Abstract: The present invention relates to the treatment of wounds.

Abstract: The present invention is directed to a dienophile-modified fatty acid composition and adhesive. The composition comprises a) a polycondensate of a1) a dimer of a fatty alcohol and/or a dimer of a fatty amine, and a2) a dimer of a fatty acid, said polycondensate having a weight average molecular weight of from 2,000 to 50,000 g/mol, and b) a fatty acid derivative as a cross-linking agent, wherein said fatty acid derivative is obtainable by reacting b1) a fatty acid ester comprising at least two double bonds, and b2) a dienophile comprising at least one functional group selected from a carboxylic acid, a carboxylic acid ester and a carboxylic acid anhydride, wherein the polycondensate and the cross-linking agent are capable of reacting with each other.

Abstract: The present invention is directed to a polyester-based composition and adhesive containing a heterobicycle. The composition comprises a) a polycondensate of a1) a heterobicycle containing from 4 to 8 carbon atoms and from 1 to 3 oxygen atoms, wherein the heterobicycle is substituted by 2 to 4 hydroxyl groups, and a2) a dimer of a fatty acid, and b) a cross-linking agent having at least 2 functional groups per molecule; wherein the polycondensate and the cross-linking agent are capable of reacting with each other.

Abstract: An object of the present invention is to provide a heat-expandable/peelable acrylic pressure-sensitive adhesive tape that maintains a high adhesion force, and can be easily separated or debonded at the bonded part by heating, regardless of the material constituting the adherend. Disclosed is a heat-expandable/peelable acrylic pressure-sensitive adhesive tape or sheet which includes at least a pressure-sensitive adhesive layer containing a blowing agent, a peelable or peel-assisting film layer, and a viscoelastic substrate containing microparticles, in which at least the peelable or peel-assisting film layer and the microparticle-containing viscoelastic substrate constitute a multilayer structure, and the multilayer structure is arranged on or above at least one side of the pressure-sensitive adhesive layer so that the blowing agent-containing pressure-sensitive adhesive layer is in contact with the peelable or peel-assisting film layer with or without the interposition of another layer.

Abstract: The present invention relates to an adhesive tape, a method of manufacturing thereof and to uses thereof. More specifically, the present invention relates to an adhesive tape that can be used as such in order to join two entities with their respective surfaces together and/or to attach an entity on the surface of a substrate, whilst the peel adhesion is reduced, i.e. the tape can be removed easily, if desired. The adhesive tape comprising: a layer of a thermally shrinkable polymer, said layer having two surfaces opposite each other, a layer of a pressure sensitive adhesive composition on one of said two surfaces, said pressure sensitive adhesive composition comprising an amorphous polymer, thermally expandable particles and/or at least one blocked isocyanate compound.

Abstract: The present invention relates to a cell culture substrate in which a polymer chain having a hydrophilic skeleton is grafted onto a surface of polystyrene or poly(?-caprolactone) having a water contact angle of from 75° to 100°. This cell culture substrate has excellent efficiency of cell culture without the necessity of immobilization and adsorption of a cell adhesion substance on a surface of a substrate.

Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.

Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.

Abstract: The invention concerns an adhesive tape for flying reel changes having a backing layer and adhesive layers coated on both sides of said backing layer. The adhesive tape has a cleavage means provided substantially transverse to at least said backing layer, thereby dividing said backing layer into a first portion and a second portion, wherein the one adhesive layer is not effective in the area of the second portion and the other adhesive layer is not effective in the area of the first portion.

Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.