Abstract: A tantalum capacitor includes: a tantalum body including tantalum powder and having a tantalum wire exposed to one end surface; a molded portion having fifth and sixth surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and first and second direction opposing each other in a third direction, and disposed to surround the tantalum body; an anode lead frame exposed to the second surface of the molded portion and electrically connected to the tantalum wire; and a cathode lead frame spaced apart from the anode lead frame and exposed to the second surface of the molded portion. The anode lead frame includes a first connection portion and a first bent portion, and the first bent portion forms an angle of inclination, ranging from 70° or more to 80° or less, to a side of the tantalum body with respect to the first connection portion.

Abstract: A tantalum capacitor includes: a tantalum body including tantalum, and having a tantalum wire in which a distance from a lower surface of the tantalum body is closer than a distance from an upper surface of the tantalum body; an insulating member on which the tantalum body is disposed; an encapsulation portion; an anode terminal including an upper anode and connected to the tantalum wire, a lower anode pattern, and an anode connection portion connecting the upper anode pattern and the lower anode pattern; and a cathode terminal including an upper cathode pattern and connected to the tantalum body, a lower cathode pattern disposed on a lower surface of the insulating member to be spaced apart from the lower anode pattern, and a cathode connection portion connecting the upper cathode pattern and the lower cathode pattern.

Abstract: A tantalum capacitor includes: a tantalum body having a tantalum wire exposed from one surface of the tantalum body; a molded portion including first and second surfaces opposing in a thickness direction, third and fourth surfaces opposing in a width direction, and fifth and sixth surfaces opposing in a longitudinal direction, the molded portion surrounding the tantalum body; an anode lead frame including an anode connection member and an anode terminal, which are connected to the tantalum wire, exposed through the second surface of the molded portion; and a cathode lead frame spaced apart from the anode lead frame, and exposed through the second surface of the molded portion, wherein end portions of the tantalum wire, the anode connection member, and the anode terminal in the longitudinal direction are on a same plane.

Abstract: A tantalum capacitor includes a tantalum body including tantalum powder, and having a tantalum wire exposed to one end surface; a molding portion including fifth and sixth surfaces opposed in a first direction, third and fourth surfaces opposed in a second direction, and first and second surfaces opposed in a third direction, and formed to surround the tantalum body; an anode lead frame exposed to the second surface of the molding portion, and connected to the tantalum wire; and a cathode lead frame spaced apart from the anode lead frame, and exposed to the second surface of the molding portion. The anode lead frame includes a first connection portion and a first bent portion, and the first bent portion forms an inclination angle within a range of less than 70° toward the tantalum body, based on the first connection portion.

Abstract: A tantalum capacitor includes: a tantalum body having a tantalum wire exposed from one surface of the tantalum body; a molded portion including first and second surfaces opposing in a thickness direction, third and fourth surfaces opposing in a width direction, and fifth and sixth surfaces opposing in a longitudinal direction, the molded portion surrounding the tantalum body; an anode lead frame including an anode connection member and an anode terminal, which are connected to the tantalum wire, exposed through the second surface of the molded portion; and a cathode lead frame spaced apart from the anode lead frame, and exposed through the second surface of the molded portion, wherein end portions of the tantalum wire, the anode connection member, and the anode terminal in the longitudinal direction are on a same plane.

Abstract: A tantalum capacitor includes: a tantalum body including tantalum, and having a tantalum wire in which a distance from a lower surface of the tantalum body is closer than a distance from an upper surface of the tantalum body; an insulating member on which the tantalum body is disposed; an encapsulation portion; an anode terminal including an upper anode and connected to the tantalum wire, a lower anode pattern, and an anode connection portion connecting the upper anode pattern and the lower anode pattern; and a cathode terminal including an upper cathode pattern and connected to the tantalum body, a lower cathode pattern disposed on a lower surface of the insulating member to be spaced apart from the lower anode pattern, and a cathode connection portion connecting the upper cathode pattern and the lower cathode pattern.

Abstract: A tantalum capacitor includes a tantalum body including tantalum powder, and having a tantalum wire exposed to one end surface; a molding portion including fifth and sixth surfaces opposed in a first direction, third and fourth surfaces opposed in a second direction, and first and second surfaces opposed in a third direction, and formed to surround the tantalum body; an anode lead frame exposed to the second surface of the molding portion, and connected to the tantalum wire; and a cathode lead frame spaced apart from the anode lead frame, and exposed to the second surface of the molding portion. The anode lead frame includes a first connection portion and a first bent portion, and the first bent portion forms an inclination angle within a range of less than 70° toward the tantalum body, based on the first connection portion.

Abstract: A tantalum capacitor includes a capacitor body; a tantalum wire protruding from one surface of the capacitor body; a molded part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the molded part; and a cathode lead frame disposed on an outer surface of the capacitor body and exposed to the outer surface of the molded part. The anode lead frame includes a bend portion.

Abstract: There is provided a tantalum capacitor including: a tantalum capacitor body; a plurality of tantalum wires and an adhesive layer on a lower surface of the tantalum capacitor body; and a molding part enclosing the tantalum capacitor body, wherein the tantalum wire and the adhesive layer are connected to an anode lead frame and a cathode lead frame, respectively.

Abstract: A tantalum capacitor includes a capacitor body; a tantalum wire protruding from one surface of the capacitor body; a molded part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the molded part; and a cathode lead frame disposed on an outer surface of the capacitor body and exposed to the outer surface of the molded part. The anode lead frame includes a bend portion.

Abstract: A composite electronic component includes: a tantalum capacitor, a multilayer ceramic capacitor, a sealing part, an anode lead frame, and a cathode lead frame, wherein the anode lead frame includes a step portion that does not contact a first external electrode of the multilayer ceramic capacitor, and the cathode lead frame includes a step portion that does not contact a second external electrode of the multilayer ceramic capacitor.

Abstract: There are provided a tantalum capacitor having groove parts extended from a lower surface of a positive electrode terminal to an inner part of a wire connection part; and a method of manufacturing a tantalum capacitor, the method including: forming a wire connection part of a positive electrode terminal by applying pressure to a portion of a conductive metal plate upwardly from a bottom surface thereof.

Abstract: A tantalum capacitor includes a capacitor body containing a tantalum powder and having a tantalum wire protruding to one side surface thereof, a molding part enclosing the tantalum wire and the capacitor body so as to allow an end portion of the tantalum wire to be exposed through one side surface thereof, a positive electrode terminal extended from one side surface of the molding part to a portion of a lower surface thereof and connected to the end portion of the tantalum wire, and a negative electrode terminal extended from the other side surface of the molding part to a portion of the lower surface thereof and connected to the other side surface of the capacitor body.

Abstract: A tantalum capacitor may include two tantalum wires exposed through two surfaces of a capacitor body opposing each other, first and second positive electrode terminals, connected to the tantalum wires, respectively, and disposed on two surfaces of a molded part opposing each other, and a negative electrode terminal disposed between the first and second positive electrode terminals. The negative electrode terminal may be electrically connected to the capacitor body by a via electrode or a pad electrode disposed between the negative electrode terminal and the capacitor body.

Abstract: A composite electronic component includes: a tantalum capacitor, a multilayer ceramic capacitor, a sealing part, an anode lead frame, and a cathode lead frame, wherein the anode lead frame includes a step portion that does not contact a first external electrode of the multilayer ceramic capacitor, and the cathode lead frame includes a step portion that does not contact a second external electrode of the multilayer ceramic capacitor.

Abstract: A tantalum capacitor includes a capacitor body; a tantalum wire disposed on a surface of the capacitor body; an encapsulant part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the encapsulant part; and a cathode lead frame disposed on a surface of the capacitor body and exposed to the outer surface of the encapsulant part. The anode lead frame includes a pillow head part connected to the tantalum wire and an electrode plate connected to the pillow head part and exposed to the outer surface of the encapsulant part, and the pillow head part includes an etched surface.

Abstract: A tantalum capacitor includes a capacitor body; a tantalum wire protruding from one surface of the capacitor body; a molded part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the molded part; and a cathode lead frame disposed on an outer surface of the capacitor body and exposed to the outer surface of the molded part. The anode lead frame includes a bend portion.

Abstract: A tantalum capacitor includes a capacitor body; a tantalum wire disposed on a surface of the capacitor body; an encapsulant part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the encapsulant part; and a cathode lead frame disposed on a surface of the capacitor body and exposed to the outer surface of the encapsulant part. The anode lead frame includes a plating part connected to the tantalum wire and an electrode plate connected to the plating part and exposed to the outer surface of the encapsulant part.

Abstract: A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame.

Abstract: There is provided a tantalum capacitor including: a tantalum capacitor body; a plurality of tantalum wires and an adhesive layer on a lower surface of the tantalum capacitor body; and a molding part enclosing the tantalum capacitor body, wherein the tantalum wire and the adhesive layer are connected to an anode lead frame and a cathode lead frame, respectively.