Abstract: This application discloses an integrated circuit, and relates to the field of electronic technologies, to ensure that the integrated circuit has a relatively high bandwidth and can meet an ESD standard. The integrated circuit includes a die and a transmission line coupled to the die. Electrostatic discharge ESD modules are periodically disposed on the transmission line.

Abstract: An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.

Abstract: An electrostatic discharge (ESD) protection circuit is provided to minimize ESD damage to an internal circuit in a CDM model. The ESD protection circuit includes two stages of discharging circuits that are coupled to an IO pin and the internal circuit, a first power clamp circuit, and a second power clamp circuit. The first power clamp circuit is electrically connected to a power rail and a ground rail to discharge a part of a current to the ground, and the second power clamp circuit is electrically connected to a second-stage discharging circuit and the ground rail, so that the other part of the current is discharged to the ground through the second power clamp circuit.

Abstract: An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.

Abstract: An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.

Abstract: This application discloses an integrated circuit, and relates to the field of electronic technologies, to ensure that the integrated circuit has a relatively high bandwidth and can meet an ESD standard. The integrated circuit includes a die and a transmission line coupled to the die. Electrostatic discharge ESD modules are periodically disposed on the transmission line.

Abstract: An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.

Abstract: In the field of electronic technologies, a power supply selector and a power supply selection method are provided. The power supply selector includes: a first selection module, configured to select a power supply from multiple candidate power supplies; a control module, coupled to the first selection module, and configured to use the power supply selected by the first selection module as a power supply, and compare voltages of the multiple candidate power supplies to generate a control signal of each candidate power supply; and a second selection module, coupled to the control module, and configured to select a power supply for output in the multiple candidate power supplies under the control of the control signal of each candidate power supply. The technical solution is used to select a power supply from multiple candidate power supplies.

Abstract: In the field of electronic technologies, a power supply selector and a power supply selection method are provided. The power supply selector includes: a first selection module, configured to select a power supply from multiple candidate power supplies; a control module, coupled to the first selection module, and configured to use the power supply selected by the first selection module as a power supply, and compare voltages of the multiple candidate power supplies to generate a control signal of each candidate power supply; and a second selection module, coupled to the control module, and configured to select a power supply for output in the multiple candidate power supplies under the control of the control signal of each candidate power supply. The technical solution is used to select a power supply from multiple candidate power supplies.

Abstract: In the field of electronic technologies, a power supply selector and a power supply selection method are provided. The power supply selector includes: a first selection module, configured to select a power supply from multiple candidate power supplies; a control module, coupled to the first selection module, and configured to use the power supply selected by the first selection module as a power supply, and compare voltages of the multiple candidate power supplies to generate a control signal of each candidate power supply; and a second selection module, coupled to the control module, and configured to select a power supply for output in the multiple candidate power supplies under the control of the control signal of each candidate power supply. The technical solution is used to select a power supply from multiple candidate power supplies.

Abstract: In the field of electronic technologies, a power supply selector and a power supply selection method are provided. The power supply selector includes: a first selection module, configured to select a power supply from multiple candidate power supplies; a control module, coupled to the first selection module, and configured to use the power supply selected by the first selection module as a power supply, and compare voltages of the multiple candidate power supplies to generate a control signal of each candidate power supply; and a second selection module, coupled to the control module, and configured to select a power supply for output in the multiple candidate power supplies under the control of the control signal of each candidate power supply. The technical solution is used to select a power supply from multiple candidate power supplies.

Abstract: A driver for a DC-to-DC converter that may utilize a flyback or buck-boost converter circuit. The driver includes a driver circuit and an interface circuit. The interface circuit has a sensor sensing an input voltage from a DC supply and generating a sensor signal to a driver selector. The driver selector compares the sensor signal to a comparison voltage to determine the type of converter circuit and then transmits a selector signal to a driver circuit where it is used to control one or more of the components of the driver circuit, such as the logic circuit which is used for driving the converter to regulate the converter output. The sensor includes a sense resistor along with a current-sense amplifier, which is adapted for connection to a high side or a low side of a power supply while still producing a substantially equivalent output voltage or sensor signal.

Abstract: A driver for a DC-to-DC converter that may utilize a flyback or buck-boost converter circuit. The driver includes a driver circuit and an interface circuit. The interface circuit has a sensor sensing an input voltage from a DC supply and generating a sensor signal to a driver selector. The driver selector compares the sensor signal to a comparison voltage to determine the type of converter circuit and then transmits a selector signal to a driver circuit where it is used to control one or more of the components of the driver circuit, such as the logic circuit which is used for driving the converter to regulate the converter output. The sensor includes a sense resistor along with a current-sense amplifier, which is adapted for connection to a high side or a low side of a power supply while still producing a substantially equivalent output voltage or sensor signal.

Abstract: A driver for a DC-to-DC converter that may utilize a flyback or buck-boost converter circuit. The driver includes a driver circuit and an interface circuit. The interface circuit has a sensor sensing an input voltage from a DC supply and generating a sensor signal to a driver selector. The driver selector compares the sensor signal to a comparison voltage to determine the type of converter circuit and then transmits a selector signal to a driver circuit where it is used to control one or more of the components of the driver circuit, such as the logic circuit which is used for driving the converter to regulate the converter output. The sensor includes a sense resistor along with a current-sense amplifier, which is adapted for connection to a high side or a low side of a power supply while still producing a substantially equivalent output voltage or sensor signal.