Abstract: A radio frequency transceiver includes a container. The container includes a circuit board and the connection assembly. A baseband circuit is disposed on the circuit board. The baseband circuit is configured to synthesize the first baseband signal, and decode the second baseband signal. The connection assembly includes a board-end connector, a cable, and at least one optical module interface. The board-end connector is configured to connect to the baseband circuit. A first end of the cable is configured to connect to the at least one optical module interface, and a second end of the cable is configured to connect to the board-end connector. Each optical module interface of the at least one optical module interface is configured to connect to an external optical module. According to the solutions provided by this radio frequency transceiver, a circuit layout can be more flexible, hardware costs can be reduced, and space can be saved.

Abstract: This specification relates to an apparatus which stores a machine-learned model including a first neural network block including multiple convolutional neural network layers, a second neural network block including at least one dilated convolutional neural network layer, and a linear transformation block. The apparatus is configured to receive input data representing in-phase and quadrature signals of an input signal that is to be amplified by a power amplifier, to process the received input data using the first neural network block of the machine learned model to generate a first neural network block output, to process the received input data using the second neural network block of the machine learned model to generate a second neural network block output, and to combine, using the linear transformation block, the first neural network block output and the second neural network block output to generate a pre-distorted signal for amplification by the power amplifier.

Abstract: A socket assembly includes a connecting base, comprising a signal port and a shielding structure. The shielding structure is disposed around a peripheral edge of the signal port. The plug assembly includes a connecting head. The connecting head includes a signal terminal and a ground component. The signal terminal and the ground component are disposed side by side. When the plug assembly is fixedly connected to the socket assembly, each connecting head extends into one connecting base, the signal terminal is conducted to the signal port, and the ground component is bonded to the shielding structure. In this application, the shielding structure of the connector is disposed around peripheral edges of the signal terminal and the signal port, and forms bonding with the ground component. This may effectively prevent a phenomenon of signal current return, avoids impact of crosstalk resonance, and improves signal transmission integrity of the connector.

Abstract: A connector may be disposed in the communication device, and may be signally connected to a circuit board in the communication device. The connector may include a terminal module and a shielding part. The terminal module includes a plurality of connection terminals, and the plurality of connection terminals include a signal terminal and a ground terminal. The connection terminal includes a first end, a second end, and a terminal body that connects the first end and the second end. The shielding part includes a shielding body and a contact arm. In addition, the contact arm may be elastically abutted against the ground terminal, to implement an electrical connection between the contact arm and the ground terminal. By using the connector provided in this application, crosstalk performance of the terminal module can be improved, to enhance signal transmission performance of the communication device.

Abstract: A connector includes an end protector and lead frames. Each lead frame includes a plurality of connection terminal groups and a shield layer. Each connection terminal group includes two connection terminals configured to transmit a signal. Each connection terminal has a first connection end that cooperates with insertion of a circuit board. The shield layer is configured to electromagnetically isolate connection terminal groups in adjacent lead frames. The end protector includes a conductive structure that is located between the first connection ends of the two connection terminals in each connection terminal group. In the foregoing technical solution, with the conductive structure that is on the end protector, a transmission path of a loop signal corresponding to a differential signal transmitted by each connection terminal group is improved, crosstalk between loop signals corresponding to different connection terminal groups is reduced, and communication effect of the connector is improved.

Abstract: The technology of this application relates to a connector assembly including a metal housing, a conducting piece, a wire, and a shield layer. The metal housing includes a shield cavity. The conducting piece is accommodated in the shield cavity. The wire is partially located in the shield cavity and is electrically connected to one end of the conducting piece. The shield layer is wrapped around the wire. At least two electrical connecting parts are disposed on an outer surface of the shield layer. The at least two electrical connecting parts face different directions and are respectively electrically connected to parts, of the metal housing, that the at least two electrical connecting parts face, to reduce impact of crosstalk of the connector assembly. The connector assembly is intended to reduce impact of crosstalk of the connector assembly, to provide the connector assembly and the electronic device that meet an application requirement of 112 Gbps.

Abstract: This application provides a differential pair module, including a first signal terminal and a second signal terminal. The first signal terminal includes a first signal tail part, a first signal body part, and a first signal conductive connection part that are successively connected. An extension plane of the first signal conductive connection part and an extension plane of the first signal body part form an included angle, and an extension direction of the first signal conductive connection part and an extension direction of the first signal tail part form an included angle. The second signal terminal includes a second signal tail part, a second signal body part, and a second signal conductive connection part that are successively connected. Solutions in this application can implement a PCB board connection architecture having no backplane.

Abstract: A printed circuit board includes a connector insertion area including many rows of crimping holes, each row of crimping holes includes at least two pairs of signal crimping holes (SCHs), and each pair of SCHs includes two SCHs. In a row arrangement direction of the crimping holes, at least one ground crimping hole (GCH) is arranged on either side of each pair of SCHs. A depth of the GCH is greater than or equal to a depth of the SCH, the GCH includes a main hole and a shielding component on at least one side of the main hole, a part of a side wall of the main hole is a part of a side wall of the shielding component, and a sum of lengths of the main hole and the shielding component in a first direction is greater than a length of the SCHs in the first direction.

Abstract: The present disclosure discloses a PCB processing method and a PCB. The method includes: respectively carrying out laminating processing on a plurality of PCB daughter boards constituting a PCB, and drilling and electroplating the top-most PCB daughter board to form a via hole; and laminating the plurality of PCB daughter boards together to form the PCB, and drilling and electroplating the formed PCB to form a through hole for mounting a connector, wherein a blind hole for mounting a connector is formed by the via hole, and a depth of the blind hole is greater than or equal to the length of a signal pin of the connector. By virtue of the technical scheme of the present disclosure, a space between wafers of the lower layer of PCBs may be doubled, and the space for layout between wafers may be doubled.

Abstract: The present disclosure discloses a PCB processing method and a PCB. The method includes: respectively carrying out laminating processing on a plurality of PCB daughter boards constituting a PCB, and drilling and electroplating the top-most PCB daughter board to form a via hole; and laminating the plurality of PCB daughter boards together to form the PCB, and drilling and electroplating the formed PCB to form a through hole for mounting a connector, wherein a blind hole for mounting a connector is formed by the via hole, and a depth of the blind hole is greater than or equal to the length of a signal pin of the connector. By virtue of the technical scheme of the present disclosure, a space between wafers of the lower layer of PCBs may be doubled, and the space for layout between wafers may be doubled.