Abstract: A method for determining an etch profile is described. The method includes determining a masking layer profile. Loading information can be determined. The loading information indicates dependence of an etch rate for the masking layer profile on a quantity and pattern of material being etched. Flux information can be determined. The flux information indicates dependence of the etch rate on an intensity and a spread angle of radiation incident on the masking layer profile. Re-deposition information can be determined. The re-deposition information indicates dependence of the etch rate on an amount of material removed from the masking layer profile that is re-deposited back on the masking layer profile. An output etch profile for the layer of the wafer is determined based on the loading information, the flux information, and/or the re-deposition information.

Abstract: A method for determining an etch profile is described. The method includes determining a masking layer profile. Loading information can be determined. The loading information indicates dependence of an etch rate for the masking layer profile on a quantity and pattern of material being etched. Flux information can be determined. The flux information indicates dependence of the etch rate on an intensity and a spread angle of radiation incident on the masking layer profile. Re-deposition information can be determined. The re-deposition information indicates dependence of the etch rate on an amount of material removed from the masking layer profile that is re-deposited back on the masking layer profile. An output etch profile for the layer of the wafer is determined based on the loading information, the flux information, and/or the re-deposition information.

Abstract: A method for determining an etch profile is described. The method includes determining a masking layer profile. Loading information can be determined. The loading information indicates dependence of an etch rate for the masking layer profile on a quantity and pattern of material being etched. Flux information can be determined. The flux information indicates dependence of the etch rate on an intensity and a spread angle of radiation incident on the masking layer profile. Re-deposition information can be determined. The re-deposition information indicates dependence of the etch rate on an amount of material removed from the masking layer profile that is re-deposited back on the masking layer profile. An output etch profile for the layer of the wafer is determined based on the loading information, the flux information, and/or the re-deposition information.

Abstract: An apparatus with either a graphene sheet or an epsilon-near-zero layer sandwiched in a waveguide structure and a tuning device. The tuning device is configured to selectively control application of at least first and second gate voltages across the waveguide structure. The graphene sheet has a first dielectric constant which is zero and the waveguide structure operates at a first absorption state and a first propagation distance with application of the first voltage by the tuning device and has a second dielectric constant and the waveguide structure operates at a second absorption state and a second propagation distance with application of the second voltage. The second dielectric constant is larger than the first dielectric constant, the second absorption state is smaller than the first absorption state, the second propagation distance is longer than the first propagation distance, and the second voltage which is zero or smaller than the first voltage.

Abstract: An apparatus with either a graphene sheet or an epsilon-near-zero layer sandwiched in a waveguide structure and a tuning device. The tuning device is configured to selectively control application of at least first and second gate voltages across the waveguide structure. The graphene sheet has a first dielectric constant which is zero and the waveguide structure operates at a first abosrpotion state and a first propagation distance with application of the first voltage by the tuning device and has a second dielectric constant and the waveguide structure operates at a second absorption state and a second propagation distance with application of the second voltage. The second dielectric constant is larger than the first dielectric constant, the second absorption state is smaller than the first absorption state, the second propagation distance is longer than the first propagation distance, and the second voltage which is zero or smaller than the first voltage.