Patents by Inventor Wataru Oikawa

Wataru Oikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240112927
    Abstract: In one embodiment, an etching method includes (a) preparing a substrate having a first region including a first material that contains silicon, and a second region including a second material different from the first material, and (b) etching the first region by plasma generated from a processing gas containing a carbon- and fluorine-containing gas, a nitrogen-containing gas, and a metal halide gas. In (b), a flow rate of the metal halide gas is lower than a flow rate of the carbon- and fluorine-containing gas and a flow rate of the nitrogen-containing gas.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 4, 2024
    Applicant: Tokyo Electron Limited
    Inventors: Fumiya TAKATA, Wataru TOGASHI, Kota OIKAWA
  • Patent number: 7648117
    Abstract: A cavity is formed between stationary and movable mold members, and a runner is connected to a gate to the mold cavity to supply a molten resin material thereto. The stationary and movable mold members have bodies of an aluminum alloy of high heat conductivity and light weight. Iron base plating is applied at least to transfer wall surfaces of the cavity, leaving and exposing other wall surfaces in a non-plated state.
    Type: Grant
    Filed: December 12, 2007
    Date of Patent: January 19, 2010
    Assignee: Nippon Platec Co., Ltd.
    Inventors: Wataru Oikawa, Tsuyoshi Namioka
  • Patent number: 7402231
    Abstract: For partially plating work surfaces, a tubular shield member is set around a work which is connected to a cathode, in face to face and in predetermined small gap relation with a non-plating surface or surfaces of a work. In a plating bath, an anode is located on the outer side of the shield member to cover the non-plating surface from the anode. Upon conducting current between the anode and cathode, a metallic coating is deposited specifically and selectively on a work surface or surfaces which are not covered by the shield member.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: July 22, 2008
    Assignee: Nippon Platec Co., Ltd.
    Inventors: Wataru Oikawa, Akira Takumi, Tomonori Zenbayashi
  • Publication number: 20080145472
    Abstract: A cavity is formed between stationary and movable mold members, and a runner is connected to a gate to the mold cavity to supply a molten resin material thereto. The stationary and movable mold members have bodies of an aluminum alloy of high heat conductivity and light weight. Iron base plating is applied at least to transfer wall surfaces of the cavity, leaving and exposing other wall surfaces in a non-plated state.
    Type: Application
    Filed: December 12, 2007
    Publication date: June 19, 2008
    Applicant: Nippon Platec Co., Ltd.
    Inventors: Wataru OIKAWA, Tsuyoshi Namioka
  • Publication number: 20050218121
    Abstract: The resistance welding method of different kinds of materials is the method for welding an iron material and an aluminum alloy material, and comprises the steps of: performing in advance a coating treatment at least to a portion of the aluminum alloy material, where resistance welding is performed, with any of iron and iron-base alloy and forming a surface layer; and performing resistance welding of the iron material and the aluminum alloy material through the surface layer, and the resistance welding may be any of spot welding and projection welding.
    Type: Application
    Filed: March 24, 2005
    Publication date: October 6, 2005
    Inventors: Noboru Hayashi, Hitoshi Kazama, Wataru Oikawa
  • Publication number: 20050056541
    Abstract: For partially plating work surfaces, a tubular shield member is set around a work which is connected to a cathode, in face to face and in predetermined small gap relation with a non-plating surface or surfaces of a work. In a plating bath, an anode is located on the outer side of the shield member to cover the non-plating surface from the anode. Upon conducting current between the anode and cathode, a metallic coating is deposited specifically and selectively on a work surface or surfaces which are not covered by the shield member.
    Type: Application
    Filed: September 8, 2004
    Publication date: March 17, 2005
    Inventors: Wataru Oikawa, Akira Takumi, Tomonori Zenbayashi
  • Patent number: 6149790
    Abstract: A method for making an aluminium material which is electroplated on its aluminum or aluminium alloy base with iron or an iron alloy containing 2-20 weight % of chromium, and which can be utilized as a new structural or functional material in various industrial fields. The material is characterized in having an inter-diffusion layer produced between the base and the plating and/or having such fine cracks produced in the plating which can reserve well machine oil, work well for painting it, and be impregnated with a resin for improving its wear resistance and so on.
    Type: Grant
    Filed: June 12, 1998
    Date of Patent: November 21, 2000
    Assignee: Nippon Platec, K.K.
    Inventors: Wataru Oikawa, Eiichi Takeuchi