Abstract: A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.

Abstract: A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.

Abstract: A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.

Abstract: Systems, apparatus and methods of forming an LED device are described herein. The method includes providing a lead frame and an LED sub-assembly including an LED die attached to a wavelength conversion layer, and an optically transparent sidewall surrounding the LED die, the optically transparent sidewall having a curved or angled profile, attaching the LED sub-assembly to the lead frame, and dispensing an encapsulation material in a space surrounding the LED sub-assembly attached to the lead frame. The LED assembly is a high power LED assembly.

Abstract: Systems, apparatus and methods of forming an LED device are described herein. The method includes providing a lead frame and an LED sub-assembly including an LED die attached to a wavelength converting layer, and an optically transparent side wall surrounding the LED die, the optically transparent side wall having a curved or angled profile, attaching the LED sub-assembly to the lead frame, and dispensing an encapsulation material in a space surrounding the LED sub-assembly attached to the lead frame. The LED assembly is a high power LED assembly.

Abstract: A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.

Abstract: A lens structure is pre-formed with features that facilitate accurate alignment of a light emitting chip within the lens structure. To ease manufacturing, the features include tapered walls that allow for easy insertion of the light emitting chip into the lens structure, the taper serving to accurately align the light emitting chip when the chip is fully inserted. The taper may include linearly sloped or curved walls, including complex shapes. An adhesive may be used to secure the light emitting chip to the lens structure. The light emitting chips may be picked-and-placed into an array of lens structures, or picked-and-placed onto a substrate that may be overlaid by the array of lens structures.

Abstract: A lens structure is pre-formed with features that facilitate accurate alignment of a light emitting chip within the lens structure. To ease manufacturing, the features include tapered walls that allow for easy insertion of the light emitting chip into the lens structure, the taper serving to accurately align the light emitting chip when the chip is fully inserted. The taper may include linearly sloped or curved walls, including complex shapes. An adhesive may be used to secure the light emitting chip to the lens structure. The light emitting chips may be picked-and-placed into an array of lens structures, or picked-and-placed onto a substrate that may be overlaid by the array of lens structures.

Abstract: A lens is affixed over an LED die mounted on a substrate to encapsulate the LED die. The lens may have a top surface shaped as a dome or other shape to achieve the desired light pattern. The lens has a cavity for the LED die. A reflector pattern is molded into the bottom surface of the lens, such as one or more facet rings with an angled surface surrounding the LED die. The angled surface of the facet ring reflects the downward or shallow light emission from the LED die upward. A plurality of facet rings of different radii and heights may be formed in the bottom of the lens for shaping the light emission. Any suitable shape of facet may be used. The facet rings may be formed to cause the LED module to emit a narrow beam or other light emission patterns.

Abstract: A patterned conductive layer on a flexible substrate includes pads for mounting an array of LEDs, conductive strips, and conductive tabs that couple the conductive strips to the pads. The desired circuit configuration is created by removing select tabs by punching holes or otherwise piercing the flexible substrate at the location of the tabs. In some embodiments, the patterned conductive layer is arranged to permit each LED to be mounted in either of two mirrored orientations, and in some embodiments, the patterned conductive layer is arranged to permit a separation between LEDs that is not predefined by the pattern. In some embodiments, the unmodified patterned conductive layer is arranged to provide a parallel circuit configuration, and the modified patterned conductive layer is arranged to provide a series or series-parallel configuration.

Abstract: A patterned conductive layer on a flexible substrate includes pads for mounting an array of LEDs, conductive strips, and conductive tabs that couple the conductive strips to the pads. The desired circuit configuration is created by removing select tabs by punching holes or otherwise piercing the flexible substrate at the location of the tabs. In some embodiments, the patterned conductive layer is arranged to permit each LED to be mounted in either of two mirrored orientations, and in some embodiments, the patterned conductive layer is arranged to permit a separation between LEDs that is not predefined by the pattern. In some embodiments, the unmodified patterned conductive layer is arranged to provide a parallel circuit configuration, and the modified patterned conductive layer is arranged to provide a series or series-parallel configuration.

Abstract: A lens structure is pre-formed with features that facilitate accurate alignment of a light emitting chip within the lens structure. To ease manufacturing, the features include tapered walls that allow for easy insertion of the light emitting chip into the lens structure, the taper serving to accurately align the light emitting chip when the chip is fully inserted. The taper may include linearly sloped or curved walls, including complex shapes. An adhesive may be used to secure the light emitting chip to the lens structure. The light emitting chips may be picked-and-placed into an array of lens structures, or picked-and-placed onto a substrate that may be overlaid by the array of lens structures.

Abstract: A lens is affixed over an LED die mounted on a substrate to encapsulate the LED die. The lens may have a top surface shaped as a dome or other shape to achieve the desired light pattern. The lens has a cavity for the LED die. A reflector pattern is molded into the bottom surface of the lens, such as one or more facet rings with an angled surface surrounding the LED die. The angled surface of the facet ring reflects the downward or shallow light emission from the LED die upward. A plurality of facet rings of different radii and heights may be formed in the bottom of the lens for shaping the light emission. Any suitable shape of facet may be used. The facet rings may be formed to cause the LED module to emit a narrow beam or other light emission patterns.