Abstract: High power multi-chip module packages for packaging semiconductor dice are disclosed. The disclosed packages have an output power of at least 1 kilowatt (kW) and can have an operating signal frequency in a range of hundreds of MHz. The high power multi-chip module packages have base plates with multiple planes or layers that can be conductive and may be thin metal layers in some examples. The multiple planes are formed and overlaid in such a way that they help reduce stray inductance values caused by the packaging itself, which improves overall device operation and efficiency. Current loops created when one of the multi-chip modules is in a turn-on condition are balanced and opposed and generate a minimized B-Field that is restricted by the manner in which the multiples planes of the base plate are overlaid, thus reducing the stray inductance values and improving device operation.

Abstract: A semiconductor component and methods for manufacturing the semiconductor component that includes a monolithically integrated common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.

Abstract: A semiconductor component and methods for manufacturing the semiconductor component that includes a monolithically integrated common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.

Abstract: The present invention relates to a low pass filter incorporating coupled inductors to enhance stop band attenuation. In one embodiment, the coupled inductors are provided along with various capacitors to provide for superior performance within a smaller surface area of a semiconductor or ceramic integrated device. In a further specific embodiment, the capacitors are formed on an integrated device within an area on which entirely intertwined inductors are formed. In another embodiment, at least one further pair of coupled inductors is included to create additional frequency attenuation notches, as well as a wide stop-band.

Abstract: The present invention relates to a low pass filter incorporating coupled inductors to enhance stop band attenuation. In one embodiment, the coupled inductors are provided along with various capacitors to provide for superior performance within a smaller surface area of a semiconductor or ceramic integrated device. In a further specific embodiment, the capacitors are formed on an integrated device within an area on which entirely intertwined inductors are formed. In another embodiment, at least one further pair of coupled inductors is included to create additional frequency attenuation notches, as well as a wide stop-band.

Abstract: A tunable inductor circuit and phase tuning circuit utilizing a tunable inductor circuit for dynamically controlling signal phase delay in RF/Microwave Circuits and related applications. The tunable inductor includes an inductor and a voltage variable capacitor connected to each other. The tunable inductor and voltage variable capacitor can be connected to each other in parallel or in series. The phase tuning circuit includes at least one tunable inductor circuit and at least one voltage variable capacitor coupled to the at least one tunable inductor circuit, wherein the at least one tunable inductor circuit and the voltage variable capacitor are responsive to control signals to alter a tuning characteristic of the phase tuning circuit.

Abstract: A radio frequency (RF) choke inductor (102, 500, 600) includes a magnetic core (502, 602) which substantially dissipates RF and microwave signals. The magnetic core (502, 602) is sufficiently lossy to provide a substantially resistive impedance at RF and microwave frequencies. The magnetic core is formed by providing a homogeneous ferrite composition characterized by a mixture of ferrous ions and ferric ions (404), and then sintering the homogeneous ferrite composition in an inert gas atmosphere (412) to provide a rapid electron exchange reaction. A conductive wire is then wound about the magnetic core (414) to complete the choke inductor.

Abstract: A volume efficient resonator (100) includes a helical coil transmission line (108) fabricated on a plurality of dielectrics (212, 214, 216, 218, 220, 222, 224, and 226). The transmission line (108) includes selectively metalized areas (210) on the dielectric layers. The metalized areas are formed in half loops and interconnected at alternate terminals via through-holes (203 and 205). A distributed capacitor (106) is added to the transmission line (108) using another set of selectively metalized areas (208). The distributed capacitor (106) is shunted to a ground plane (202) via through-holes (204, 206).

Abstract: First and second transmission line couplers (202, 204) one being configured in an asymmetrical open circuit configuration, the other being configured in an asymmetrical short circuit configuration, are coupled together to form a balun transformer (200). Balun transformer (200, 400, 500) can be implemented in three port bandpass filter (800) or other differential circuits to combine the functionality of a balun transformer and a two-pole filter into one circuit.

Abstract: A multi-layer substrate (500) includes a segmented stripline (602) which is formed of multi-layered segment (514, 522, 516) and is proximately coupled to a second stripline (604) to form a directional coupler. The directional coupler (500) provides similar input and output port impedances while allowing for independent control of the coupling. The overall length of the coupler is held constant while individual lengths of the segments of the segmented stripline (602) and the second stripline (604) are increased and decreased to independently control the coupling while maintaining the similar port impedances.