Abstract: An embodiment heat pump system of a vehicle includes a first cooling device including a battery module and a first line for circulating a coolant, an air conditioner unit including a compressor, an internal condenser, a main heat exchanger, a first expansion valve, and an evaporator that are interconnected through a refrigerant line for circulating a refrigerant, and a chiller connected to the first cooling device through the first line, connected to the refrigerant line through a first connection line, and configured to adjust a coolant temperature through heat-exchanging a selectively introduced coolant with the refrigerant. The air conditioner unit further includes a second expansion valve, a first valve, a second valve, a second connection line, a third connection line, and a fourth connection line.

Abstract: An embodiment multi-way coolant valve includes an outer housing including first to third outer inlets, first to third outer outlets, and a pump mount portion coupled to one of the outer outlets, an inner housing rotatably provided within the outer housing and including penetration holes corresponding to the outer inlets and outlets, a coolant line defined by a selective connection of the penetration holes such that the outer inlets and outlets are selectively connected, pads interposed between an interior circumference of the outer housing and an exterior circumference of the inner housing at locations of the outer inlets and outlets, respectively, and a driving device connected to a rotation center of the inner housing to selectively rotate the inner housing within the outer housing, wherein the inner housing is configured to rotate by a preset interval according to a selected vehicle mode.

Abstract: Embodiments of the inventive concept provide a wireless power apparatus for a substrate treating apparatus and a manufacturing method for the wireless power apparatus for the substrate treating apparatus for preventing a heat generation by preventing a generation of an eddy current in a coupling element, if the coupling element is used around an outer housing at which an induced magnetic field is formed. The inventive concept provides a wireless power apparatus for a substrate treating apparatus.

Abstract: An apparatus and method of detecting a wafer edge using a laser scanner, and a semiconductor transfer device are provided. The apparatus for detecting a wafer edge using a laser scanner includes a laser scanner disposed on a rear side of a mounted wafer and radiating a laser to a portion of an edge of the wafer, and a detection unit receiving an image acquired by the laser scanner and detecting the wafer edge in the image. The detection unit determines whether each wafer is present or aligned according to wafer edges detected in a plurality of wafer areas in the image.

Abstract: Proposed is a power supply apparatus capable of suppressing heat generation, and semiconductor manufacturing equipment and a transport system including the same. The power supply apparatus, which supplies power to a transport device in semiconductor manufacturing equipment, includes a first base member made of a conductive material installed along a moving path of the transport device, a second base member provided on a surface of the first base member and made of a magnetic core material, a track member provided as an installation structure disposed on a side of the second base member, a power supply member installed in the track member and to which current is applied to supply power, and a power reception member disposed in a power reception core member provided in the transport device at a predetermined interval from the power supply member, and magnetically coupled to the power supply member to generate an induced current.

Abstract: A support structure, includes: a support plate supporting a substrate; a lower cover covering a lower portion of the support plate; and a catching unit comprising a concave-convex structure having portions corresponding to each other so that the support plate and the lower cover are rotated and assembled with each other.

Abstract: The present invention provides a liquid supplying unit, including: a nozzle; a liquid supply pipe configured to supply a treatment liquid to the nozzle; and an impurity removing unit installed in the liquid supply pipe to remove an impurity in the treatment liquid, in which the impurity removing unit includes: a measuring unit configured to measure a characteristic of the impurity in the treatment liquid and form impurity data; a vibrating unit configured to apply vibration to the treatment liquid; a capturing unit configured to adsorb the impurity in the treatment liquid to which the vibration is applied; and a control unit configured to control the measuring unit and the vibration unit, and when the impurity data exceeds a reference data range, the control unit operates the vibrating unit.

Abstract: Disclosed is a lift pin assembly, including: a lift pin inserted into a pin hole; a moving plate moving up and down by a driving unit; a bellows module including a lower flange supported by the moving plate and a bellows shaft supporting the lift pins; and a pressurizing member provided between the lower flange and the moving plate to apply constant pressure in a lifting direction of the bellows module.

Abstract: According to an embodiment of the present invention, there is provided an article transport vehicle capable of speeding up and reducing vibration in a manufacturing plant, a rail assembly, and an article transport system including the same. The article transport vehicle that conveys an article between manufacturing facilities along a rail of an article transport system in a manufacturing plant includes an article holder, a vehicle body, a magnetic levitation actuator, and a linear motor coil.

Abstract: A substrate support unit includes a substrate support member that supports a substrate, the substrate support member being provided with one or more pin holes vertically penetrating the substrate support member, and a lift pin assembly provided to be lifted along a corresponding pin hole. The lift pin assembly includes lift pins, each lift pin having an upper end contacting the substrate and supporting the substrate, and a pin drive unit that is coupled to the lift pins and lifts the lift pins. The pin drive unit includes piezoelectric motors below the lift pins, respectively.

Abstract: Proposed is a wafer expander for uniformly expanding gaps between dies, and a die supplying module and die bonding equipment including the same. The wafer expander, for supporting a dicing tape to which a plurality of dies are attached and for expanding gaps between the plurality of dies, includes an expander ring detachably coupled to a wafer ring that fixes an edge of the dicing tape, and configured to ascend and descend, and a base ring supporting a bottom side of the dicing tape, and at least a portion thereof is configured to ascend and descend.

Abstract: The inventive concept provides a transfer apparatus. The transfer apparatus includes a transfer truck; and a bumper device installed at any one of the front part or the rear part of the transfer truck, and wherein the bumper device includes: a bumper provided spaced apart from the transfer truck; and an impact attenuation unit provided between the bumper and the transfer truck and configured to attenuate an impact force transferred from the bumper to the transfer truck by a friction force.

Abstract: A substrate lifting apparatus and a substrate processing apparatus for reducing deformation due to heat are provided. The substrate lifting apparatus comprises a plurality of pins in contact with a substrate, an upper plate for supporting the plurality of pins and having a plurality of upper connecting portions formed on a lower surface, a lower plate having a plurality of lower connecting portions connected to the plurality of upper connecting portions formed on an upper surface and disposed under the upper plate, and a driving unit for driving the plurality of pins to move up and down, wherein the lower plate supports a plurality of bushes and a plurality of shafts passing through the plurality of bushes on an upper surface thereof.