Patents by Inventor Walter J. Whatley

Walter J. Whatley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to manufacture potted electronic assemblies for extreme mechanical and thermal environments
    Patent number: 11395414
    Abstract: A method and system for manufacturing potted electronic assemblies are described. Embodiments of the method and system may provide a potting compound having a first coefficient of thermal expansion different from a second coefficient of thermal expansion for a circuit board, provide a fiber reinforcement having a third coefficient of thermal expansion selected so that when the potting compound is combined with the fiber reinforcement the combined coefficient of thermal expansion is closer to the second coefficient of thermal expansion than the first coefficient of thermal expansion is to the second coefficient of thermal expansion, and apply the fiber reinforcement and the potting compound to the circuit board.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: July 19, 2022
    Assignee: GENERAL ATOMICS
    Inventors: Walter J. Whatley, Noel Martinez, Clay S. Staley
  • Fixture for performing tensile tests at extremely high temperature
    Patent number: 5286108
    Abstract: A fixture for performing tensile tests on advanced materials at extremely high temperatures (greater than 2500 degrees fahrenheit). The fixture allows gripping a specimen without introducing thermal gradient in the specimen. It incorporates a self aligning feature while avoiding thermal stress problems inherent in using different materials at elevated temperatures.
    Type: Grant
    Filed: June 1, 1992
    Date of Patent: February 15, 1994
    Assignee: Hughes Missile Systems Company
    Inventors: Walter J. Whatley, Gregory M. Duchnak