Abstract: A method of orienting wafers in an apparatus having a wafer receiving-workpiece holder such as an electro-static chuck for processing of the wafers and eliminating etch debris build-up at the wafer orienting notch. The method comprises the steps of first providing a plurality of wafers, each wafer having an orientation mark thereon and then securing a first wafer in the chuck with the first wafer orientation mark in a first position with respect to the chuck. Thereafter, the first wafer is removed from the chuck after desired processing of the first wafer. A subsequent wafer is secured in the chuck with the subsequent wafer orientation mark in a second position with respect to the chuck different than the first position.