder contaminant is contacted with the wick structure in the presence of the desoldering flux and the wick structure and the solder contaminant are heated to melt the solder contaminant to cause the melted solder to flow into the wick structure in contact with the heat conductive metal strands.

Abstract: To avoid the use of harmful CFCs in the cleaning of soldered printed circuit board assemblies, their manufacture is accomplished using a screen-printable solder paste composition which will in use yield minimal flux residues which will not require removal by a solvent cleaning step. The paste composition is formulated by incorporating the powdered soft solder alloy in a liquid medium containing up to 10% by weight of a non-corrosive organic flux material, a substantially water-immiscible organic solvent, and one or more thickening agents.

Abstract: In order to avoid the undesirable formation of flux residues when soldering electronic components, as in the production of printed circuit assemblies, there is used, as the solvent for a non-corrosive flux material, a mixture composed of a major proportion by weight of a monohydric alcohol and a minor proportion by weight of a water-immiscible polyalkylene glycol dialkyl or diaryl ether.

Abstract: The soft soldering of an aluminium or aluminium-based alloy member to another member of a metal or alloy capable of being soft soldered to aluminium at a joint site is effected using a lead/tin soft solder alloy in conjunction with a flux containing as one of the essential constituents a silver halide so that sufficient silver is deposited with the soft solder alloy at the joint site to prevent corrosion of the joint.

Abstract: A flux composition of the non-corrosive type suitable for use in soft soldering, particularly in the electrical and electronics industries, contains in place of the conventional natural rosin (colophony), an ester of a polyhydric alcohol such as pentaerythritol tetrabenzoate. The composition can be in solid or liquid form and in the latter can perform the multiple functions of an etch resist, a protective coating and a flux in the production of printed circuit assemblies.

Abstract: A flux composition of the non-corrosive type suitable for use in soft soldering, particularly in the electrical and electronics industries, contains in place of the conventional natural rosin (colophony), an ester of a polyhydric alcohol such as pentaerythritol tetrabenzoate. The composition can be in solid or liquid form and in the latter can perform the multiple functions of an etch resist, a protective coating and a flux in the production of printed circuit assemblies.