Abstract: A device includes a first buried layer over a substrate, a second buried layer over the first buried layer, a first well over the first buried layer and the second buried layer, a first high voltage well, a second high voltage well and a third high voltage well extending through the first well, wherein the second high voltage well is between the first high voltage well and the third high voltage well, a first drain/source region in the first high voltage well, a first gate electrode over the first well, a second drain/source region in the second high voltage well and a first isolation region in the second high voltage well, and between the second drain/source region and the first gate electrode, wherein a bottom of the first isolation region is lower than a bottom of the second drain/source region.

Abstract: The present invention discloses a compact sensor package structure, which comprises a package body, an LED chip and a sensor chip. The package body has a first room, a second room, a first hole and a second hole. The first and second rooms are independent to each other. The first and second holes interconnect the interiors and the external environments of the first and second rooms. The LED chip is arranged inside the first room, corresponding to the first hole and below the first hole. The LED chip projects light through the first hole. The sensor chip is arranged inside the second room, corresponding to the second hole and above/below the second hole. The sensor chip receives light via the second hole. The present invention features two independent rooms for two chips and prevents interference between the two chips.

Abstract: A glove iron comprises a cloth body and a power unit disposed in the cloth body. The cloth body includes a cloth fiber layer, a heat insulation layer, and an electrothermal fiber layer. The cloth fiber layer forms an accommodating space. The power unit is disposed on the cloth fiber layer, and corresponds to the heat insulation layer and the electrothermal fiber layer. The power unit is electrically connected to and provides power for the electrothermal fiber layer. The electrothermal fiber layer can also be replaced with the combination of an electrothermal membrane and a second cloth fiber layer. A user can use the glove type iron to iron a piece of clothing or material.

Abstract: An electric iron in accordance with a preferred embodiment includes a housing body, a carrying base, and a flexible soleplate. The carrying base is mounted on the bottom of the housing body to define a containing space configured for receiving inner members and a controlling circuit of the electric iron. The flexible soleplate is arranged under the carrying base and transforms an electric energy transmitted from the controlling circuit to a heat energy for generating the high temperature on the surface thereof to perform an ironing function. The electric iron has the flexible soleplate, which has a high heating and dissipating-heat property and a low power property so as to decrease the consume of the electric energy and the whole weight of the electric iron.

Abstract: A multi-leaf solar energy supplying apparatus includes an energy converting module and an electrical power storing module. The energy converting module includes a solar energy board having a plurality of leaves for converting solar energy into electrical power. The electrical power storing module is electrically connected with the energy converting module for receiving electrical power to charge a secondary battery. Therefore, the secondary battery provides at least one output voltage to an application system. Furthermore, the energy converting module further includes at least one first power transmission port. When the energy converting module is separated from the electrical power storing module, the energy converting module is connected with the application system via the first power transmission port and provides a voltage to the application system. Thereby, the goals of charging and supplying power via solar power, and offering a power source that can be used anywhere are achieved.

Abstract: A glove iron comprises a cloth body and a power unit disposed in the cloth body. The cloth body includes a cloth fiber layer, a heat insulation layer, and an electrothermal fiber layer. The cloth fiber layer forms an accommodating space. The power unit is disposed on the cloth fiber layer, and corresponds to the heat insulation layer and the electrothermal fiber layer. The power unit is electrically connected to and provides power for the electrothermal fiber layer. The electrothermal fiber layer can also be replaced with the combination of an electrothermal membrane and a second cloth fiber layer. A user can use the glove type iron to iron a piece of clothing or material.

Abstract: An electric iron in accordance with a preferred embodiment includes a housing body, a carrying base, and a flexible soleplate. The carrying base is mounted on the bottom of the housing body to define a containing space configured for receiving inner members and a controlling circuit of the electric iron. The flexible soleplate is arranged under the carrying base and transforms an electric energy transmitted from the controlling circuit to a heat energy for generating the high temperature on the surface thereof to perform an ironing function. The electric iron has the flexible soleplate, which has a high heating and dissipating-heat property and a low power property so as to decrease the consume of the electric energy and the whole weight of the electric iron.

Abstract: The present invention discloses a reinforced MEMS package structure, wherein after the wire-bonding process and before the molding process, an extra resin coating process is used to apply a protective resin onto the MEMS chip, the controller chip, the wires and a portion of the lead frame and provide an extra protection for the MEMS structure lest the MEMS structure be damaged by stress, thermal stress, or external force. Thereby, a reinforced MEMS package structure with a higher strength and a smaller size is achieved.

Abstract: The invention provides a multiple stacked-chip packaging structure, including: at least one lower layer chip located on a substrate, wherein a plurality of wires are electrically connected to the bonding pads on the lower layer chip and to the substrate; at least one carrier cap provided on the lower layer chip to provide an accommodating space to the bonding pads and the wires on the lower layer chip; at least one upper layer chip provided on the carrier cap, wherein a plurality of wires are electrically connected to the bonding pads on the upper layer chip and to the substrate; and finally, a Molding Compound used to wrap up the foregoing components.

Abstract: The present invention is to provide a semiconductor package structure provided with the heat sink fan. The present invention is to arrange at least a chip and a heat sink fan on a substrate. A trench is positioned surrounding around a surface of the external exposed portion of the heat sink fan so as to block the encapsulant, which is to cover the chip, in the trench to prevent the encapsulant to overflow the surface of the heat sink fan. In the present invention, the surrounding of the exposed surface of the heat sink fan can maintain the uniform appearance and retain the fixed heat-sinking area so as to assure the heat-sinking efficiency.