Patents by Inventor Walter Protsch

Walter Protsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7331498
    Abstract: Method for refining and homogeneously distributing alloying partners and for removing undesired reaction products such as oxides and/or slag in or from soft solder during the production of fine solder powder, in which the solder alloy is melted in a high temperature-resistant plant and/or animal oil, the melt is moved to another container of oil with a temperature of at least 20° C. greater than the liquidus temperature, stirred there, and subjected to multiple shear treatments using rotors and stators for forming a dispersion comprising solder balls and oil, from which dispersion the solder balls are separated by means of subsequent sedimentation.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: February 19, 2008
    Assignee: W. C. Heraeus GmbH
    Inventors: Walter Protsch, Juergen Schulze
  • Publication number: 20060208042
    Abstract: The invention relates to a method for refining and homogeneously distributing alloying partners and for removing undesired reaction products such as oxides and/or slag in or from soft solder during the production of fine solder powder, in which the solder alloy is melted in a high temperature-resistant plant and/or animal oil, the melt is moved to another container of oil with a temperature of at least 20° C. greater than the liquidus temperature, stirred there, and subjected to multiple shear treatments using rotors and stators for forming a dispersion comprising solder balls and oil, from which dispersion the solder balls are separated by means of subsequent sedimentation.
    Type: Application
    Filed: July 28, 2005
    Publication date: September 21, 2006
    Inventors: Walter Protsch, Juergen Schulze
  • Patent number: 6485674
    Abstract: Soft solder powder is made in the form of spherical fine metal particles having a grain size ranging from 1 to 100 &mgr;m and a Liquidus temperature <250° C.
    Type: Grant
    Filed: April 10, 2001
    Date of Patent: November 26, 2002
    Inventors: Jürgen Schulze, Walter Protsch
  • Publication number: 20020109273
    Abstract: Soft solder powder is made in the form of spherical fine metal particles having a grain size ranging from 1 to 100 &mgr;m and a Liquidus temperature <250° C.
    Type: Application
    Filed: April 10, 2001
    Publication date: August 15, 2002
    Inventors: Jurgen Schulze, Walter Protsch
  • Patent number: 6416863
    Abstract: A method is disclosed for encapsulating solder metal powders and the microencapsulated metal solder in such a way that the metal powder is reliably protected from external oxidizing influences and the capsule only releases the metal powder as a result of the influence of temperature, without the influence of soldering flux.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: July 9, 2002
    Inventors: Jürgen Schulze, Walter Protsch
  • Patent number: 6290745
    Abstract: The invention relates to a method and device for producing soft solder powder without pressure, in particular for producing spherical fine metal particles having a grain size ranging from 1-100 microns and a liquidus temperature <250 degrees C.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: September 18, 2001
    Inventors: Jürgen Schulze, Walter Protsch