Abstract: A shunt strip that includes a plurality of shunts arranged in a grid with each of the shunts spaced from an adjacent shunt by a shunt-gap. A plurality of tabs connect the plurality of shunts and at least one tab is positioned within each shunt-gap. Also, a shunt with a generally parallelepiped shaped body has severed tab portions extending outwardly and downwardly from the body.

Abstract: A sheet of electronic components includes a plurality of electronic components. A plurality of connecting members mechanically connects the electronic components together. A first fiducial marker is located at a first predetermined location on the sheet and a second fiducial marker is located at a second predetermined location on the sheet.

Abstract: A shunt strip that includes a plurality of shunts arranged in a grid with each of the shunts spaced from an adjacent shunt by a shunt-gap. A plurality of tabs connect the plurality of shunts and at least one tab is positioned within each shunt-gap. Also, a shunt with a generally parallelepiped shaped body has severed tab portions extending outwardly and downwardly from the body.

Abstract: A shunt strip that includes a plurality of shunts arranged in a grid with each of the shunts spaced from an adjacent shunt by a shunt-gap. A plurality of tabs connect the plurality of shunts and at least one tab is positioned within each shunt-gap. Also, a shunt with a generally parallelepiped shaped body has severed tab portions extending outwardly and downwardly from the body.

Abstract: A saw blade for dicing a sheet of copper alloy to form individual resistors is disclosed, wherein the sheet of copper alloy has a thickness of less than 0.3 mm. The saw blade includes a ring having a first side, a second side, and a circumferential surface, wherein the thickness of the ring between the first side and the second side is less than 0.6 mm.

Abstract: A sheet of electronic components includes a plurality of electronic components. A plurality of connecting members mechanically connects the electronic components together. A first fiducial marker is located at a first predetermined location on the sheet and a second fiducial marker is located at a second predetermined location on the sheet.

Abstract: A saw blade for dicing a sheet of copper alloy to form individual resistors is disclosed, wherein the sheet of copper alloy has a thickness of less than 0.3 mm. The saw blade includes a ring having a first side, a second side, and a circumferential surface, wherein the thickness of the ring between the first side and the second side is less than 0.6 mm.

Abstract: A sheet of electronic components includes a plurality of electronic components. A plurality of connecting members mechanically connects the electronic components together. A first fiducial marker is located at a first predetermined location on the sheet and a second fiducial marker is located at a second predetermined location on the sheet.

Abstract: A shunt strip that includes a plurality of shunts arranged in a grid with each of the shunts spaced from an adjacent shunt by a shunt-gap. A plurality of tabs connect the plurality of shunts and at least one tab is positioned within each shunt-gap. Also, a shunt with a generally parallelepiped shaped body has severed tab portions extending outwardly and downwardly from the body.

Abstract: A packaged integrated circuit (IC) includes a leadframe having metal terminals positioned outside the die pad. An IC die having a top side including a plurality of bond pads is placed with its bottom side onto attached by a dielectric polymer material to the die pad. Bond wires are between the plurality of bond pads and the metal terminals of the leadframe. A mold material different from said dielectric polymer material provides encapsulation for the packaged IC. An area of the dielectric polymer material exceeds an area of the IC die. The dielectric polymer material forms a dielectric polymer/mold material interface with the mold material.

Abstract: A method of assembling a packaged integrated circuit (IC) includes printing a viscous dielectric polymerizable material onto a die pad of a leadframe having metal terminals positioned outside the die pad. An IC die having a top side including a plurality of bond pads is placed with its bottom side onto the viscous dielectric polymerizable material. Bond wires are wire bonded between the plurality of bond pads and the metal terminals of the leadframe.

Abstract: A method of assembling a packaged integrated circuit (IC) includes printing a viscous dielectric polymerizable material onto a die pad of a leadframe having metal terminals positioned outside the die pad. An IC die having a top side including a plurality of bond pads is placed with its bottom side onto the viscous dielectric polymerizable material. Bond wires are wire bonded between the plurality of bond pads and the metal terminals of the leadframe.