Patents by Inventor Walter H. Brendecke

Walter H. Brendecke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resealable multichip module and method therefore
    Patent number: 5477009
    Abstract: A multichip electronic module comprising a base for holding various components and a lid for sealing the module, is temporarily closed by a reworkable seal made from a thermoplastic material. The seal is hermetic so that the module can be tested under ambient conditions approximating actual use. If the module fails the functional test, the lid is easily removed for repair. The thermoplastic material is located in a special grove near the periphery of the base or lid next to the mating surfaces which form part of a final seal for the module. After a module has been repaired, the lid is finally soldered or welded to the base using portions of these mating surfaces which are free of the thermoplastic material. There is no need to remove the thermoplastic material used for the temporary seal.
    Type: Grant
    Filed: March 21, 1994
    Date of Patent: December 19, 1995
    Assignee: Motorola, Inc.
    Inventors: Walter H. Brendecke, Kenneth H. Schmidt