Abstract: It is an object of the invention to suck the central position of an electronic part precisely, and enhance the successful suction rate of electronic parts. To achieve the object, the central position of the suction opening 14 provided in the nozzle tip end 13 for sucking an electronic part is deviated from the central position of rotation of the nozzle tip end 13 by a specified amount, and the rotation amount of the nozzle tip end 13 and the positioning position of the part supply portion are controlled.

Abstract: An electronic component mounting apparatus includes a plurality of pickup nozzles (1) which are attached to the periphery of a rotary table, that intermittently rotates. The apparatus also includes a cylindrical cam (105) having a cam groove (106, 107a, 107b) which allows the pickup nozzles (1) to move up and down. A first roller (5) is attached to a first slide portion (4a), which is equipped with the pickup nozzles 1. The first roller runs within the cam grooves (106, 107a, 107b) to make the pickup nozzles 1 move up and down. A second roller (6) is attached to a second slide portion 4b, which is attached to the pickup nozzles (1). The second roller runs within the cam grooves (106, 107a, 107b) to make the pickup nozzles move up and down together with the first roller. Also, springs (9) are provided for biasing the first and second rollers (5, 6) into contact with the two side surfaces, respectively, of the cam grooves (106, 107a, 107b).

Abstract: By lightening the impact load to an electronic component and greatly promoting the load range, the adaptability to the electronic components is enhanced and the manned manual operation is eliminated, thereby improving the productivity and realizing unmanned operation. The vacuum-clamping nozzle unit comprises an automatically detachable vacuum-clamping nozzle (2) for vacuum-clamping the electronic component, a positioning section (3) for positioning the vacuum-clamping nozzle (2) in a rotating direction and a vertical direction, a pushing section (4) for urging said vacuum-clamping nozzle (2) downward by using fluid, a fluid pressure switching section for switching the urging force, a timing switching section for switching the timing of the urging force of said vacuum-clamping nozzle, and a pressure control section for controlling the load to a desired load. Switching the timing of the urging force can be made before or at the time of mounting the electronic component on an electronic circuit board.

Abstract: An electronic component feeder is provided for feeding electronic components in their stable position into an electronic component mounting apparatus and allowing the taking up of a top tape with high stability thus increasing the speed of component mounting action. As the top tape (4) is being taken up on a reel (42), a shutter (34) moves backward together with a slit (51) provided integral on the shutter (34). The turning in the tape take-up direction of the reel (42) is driven by the restoring force of a return spring (39). When the reel (42) has completed its take-up motion, the electronic component (1) can be picked up at a component pick-up location with the shutter (34) staying backward. A stationary roller (31) is provided between the slit (51) and the reel (42) and a movable roller (32) is provided for keeping the length of the top tape (4) between the slit (51) and the stationary roller (31) substantially constant.

Abstract: A component mounting apparatus for automatically mounting components on a circuit board includes a mounting unit for picking up a component from a component pickup location and mounting it at a mounting location. The mounting table can be driven to the pickup location and can removably secure a cassette table that can support a plurality of components that are to be mounted on the circuit board. A cassette table can be removable clamped to the mounting table. A carrier cart can transport the cassette table to a position for attachment to the mounting table. The carrier cart can be appropriately aligned and secured relative to the mounting table to enable the cassette table to be removably attached to the mounting table.

Abstract: A method for supporting a printed board. Includes a first step of conveying to a specified position by a conveying a printed board having a first reference hole and a second reference hole device a for setting a position and posture thereof. A second step stops the conveyed printed board at the specified position with a stop member. A third step inserts a first reference pin provided at the specified position into the first reference hole of the stopped printed board. A fourth step inserts a second reference pin into the second reference hole of the printed board. The second reference pin is movable in parallel to a mounting surface of the printed board and in any arbitrary direction relative to the first reference pin. A fifth step pinches the printed board to hold the position and posture thereof of a holding device with the first reference pin and the second reference pin both inserted.

Abstract: A component mounting apparatus and method for mounting components on to-be-mounted positions of works, includes a carrying device for continuously and successively carrying the works in a working area, and a first component-mounting device for picking up one component from component supply units in a first component supply section and mounting the picked-up component on the to-be-mounted position of one of the works being continuously and successively carried in the work area.

Abstract: A component-mounting apparatus includes a component supply mechanism for supplying components to be mounted on a circuit board, a circuit board positioning device for placing in position the circuit board on which the components are to be mounted, and a mounting head for taking out one of the components at a predetermined component take-out position of the component supply mechanism, thus mounting the component on the circuit board.

Abstract: A method for mounting components, includes a first step for feeding to a component feed unit a plurality of stacked-in-stages trays on which components are accommodated, a second step for taking out the components of a Top-stage tray sequentially one by one to mount them onto a board, and a third step for, when the components on the tray are exhausted, removing the empty top-stage tray, and then returning to the second step. An apparatus for mounting Components includes a component feed unit for feeding a plurality of stacked-in-stages trays on which components are accommodated, and a pickup device which can selectively hold either a component pickup nozzle or a tray transfer nozzle. The pickup device is movable between the component feed unit and a specified position of a substrate or between the component feed unit and a tray removal box. A nozzle replacement unit is provided for performing replacement of the pickup nozzle and the tray Transfer nozzle.

Abstract: A mounting apparatus for mounting electronic components, includes a component feeding section wherein plural component feeding units accommodating plural components and sequentially supplying components to a predetermined component take-out position are arranged on a moving table along a moving direction, a positioning mechanism of a mounting member to which one component is to be mounted, and a mounting device for holding one component at a predetermined position in the feeding section and mounting the component onto the mounting member. The mounting device includes a movable member which is vertically movable and has a gas groove which is formed at an inside part of the movable member, and a rotary member which is rotatable around a vertical axis of the movable member and has at its inside part a gas groove which is formed at an inside part of the rotary member and is communicated with the groove of the movable member so as to transmit gas between the grooves during operation.

Abstract: An electronic component installing apparatus includes a transporting unit for transporting an electronic circuit board to the apparatus at a predetermined position thereof and transporting the electronic circuit board therefrom, a head, having a suction nozzle, for drawing thereto an electronic component placed on an electronic component supply unit and installing the electronic component on the electronic circuit board, a device for placing the head at a given position along an X-axis and a Y-axis, and an optical signal transmitting/receiving device. The optical signal transmitting/receiving device includes first and second optical signal transmitting/receiving units for transmitting/receiving optical signals between the first and second units so as to control operation of the apparatus. The first unit is disposed at the head, and the second unit is disposed at a fixed section of the device.

Abstract: A component placement machine for mounting, on a substrate placed in position by an XY-table, a first electronic component supplied from an electronic component-supply section, includes an electronic component-holding portion for holding the first electronic component and being vertically movable; and a device for setting a movement-prohibiting time period of the XY-table by calculating a period of time in which there is a possibility that the first electronic component and a second electronic component mounted on the substrate may interfere with each other, based on a height of the first electronic component and a maximum height of the second electronic component.

Abstract: An electronic component mounting apparatus includes a table for feeding in and out a printed circuit board and holding the board thereon, a supply section for supplying an electronic component, a head portion for suctioning the component thereto and mounting the component on the board, an XY-robot for placing the head portion at an arbitrary position, a suction device for suctioning the component thereto, arranged at the head portion and vertically moving with respect to the head portion, and having a function of placing the component in a rotational direction thereof, a recognizing camera for recognizing the component and measuring an error amount of a position of the component before and after correction of the position of the component, and a controller for controlling the head portion, the XY-robot, and the camera.

Abstract: A component mounting apparatus which comprises at least first and second component supply assemblies mounted on respective movable tables that are mounted on a common track for movement therealong. The apparatus also comprises at least one positioning device for positioning a printed circuit board on which components are desired to be mounted; at least one component mounting unit for receiving a component at a predetermined position of the component supply assembly and mounting the component onto the support member; and a table moving mechanism which is selectively connectable with one of the first and second movable tables for driving the movable table along the common track.

Abstract: A mounting head exchange apparatus for a part mounting machine includes a moving unit as a part mounting portion for mounting parts onto a circuit board and the like, head holding portions, and a plurality of mounting heads provided at the head holding portions. Each of the mounting heads has a suction nozzle for attracting parts, and sets of position regulating claws for effecting positioning of the attracted parts. The mounting heads provided at the holding portions are so arranged that a predetermined mounting head is selected from them and detachably mounted to the moving unit. Thus, the mounting heads each provided with the position regulating claws and the suction nozzle may be exchanged as one unit.