Abstract: Footwear includes memory foam in at least a non-load bearing portion of the footwear to provide three-dimensional contouring to a foot. The footwear includes a top portion, a bottom portion, a pair of sides connecting the top portion with the bottom portion, and an opening formed between the top portion and the pair of sides to receive a foot. At least one of the top portion and the pair of sides includes memory foam providing three-dimensional contouring.

Abstract: Footwear includes memory foam in at least a non-load bearing portion of the footwear to provide three-dimensional contouring to a foot. The footwear includes a top portion, a bottom portion, a pair of sides connecting the top portion with the bottom portion, and an opening formed between the top portion and the pair of sides to receive a foot. At least one of the top portion and the pair of sides includes memory foam providing three-dimensional contouring.

Abstract: An insole is described that can be placed with an insole receiving area of a slipper. The insole can be prepared by compression molding a structure comprising a foam layer having a first foam side and a second foam side. The insole includes a heel region, an arch region, and a toe region. The heel region includes a heel cushioning portion and a heel perimeter portion. The heel perimeter portion includes a retaining wall that extends above the top surface of the heel cushioning portion. The arch region includes an arch cushioning portion and an arch perimeter portion. The arch perimeter portion includes an arch support that extends above the top surface of the arch cushioning portion. The toe region includes a toe cushioning portion and a toe perimeter portion. A slipper and a method for manufacturing a slipper are described.

Abstract: A footwear slipper arrangement is described. The slipper arrangement comprises a pillow top secured to an outsole member. The pillow top is a cushion member. The pillow top billows or projects upwardly.

Abstract: An insole is described that can be placed with an insole receiving area of a slipper. The insole can be prepared by compression molding a structure comprising a foam layer having a first foam side and a second foam side. The insole includes a heel region, an arch region, and a toe region. The heel region includes a heel cushioning portion and a heel perimeter portion. The heel perimeter portion includes a retaining wall that extends above the top surface of the heel cushioning portion. The arch region includes an arch cushioning portion and an arch perimeter portion. The arch perimeter portion includes an arch support that extends above the top surface of the arch cushioning portion. The toe region includes a toe cushioning portion and a toe perimeter portion. A slipper and a method for manufacturing a slipper are described.

Abstract: An insole is described that can be placed with an insole receiving area of a slipper. The insole can be prepared by compression molding a structure comprising a foam layer having a first foam side and a second foam side. The insole includes a heel region, an arch region, and a toe region. The heel region includes a heel cushioning portion and a heel perimeter portion. The heel perimeter portion includes a retaining wall that extends above the top surface of the heel cushioning portion. The arch region includes an arch cushioning portion and an arch perimeter portion. The arch perimeter portion includes an arch support that extends above the top surface of the arch cushioning portion. The toe region includes a toe cushioning portion and a toe perimeter portion. A slipper and a method for manufacturing a slipper are described.

Abstract: An insole is described that can be placed with an insole receiving area of a slipper. The insole can be prepared by molding a structure comprising a foam layer having a first foam side and a second foam side. The insole includes a heel region, an arch region, and a toe region. The heel region includes a heel cushioning portion and a heel perimeter portion. The heel perimeter portion includes a retaining wall that extends above the top surface of the heel cushioning portion. The arch region includes an arch cushioning portion and an arch perimeter portion. The arch perimeter portion includes an arch support that extends above the top surface of the arch cushioning portion. The toe region includes a toe cushioning portion and a toe perimeter portion. A slipper and a method for manufacturing a slipper are described.

Abstract: A slipper and a method of manufacturing a slipper is described where the slipper includes an outsole having a sidewall extending along a perimeter of the outsole. The outsole also includes a supporting sole structure including a platform surface. The supporting sole may include lattice walls defining open cells. The slipper also includes an insole and a vamp. The insole covers the platform of the outsole and fits within the sidewall. The method of manufacture includes the steps of providing the outsole, providing the vamp, and attaching a lower perimeter of the vamp to at least a portion of the sidewall extending along a perimeter of the outsole.

Abstract: Disclosed is a slipper having an outsole, an insole and an upper attached to the outsole. The outsole includes a bottom wall and a perimeter wall extending from the bottom wall to provide a polymer insole jell receiving area. The insole includes a polymer insole jell and is provided within the polymer jell insole receiving area of the outsole. The polymer insole jell can be formed within the polymer insole jell receiving area, or the polymer insole jell can be preformed and placed within the polymer insole jell receiving area. Also disclosed is a method for manufacturing a slipper.

Abstract: A slipper and a method of manufacturing a slipper is described where the slipper includes an outsole having a sidewall extending along a perimeter of the outsole. The outsole also includes a supporting sole structure including a platform surface. The supporting sole may include lattice walls defining open cells. The slipper also includes an insole and a vamp. The insole covers the platform of the outsole and fits within the sidewall. The method of manufacture includes the steps of providing the outsole, providing the vamp, and attaching a lower perimeter of the vamp to at least a portion of the sidewall extending along a perimeter of the outsole.

Abstract: An insole for use in a slipper is provided. The insole includes a first cushion layer and a second cushion layer. The first cushion layer includes a first foam layer and an air permeable membrane covering the first foam layer. The second cushion layer includes a second foam layer and an air permeable membrane covering the second foam layer. The first cushion layers are arranged so that the air permeable membrane of each layer faces outward, and the first cushion layer and the second cushion layer are attached together along their perimeter to provide a cavity between the first cushion layer and the second cushion layer. The insole can be referred to as pillow cushion because of the formation of a cavity between the first cushion layer and the second cushion layer. A slipper and a method for manufacturing a slipper are provided.